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Wafer transfer system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-015/00
출원번호 US-0106342 (1979-12-21)
발명자 / 주소
  • Coad George L. (Lafayette CA) Shaw R. Howard (Palo Alto CA) Hutchinson Martin A. (Santa Clara CA)
출원인 / 주소
  • Varian Associates, Inc. (Palo Alto CA 02)
인용정보 피인용 횟수 : 127  인용 특허 : 0

초록

A system for the automated handling and transfer of wafers individually and repetitively to and between processing stations and cassettes. A track-like conveyor engages a cassette holding a plurality of wafers in vertically facing alignment, to move same horizontally past a loading station of a proc

대표청구항

Wafer load lock and feed system for vacuum chamber having an entrance opening in a wall thereof, and a door for sealing said opening, comprising: a plate-like wafer support within said chamber immediately behind said opening, and provided with an aperture alignable with said opening and of a diamete

이 특허를 인용한 특허 (127)

  1. Lee, Yi-Lung, Ancillary apparatus and method for loading glass substrates into a bracket.
  2. Allison Quincy D. (Boulder Creek CA), Apparatus and method of aligning notches using a free-floating rod.
  3. Scales Martin N. ; Pechin David A. ; Benzing Jeffrey C. ; Stowell R. Marshall, Apparatus for aligning substrate to chuck in processing chamber.
  4. Mears Eric L. (Rockport MA) Hertel Richard J. (Boxford MA) Brick Robert V. (Gloucester MA) Holt ; Jr. Carl J. (Newburyport MA), Apparatus for retaining wafers.
  5. Mears Eric L. (Rockport MA) Hertel Richard J. (Bradford MA) Brick Robert V. (Gloucester MA), Apparatus for retaining wafers.
  6. Kawakami Hiroshi (Kanagawa JPX), Autochanger type disc player.
  7. Doherty, Brian J.; Mariano, Thomas R.; Sullivan, Robert P., Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists.
  8. Doherty, Brian J.; Mariano, Thomas R.; Sullivan, Robert P., Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists.
  9. Doherty, Brian J.; Mariano, Thomas R.; Sullivan, Robert P., Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists.
  10. Doherty, Brian J.; Mariano, Thomas R.; Sullivan, Robert P., Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists.
  11. Doherty,Brian J.; Mariano,Thomas R.; Sullivan,Robert P., Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists.
  12. O'Dell, Jeffrey L.; Verburgt, Thomas; Harless, Mark; Watkins, Cory, Automated wafer defect inspection system and a process of performing such inspection.
  13. O'Dell, Jeffrey L.; Verburgt, Thomas; Harless, Mark; Watkins, Cory, Automated wafer defect inspection system and a process of performing such inspection.
  14. O'Dell, Jeffrey; Verburgt, Thomas; Harless, Mark; Watkins, Cory, Automated wafer defect inspection system and a process of performing such inspection.
  15. Uehara, Akira; Hijikata, Isamu; Nakane, Hisashi; Nakayama, Muneo, Automatic plasma processing device and heat treatment device.
  16. Cay Norman S. (Los Gatos CA) Bowers Gerald M. (Boonville CA), Automatic wafer loading method and apparatus.
  17. Muka Richard S. (Topsfield MA) Russo Carl J. (Ipswitch MA), Blackbody radiation source with constant planar energy flux.
  18. Kerschner Ronald K. (Loveland CO) Hayes James M. (Loveland CO) Bullock Michael L. (Loveland CO), Board fixturing system.
  19. Wytman Joe, Co-axial motorized wafer lift.
  20. Guidotti Daniel ; Lee Kam Leung, Continual flow rapid thermal processing apparatus and method.
  21. Tateishi Hideki (Yokohama JPX) Shimizu Tamotsu (Yokohama JPX) Aiuchi Susumu (Yokohama JPX) Iwashita Katsuhiro (Yokohama JPX) Nakamura Hiroshi (Fuchu JPX), Continuous sputtering apparatus.
  22. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Conveying system for a vacuum processing apparatus.
  23. Hoitz Gerd,DEX ; Kowatsch Ulrich,DEX ; Ueffinger Friedrich,DEX, Device for simplified vertical loading of an X-ray cassette into a transport receptacle of a processing apparatus for X-ray cassettes.
  24. Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA), Dial deposition and processing apparatus.
  25. Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA), Disk or wafer handling and coating system.
  26. Ryan John F. (San Diego CA) Wright John G. (Poway CA), Elevating jig for semi-conductor wafers and similar articles.
  27. Fosnight,William John; Bufano,Michael; Friedman,Gerald; Sullivan,Robert, Extractor/buffer.
