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Apparatus for the treatment of semiconductor wafers by plasma reaction

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23F-001/02
출원번호 US-0208845 (1980-11-20)
우선권정보 JP-0163233 (1979-11-27)
발명자 / 주소
  • Hijikata Isamu (Tokyo JPX) Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX)
출원인 / 주소
  • Tokyo Ohka Kogyo Kabushiki Kaisha (Kanagawa JPX 03)
인용정보 피인용 횟수 : 88  인용 특허 : 3

초록

An apparatus for the treatment of semiconductor wafers by plasma reaction is disclosed. The apparatus comprises a first wafer carrying means for a wafer to be treated, a reaction chamber, a second wafer carrying means for a treated wafer, and a control means for driving respective elements thereof i

대표청구항

An apparatus for the treatment of semiconductor wafers by plasma reaction, which apparatus comprises a first wafer carrying means for a wafer to be treated which comprises a first conveyer for carrying the wafer to be treated, a second conveyer for carrying the wafer to be treated and disposed adjac

이 특허에 인용된 특허 (3)

  1. Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for the treatment of a wafer by plasma reaction.
  2. Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for the treatment of wafer materials by plasma reaction.
  3. Yamamoto Shinichi (Yokohama JPX) Sumitomo Yasusuke (Yokohama JPX) Horiike Yasuhiro (Tokyo JPX) Shibagaki Masahiro (Hiratsuka JPX), Etching apparatus using a plasma.

이 특허를 인용한 특허 (88)

  1. Johnson Randall E. (Carrollton TX) Spencer John E. (Plano TX), Anodized aluminum substrate for plasma etch reactor.
  2. Richards Edmond A. (Marlton NJ), Apparatus for conveying a semiconductor wafer.
  3. Davis Cecil J. (Greenville TX) Johnson Randall E. (Carrollton TX) Spencer John E. (Plano TX), Automated plasma reactor.
  4. Davis Cecil J. (Greenville TX) Spencer John E. (Plano TX) Johnson Randall E. (Carrollton TX) Jucha Rhett B. (Celeste TX) Brown Frederick W. (Tarrant TX) Kohan Stanford P. (Garland TX), Automated single slice cassette load lock plasma reactor.
  5. Davis Cecil J. (Greenville TX) Spencer John E. (Plano TX) Hockersmith Dan T. (Garland TX) Hildenbrand Randall C. (Richardson TX) Brown Frederick W. (Colleyville TX) Kohan Stanford P. (Garland TX), Automated single slice powered load lock plasma reactor.
  6. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Conveying system for a vacuum processing apparatus.
  7. Sekine Makoto (Yokohama JPX) Okano Haruo (Tokyo JPX) Arikado Tsunetoshi (Tokyo JPX) Horiike Yasuhiro (Tokyo JPX), Dry etching apparatus.
  8. Dennis L. Goodwin ; Eric R. Wood ; Ivo Raaijmakers, Dual arm linear hand-off wafer transfer assembly.
  9. Goodwin Dennis L. ; Wood Eric R. ; Raaijmakers Ivo, Dual arm linear hand-off wafer transfer assembly.
  10. Provence John D. (Mesquite TX) Brown Frederick W. (Colleyville TX) Jones John I. (Plano TX), Dual detector system for determining endpoint of plasma etch process.
  11. Hijikata Isamu (Kanagawa JPX) Uehara Akira (Kanagawa JPX) Samezawa Mitsuo (Kanagawa JPX), Electrode for use in the treatment of an object in a plasma.
  12. Hijikata Isamu (Kanagawa JPX) Uehara Akira (Kanagawa JPX) Samezawa Mitsuo (Kanagawa JPX), Electrode for use in the treatment of an object in a plasma.
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  14. Rigali Louis A. ; Hoffman David E. ; Wang Keda, High Throughput plasma treatment system.
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  17. Tyler, James Scott, High-speed symmetrical plasma treatment system.
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  24. van der Meulen, Peter, Mid-entry load lock for semiconductor handling system.
  25. Stark Lawrence R. (San Jose CA) Turner Frederick (Sunnyvale CA), Modular wafer transport and processing system.
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  27. Warenback, Douglas H.; Rathmann, Thomas M.; Mirkovich, Ninko T., Plasma reactor chuck assembly.
  28. Susko Robin A. (Owego NY) Wilson James W. (Vestal NY), Plasma reactor having segmented electrodes.
  29. Spencer John E. (Plano TX) Johnson Randall E. (Carrollton TX) Hockersmith Dan T. (Garland TX) Hildenbrand Randall C. (Richardson TX) Jones John I. (Plano TX) Jaspersen William S. (Dallas TX), Powered load lock electrode/substrate assembly including robot arm, optimized for plasma process uniformity and rate.
  30. Okano Haruo (Yokohama JPX) Horiike Yasuhiro (Tokyo JPX), RIE Apparatus utilizing a shielded magnetron to enhance etching.
  31. Gerlach Robert L. (Minnetonka MN) Seibel David D. (Lakeville MN) Miller Mark C. (Chanhassen MN), Sample transport system.
  32. van der Meulen, Peter, Semiconductor manufacturing systems.
  33. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  34. van der Meulen, Peter; Kiley, Christopher C.; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling transport.
  35. Babu Suryadevara V. (One Carol Ct. Potsdam NY 13676) Lu Neng-hsing (1206 Park Manor Blvd. Endwell NY 13760) Nilsen Carl-Otto (1800 King Street Vestal NY 13850), Side source center sink plasma reactor.
  36. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in a vaccum tank.
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  38. Maher Joseph A. ; Vowles E. John ; Napoli Joseph D. ; Zafiropoulo Arthur W. ; Miller Mark W., System for processing substrates.
  39. Sone Kazuyoshi (Kawasaki JPX) Okumura Katsuya (Kawasaki JPX) Nakajima Tomio (Tokyo JPX) Ikegaya Kanji (Tokyo JPX), Transfer machine in a surface inspection apparatus.
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  41. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
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