$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/03
출원번호 US-0875703 (1978-02-06)
발명자 / 주소
  • Kumar Ananda H. (Wappingers Falls NY) McMillan Peter W. (Leamington Spa NY GB2) Tummala Rao R. (Wappingers Falls NY)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 52  인용 특허 : 1

초록

Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points

대표청구항

A glass ceramic article with the internal mass thereof comprising: a homogenous distribution of a microstructure of a pervasive continuous connected network of 2 to 5 mb1 to 2 m1 to 2 m

이 특허에 인용된 특허 (1)

  1. Reade ; Richard F., Beta-spodumene glass-ceramics exhibiting excellent dimensional stability.

이 특허를 인용한 특허 (52)

  1. Takeuchi Yukihisa (Nagoya JPX) Masumori Hideo (Anjyo JPX), Ceramic composition for dielectrics.
  2. Fasano Benjamin V. ; Indyk Richard F. ; Kamath Sundar M. ; Knickerbocker John U. ; Langenthal Scott I. ; O'Connor Daniel P. ; Reddy Srinivasa S. N., Ceramic substrate having a sealed layer.
  3. Nakatani Seiichi (Hirakata JPX) Nishimura Tsutomu (Uji JPX) Yuhaku Satoru (Osaka JPX) Itagaki Minehiro (Moriguchi JPX), Conductor composition and method of manufacturing a multilayered ceramic body using the composition.
  4. Aoude Farid Youssif ; David Lawrence Daniel ; Divakaruni Renuka Shastri ; Farooq Shaji ; Herron Lester Wynn ; Lasky Hal Mitchell ; Mastreani Anthony ; Natarajan Govindarajan ; Reddy Srinivasa S. N. ;, Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias.
  5. Aoude Farid Youssif ; David Lawrence Daniel ; Divakaruni Renuka Shastri ; Farooq Shaji ; Herron Lester Wynn ; Lasky Hal Mitchell ; Mastreani Anthony ; Natarajan Govindarajan ; Reddy Srinivasa S. N. ;, Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias.
  6. Farid Youssif Aoude ; Lawrence Daniel David ; Renuka Shastri Divakaruni ; Shaji Farooq ; Lester Wynn Herron ; Hal Mitchell Lasky ; Anthony Mastreani ; Govindarajan Natarajan ; Srinivasa S. N., Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias.
  7. Kawakami Hiromichi,JPX ; Sunahara Hirofumi,JPX ; Tanaka Toshiki,JPX ; Watanabe Shizuharu,JPX ; Takagi Hiroshi,JPX, Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit board.
  8. Steinberg Jerry I. (Wilmington DE), Dielectric composition.
  9. Rellick Joseph R. (Wilmington DE), Dielectric compositions and method of forming a multilayer interconnection using same.
  10. Spinelli Thomas S. (Attleboro MA) Manns William G. (Dallas TX) Weirauch Donald F. (Dallas TX), Electronic circuit interconnection system.
  11. Spinelli, Thomas S.; Manns, William G.; Weirauch, Donald F., Electronic circuit interconnection system.
  12. Spinelli, Thomas S.; Manns, William G.; Weirauch, Donald F., Electronic circuit interconnection system.
  13. Herron Lester W. (Hopewell Junction NY) Knickerbocker Sarah H. (Hopewell Junction NY) Kumar Ananda Hosakere (Hopewell Junction NY) Natarajan Govindarajan (Fishkill NY) Reddy Srinivasa S. N. (LaGrange, Enhanced removal of carbon from ceramic substrate laminates.
  14. Curtin Christopher J. (Cupertino CA) Schmid Anthony P. (Solana Beach CA) Lovoi Paul A. (Saratoga CA), Flat panel device with ceramic backplate.
  15. Beall, George Halsey; Borrelli, Nicholas Francis; Smith, Charlene Marie; Tietje, Steven Alvin, Fusion formed and ion exchanged glass-ceramics.
  16. Beall, George Halsey; Borrelli, Nicholas Francis; Smith, Charlene Marie; Tietje, Steven Alvin, Fusion formed and ion exchanged glass-ceramics.
  17. Tosaki, Hiromi; Tanei, Hirayoshi; Ikegami, Akira; Sugishita, Nobuyuki, Glass multilayer wiring board and method for its manufacture.
  18. Rita,Robert A., Glass-ceramic materials and electronic packages including same.
  19. Sammet Manfred (Calw-Stammheim DEX), Glass-ceramic structure and method for making same.
  20. Norihiro Ami JP; Masahide Okamoto JP; Shosaku Ishihara JP; Minoru Tanaka JP; Mutsumi Horikoshi JP; Akihiro Yasuda JP, Glass-ceramic wiring board.
  21. Pryor Michael J. (Woodbridge CT) Singhdeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT), Hermetically sealed package.
  22. Pryor Michael J. (Woodbridge CT), Hybrid and multi-layer circuitry.
  23. Pryor Michael J. (Woodbridge CT) Leedecke Charles J. (Northford CT) Masse Norman G. (Wallingford CT), Hybrid and multi-layer circuitry.
  24. Ravi, Tirunelveli S.; Kumar, Ananda H.; Asthana, Ashish, Integrated method and system for manufacturing monolithic panels of crystalline solar cells.