  28. Rastegar, Abbas; Ma, Andy; Krick, Dave; Marmillion, Pat, Hot source cleaning system.
  29. Bonora, Anthony C.; Gould, Richard H., Integrated transport carrier and conveyor system.
  30. Noda Minoru (31-1 Kameido 6-chrome Koto-ku ; Tokyo JPX) Miyata Tsutomu (31-1 Kameido 6-chrome Koto-ku ; Tokyo JPX) Yamashita Yoshihiro (31-1 Kameido 6-chrome Koto-ku ; Tokyo JPX) Ohmura Kenji (31-1 K, Linear transfer device for wafery works.
  31. Ackley James W. (Los Altos CA), Load lock pumping mechanism.
  32. Hayden Thomas J. (2244 Mesa Verde Dr. Milpitas CA 95035), Method and apparatus for orienting semiconductor wafers.
  33. Price, JB; Keller, Jed; Dulmage, Laurence; Cheng, David, Method and apparatus for semiconductor processing.
  34. Prabhakar Rakesh (Castro Valley CA) Benavides A. Fernando (Round Rock TX) Nitescu Petru (Fremont CA) Ebbing Peter (Los Altos CA), Method of aligning wafers and device therefor.
  35. Keigler Arthur, Method of and apparatus for handling thin and flat workpieces and the like.
  36. Bayne Christopher J. (Lightwater GB2), Methods of and apparatus for transferring articles between carrier members.
  37. Vora Mahasukh (Beverly MA) Malhotra Rajender (Beverly MA), Missing or broken wafer sensor.
  38. Hertel Richard J. (Bradford MA) Klos Leo V. (Newburyport MA), Multiple wafer holder for a wafer transfer system.
  39. Charbonnet Carl D. (4800 Divison Ave. Birmingham AL 35222), Panel transferring apparatus.
  40. Keigler, Arthur; Goodman, Daniel L.; Guarnaccia, David G., Parallel single substrate marangoni module.
  41. Keigler, Arthur; Fisher, Freeman; Goodman, Daniel L., Parallel single substrate processing system.
  42. Keigler, Arthur; Fisher, Freeman; Goodman, Daniel L.; Haynes, Jonathan, Parallel single substrate processing system.
  43. Keigler, Arthur, Parallel single substrate processing system with alignment features on a process section frame.
  44. Tsutsui Shinji (Kawasaki JPX) Shimoda Isamu (Zama JPX), Photomask positioning device.
  45. Muka Richard S. (Topsfield MA) Russo Carl J. (Ipswitch MA), Process for treating a semiconductor material by blackbody radiation source with constant planar energy flux.
  46. Rubin Richard H. (West Paterson NJ) Hillman Gary (Livingston NJ), Processing apparatus and method.
  47. Dill Charles T., Rotatable wafer handler with retractable stops.
  48. Brossman ; Jr. James W. (Bethel PA) Nemeth Carol A. (Reading PA) Shapiro Alan K. (Shillington PA), Selecting articles from an array thereof.
  49. Maydan Dan (Los Altos Hills CA) Somekh Sasson R. (Redwood City CA) Ryan-Harris Charles (La Honda CA) Seilheimer Richard A. (Pleasanton CA) Cheng David (San Jose CA) Abolnikov Edward M. (San Francisco, Semiconductor processing system with robotic autoloader and load lock.
  50. Muka Richard S. (Topsfield MA) Russo Carl J. (Ipswitch MA), Semiconductor processor incorporating blackbody radiation source with constant planar energy flux.
  51. Kakehi Yutaka (Hikari JPX), Semiconductor substrate transport system.
  52. Wilkinson Thomas F. (Garland TX) Ishii Kaoru (Garland TX), Semiconductor wafer carrier guide tracks.
  53. Butler Robert M. (Tempe AZ), Semiconductor wafer transfer apparatus and method.
  54. Graves, Jr., Walter E., Substrate and substrate holder.
  55. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in a vaccum tank.
  56. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in vacuum tank.
  57. Maher Joseph A. ; Vowles E. John ; Napoli Joseph D. ; Zafiropoulo Arthur W. ; Miller Mark W., System for processing substrates.
  58. Risca Mihai S., Thermal interface member.
  59. Yamazaki Takashi (Katsuta JPX) Sakai Hiroyuki (Ibaraki JPX) Sugano Hiroshi (Katsuta JPX) Moriyama Shigeo (Tama JPX), Transfer apparatus.
  60. Hutchinson, Martin A.; Shaw, R. Howard; Coad, George, Transfer plate rotation system.
  61. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Transferring device for a vacuum processing apparatus and operating method therefor.
  62. Foulke Richard F. (Carlisle MA) Winchell Kenneth A. (Melrose MA), Vacuum pickup apparatus.
  63. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
  64. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
  65. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method using a vacuum chamber.
  66. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method with wafers, substrates and/or semiconductors.
