초록 ▼

Apparatus for supporting a plurality of wafer-like substrates so as to be treatable in a plasma environment. At least three plate-like electrically conductive electrodes are provided. They are parallel to and spaced from one another along an axis. A support adjacent to each electrode supports a wafe

Apparatus for supporting a plurality of wafer-like substrates so as to be treatable in a plasma environment. At least three plate-like electrically conductive electrodes are provided. They are parallel to and spaced from one another along an axis. A support adjacent to each electrode supports a wafer-like substrate against at least one of the faces of at least one electrode of a pair of adjacent electrodes. A first conductive bus is conductively connected to a first set of alternate ones of the electrodes, and a second conductive bus is also provided. An individual capacitative coupling is respective to each member of a second set of the electrodes and is connected to the second bus so that each pair of adjacent electrodes and the respective capacitative coupling are in series connection, and all of the pairs of electrodes are in parallel connection.

대표청구항 ▼

Apparatus for supporting a plurality of wafer-like substrates so as to be treatable in a plasma environment, comprising: at least three plate-like electrically conductive electrodes each having a face parallel to and spaced from one another along an axis; support means adjacent to each of said elect

Apparatus for supporting a plurality of wafer-like substrates so as to be treatable in a plasma environment, comprising: at least three plate-like electrically conductive electrodes each having a face parallel to and spaced from one another along an axis; support means adjacent to each of said electrodes for supporting a wafer-like substrate against at least one of said faces between each pair of adjacent electrodes; a first conductive bus conductively connected to a first set of alternate ones of said electrodes; a second conductive bus; and an individual capacitative coupling respective to each member of a second set of said electrodes, said second set of electrodes comprising the electrodes located between the electrodes of said first set, each said capacitative coupling being connected to its respective electrode and to said second bus but not directly to any other capacitative coupling, whereby in a circuit including said first and second buses, each pair of adjacent electrodes and the respective capacitative coupling are in series relationship, and the respective members of said pairs are in parallel connection with one another.