  25. Ravi, Tirunelveli S.; Kumar, Ananda H.; Asthana, Ashish; Tantiwong, Kyle Ross; Sivaramakrishnan, Visweswaren, Integrated method and system for manufacturing monolithic panels of crystalline solar cells.
  26. Perry Charles H. (Poughkeepsie NY) Bauer Tibor L. (Hopewell Junction NY) Long David C. (Wappingers Falls NY) Pickering Bruce C. (Wappingers Falls NY) Vittori Pierre C. (Cold Spring NY), Interface card for a probe card assembly.
  27. Rita,Robert A., Low loss glass-ceramic materials, method of making same and electronic packages including same.
  28. Tummala Rao R. (Hopewell Jct. NY) Master Raj N. (Wappingers Falls NY), Material and process set for fabrication of molecular matrix print head.
  29. Dupon Ryan W. (San Carlos CA) Thompson Mark S. (San Carlos CA) Wiseman Gary H. (San Francisco CA) Musolf Douglas J. (Mountain View CA) Tanous Adam C. (Woodside CA), Metal oxide dielectric dense bodies, precursor powders therefor, and methods for preparing same.
  30. Kondo Kazuo (Nagoya JPX) Morikawa Asao (Komaki JPX), Metallizing paste for circuit board having low thermal expansion coefficient.
  31. Fasano Benjamin V. ; Goldmann Lewis S. ; Indyk Richard F. ; Kamath Sundar M. ; Langenthal Scott I. ; Reddy Srinivasa S., Method and materials for increasing the strength of crystalline ceramic.
  32. Pliskin William A. (Poughkeepsie NY) Riseman Jacob (Poughkeepsie NY) Shepard Joseph F. (Hopewell Junction NY), Method for forming recessed isolated regions.
  33. Pryor Michael J. (Woodbridge CT), Method for making multi-layer and pin grid arrays.
  34. Magdo Ingrid E. (Hopewell Junction NY) Ormond ; Jr. Douglas W. (Wappingers Falls NY), Method for producing a plurality of layers of metallurgy.
  35. Churchwell Robert W. (Highland NY) Flaitz Philip L. (Hopewell Junction NY) Humenik James N. (LaGrangeville NY), Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate.
  36. Singhdeo Narendra N. (New Haven CT) Pryor Michael J. (Woodbridge CT) Leedecke Charles J. (Northford CT) Masse Norman G. (Wallingford CT), Method of manufacturing glass capacitors and resulting product.
  37. Ami, Norihiro; Okamoto, Masahide; Ishihara, Shosaku; Tanaka, Minoru; Horikoshi, Mutsumi; Yasuda, Akihiro, Method of manufacturing via interconnection of glass-ceramic wiring board.
  38. Gottmann, Matthias; Couse, Stephen, Methods and devices for printing seals for fuel cell stacks.
  39. Dohya Akihiro (El Cerrito CA), Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the sam.
  40. Shinohara Hiroichi (Hitachi JPX) Ushifusa Nobuyuki (Hitachi JPX) Nagayama Kousei (Toukai JPX) Ogihara Satoru (Hitachi JPX), Multilayer ceramic circuit board.
  41. Jiang Hunt Hang ; Massingill Thomas ; McCormack Mark Thomas ; Lee Michael Guang-Tzong, Multilayer laminated substrates with high density interconnects and methods of making the same.
  42. Ushifusa Nobuyuki (Hitachi JPX) Ogihara Satoru (Hitachi JPX) Noro Takanobu (Yokohama JPX), Multilayered ceramic circuit board.
  43. Herron Lester W. (Hopewell Junction NY) Lussow Robert O. (Hopewell Junction NY) Nufer Robert W. (Hopewell Junction NY) Schwartz Bernard (Poughkeepsie NY) Acocella John (Hopewell Junction NY) Reddy Sr, Multilayered ceramic substrate having solid non-porous metal conductors.
  44. Ohyama Sadahiro (Chigasaki JPX) Kato Hiroshi (Machida JPX) Yaguchi Sadao (Yokohama JPX) Baba Mikito (Yokohama JPX) Okada Morikazu (Atsugi JPX), Printed circuit device.
  45. Warmerdam, Jerry; Cochran, Joseph R.; Guenther, Ross; Wood, James L.; Villwock, Robert D., Process for hot-forging synthetic ceramic.
  46. Tosaki Hiromi (Yokohama JPX) Sugishita Nobuyuki (Yokosuka JPX) Ikegami Akira (Yokohama JPX), Process for manufacturing a multilayer circuit board.
  47. Dubuisson Jacques (Paris FRX), Process for the manufacture of an interconnecting substrate for electronic components.
  48. Kumar, Ananda H.; Nguyen, Dien; Janousek, Martin; Armstrong, Tad, Seal compositions, methods, and structures for planar solid oxide fuel cells.
  49. Kumar, Ananda H.; Nguyen, Dien; Janousek, Martin; Armstrong, Tad, Seal compositions, methods, and structures for planar solid oxide fuel cells.
  50. Kumar, Ananda H.; Nguyen, Dien; Janousek, Martin; Armstrong, Tad, Seal compositions, methods, and structures for planar solid oxide fuel cells.
  51. Fischer David J. (Arden Hills MN), Subcutaneous housing assembly.
  52. Kumar, Ananda H.; Ravi, Tirunelveli S.; Gopal, Vidyut, Thin film solar cell with ceramic handling layer.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로