  67. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  68. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  69. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  70. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  71. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  72. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  73. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  74. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  75. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  76. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  77. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  78. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  79. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  80. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  81. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  82. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  83. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  84. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  85. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  86. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  87. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  88. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  89. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  90. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  91. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  92. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  93. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  94. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  95. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
  96. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
  97. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  98. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  99. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  100. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  101. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  102. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
  103. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
  104. Derbinski Senia L. ; Parker Richard Fred, Vacuum processing apparatus with low particle generating wafer clamp.
  105. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing equipment configuration.
  106. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing equipment configuration.
  107. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  108. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  109. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  110. Tamai,Tadamoto, Vacuum processing system being able to carry process object into and out of vacuum chamber.
  111. Wu, Kung Chris, Wafer aligner.
  112. Turner Frederick T. (Sunnyvale CA) Hutchinson Martin A. (Santa Clara CA) Shaw R. H. (Palo Alto CA) Lamont ; Jr. Lawrence T. (Mountain View CA), Wafer coating system.
  113. Reiss Ira, Wafer holder and clamping ring therefor for use in a deposition chamber.
  114. Flint Alan G. (Los Gatos CA) Jacobs William G. (San Jose CA), Wafer loading apparatus.
  115. Hertel Richard J. (Bradford MA), Wafer orientation system.
  116. Shimane Kazuo (Kawasaki JPX), Wafer positioning mechanism using a notch formed on the wafer periphery.
  117. Dimock Jack A. (Santa Barbara CA), Wafer processing machine.
  118. Dimock Jack A. (Santa Barbara CA) Clarke Peter J. (Santa Barbara CA), Wafer processing machine.
  119. Dimock Jack A. (Santa Barbara CA) Woestenburg Dirk P. (Summerland CA), Wafer processing machine with evacuated wafer transporting and storage system.
  120. Shaw R. Howard (Palo Alto CA), Wafer support assembly.
  121. Ohkase Wataru (Sagamihara JPX), Wafer support device.
  122. Lee Steven N. (Irvine CA) Kim Jae Y. (Irvine CA), Wafer transfer apparatus.
  123. Kato Tomoo,JPX ; Kimura Keiji,JPX, Wafer transfer device.
  124. Hertel Richard J. (Bradford MA), Wafer transfer system.
  125. Hertel Richard J. (Bradford MA) Delforge Adrian C. (Rockport MA) Mears Eric L. (Rockport MA) MacIntosh Edward D. (Gloucester MA) Jennings Robert E. (Nethuen MA) Bhargava Akhil (Reading MA), Wafer transfer system.
  126. Hertel Richard J. (Bradford MA) MacIntosh Edward D. (Gloucester MA), Wafer transfer system.
  127. Corville Richard E. (Alameda CA), Workpiece accumulating and transporting apparatus.
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