초록 ▼

A system for superplastic forming and diffusion bonding of a metal workpiece sandwich between an upper and lower die to form a structural shape wherein a hollow stainless steel pin is in sealed relationship with a hole in the surface of one metal layer and communicates with the interior of the sandw

A system for superplastic forming and diffusion bonding of a metal workpiece sandwich between an upper and lower die to form a structural shape wherein a hollow stainless steel pin is in sealed relationship with a hole in the surface of one metal layer and communicates with the interior of the sandwich. The hollow pin extends into a recess in one of the dies and is in sealing relationship with the recess.

대표청구항 ▼

A method for superplastically forming and diffusion bonding a metal workpiece sandwich having at least first and second layers between an upper die and a lower die comprising: (a) placing an end portion of a hollow pin into a hole in one of the metal workpiece layers so that the hollow pin and said

A method for superplastically forming and diffusion bonding a metal workpiece sandwich having at least first and second layers between an upper die and a lower die comprising: (a) placing an end portion of a hollow pin into a hole in one of the metal workpiece layers so that the hollow pin and said layer are in sealed relationship; (b) selectively coating the metal layers with stop-off; (c) placing the metal layers in face-to-face engagement; (d) joining the first and second layers together at their edges to form a sandwich assembly; (e) placing the sandwich assembly between an upper die and a lower die so that the hollow pin is in a recess in one of said dies and in sealed relationship with said die; (f) subjecting the sandwich assembly to pressure and heat so as to cause diffusion bonding of selected areas of the first and second metal layers; and (g) passing inert gas under pressure through said hollow pin and to the interior of the sandwich assembly so as to cause superplastic forming of selected areas of said first and second layers to thereby form a honeycomb-like structural unit. A device for forming a honeycomb-like structure from a metal sandwich having at least first and second metal layers by superplastic forming and diffusion bonding, comprising: (a) an upper die and a lower die adapted to be brought together under pressure; (b) a hollow stainless steel pin having one end in sealed relationship with one of the metal layers, and extending from the surface of said one metal layer; (c) a recess in one of said dies; (d) means maintaining said hollow pin in said recess in sealed relationship with said die; and (e) passageway means in said one die for directing gas under pressure through said hollow pin to the interior of the metal sandwich to cause superplastic deformation of at least one of said layers.