초록 ▼

Several methods are disclosed for forming an air gap between crossing thin film conductors utilized to interconnect electronic components on a substrate. Each of the methods involves the use of photolithographic techniques to form overpassing conductors on a support material covering the overpassed

Several methods are disclosed for forming an air gap between crossing thin film conductors utilized to interconnect electronic components on a substrate. Each of the methods involves the use of photolithographic techniques to form overpassing conductors on a support material covering the overpassed conductors, followed by removal of the support material. Both deposition and plating techniques are described for forming the overpassing conductors.

대표청구항 ▼

A method of forming a conductive bridge connecting selected ones of a plurality of thin film conductors located on a substrate comprising: A. applying a layer of photosensitive material to the conductors and the substrate, said layer being of a thickness equal to the desired height of the bridges; B

A method of forming a conductive bridge connecting selected ones of a plurality of thin film conductors located on a substrate comprising: A. applying a layer of photosensitive material to the conductors and the substrate, said layer being of a thickness equal to the desired height of the bridges; B. selectively exposing and developing the photosensitive material to effect uncovering of a contact region of each of the selected conductors with which the bridge is to come in contact; C. depositing a layer of conductive material onto the photosensitive material and the contact regions, said layer being of sufficient thickness to form an electroplating electrode; D. applying a layer of photosensitive material onto the layer of conductive material, said layer being of sufficient thickness to prevent electroplating therethrough; E. selectively exposing and developing the last applied layer of photosensitive material to effect uncovering of the conductive material spanning the contact regions; F. utilizing the conductive material as an electrode and electroplating the uncovered surface areas thereof to the desired bridge thickness to form the bridge; and G. removing the remaining photosensitive material and the unplated conductive material.