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Cooling arrangement for plug-in module assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0007524 (1979-01-29)
발명자 / 주소
  • Parmerlee James K. (Indianapolis IN) Tague B. Dale (Indianapolis IN)
출원인 / 주소
  • The United States of America as represented by the Secretary of the Navy (Washington DC 06)
인용정보 피인용 횟수 : 85  인용 특허 : 2

초록

An improved cooling arrangement for an electronic plug-in module assembly having a plurality of modules supported in grooves in a pair of parallel sides. Each parallel side is provided with fluid passageways for carrying a cooling liquid for removing heat transferred from a heat sink on each module

대표청구항

A modular electronic system comprising, a support assembly having first and second side plates each having a plurality of spaced grooves therein, a plurality of electronic modules each having a metallic frame with the ends of each said metallic frame being slidably mounted in opposed grooves in said

이 특허에 인용된 특허 (2)

  1. Chu ; Bing-Lun ; Subbarao ; Wunnava Venkata ; Peale ; Jack ; McCune ; Ke nt ; Steiner ; Marvin Elroy, D-I-P On island.
  2. Calabro Anthony D. (8738 West Chester Pike Upper Darby PA 19082), Uniformly cooled printed circuit board mounting assembly.

이 특허를 인용한 특허 (85)

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