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Printed wiring board substrates for ceramic chip carriers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-003/00
  • B32B-009/00
  • B05D-005/12
출원번호 US-0232426 (1981-02-09)
발명자 / 주소
  • Jensen Warren M. (Kirkland WA)
출원인 / 주소
  • Boeing Aerospace Company (Seattle WA 02)
인용정보 피인용 횟수 : 41  인용 특허 : 4

초록 ▼

A composite printed wiring board is provided wherein the surface of the board is fabricated from conventional fiber reinforced plastic laminates such as glass fiber reinforced epoxy laminates and that laminate is secured by means of a thermoset adhesive to a support member which is fabricated from g

대표청구항 ▼

A composite printed wiring board laminate comprising: a support fabricated from graphite filament or aramid filament reinforced thermoset resin and having a coefficient of thermal expansion less than 2 microinch/inch/°F.; a wiring board fabricated from fiber reinforced thermoset resin and having ele

이 특허에 인용된 특허 (4)

  1. Kehrer Gerald P. (Auburn MI) Smith William G. (Saint Charles IL), Electrically conductive silicone elastomers.
    상세보기
  2. Rauch ; Sr. Harry W. (Chester PA), Fiber reinforced ceramics produced without pressing or sintering using a slurry comprising a silicate and a powdered cer.
    상세보기
  3. Crepeau Philip C. (San Diego CA), Multilayer printed circuit board.
    상세보기
  4. Klein ; Theodore Harold, Reinforced flexible printed wiring board.
    상세보기

이 특허를 인용한 특허 (41)

  1. Vasoya, Kalu K., Build-up printed wiring board substrate having a core layer that is part of a circuit.
    상세보기
  2. Vasoya, Kalu K., Build-up printed wiring board substrate having a core layer that is part of a circuit.
    상세보기
  3. Abe,Tomoyuki, Circuit board and method for fabricating the same, and electronic device.
    상세보기
  4. Yokouchi, Kishio; Yoshimura, Hideaki; Fukase, Katsuya, Circuit board and method of manufacturing the same.
    상세보기
  5. Burgess James F. (Schenectady NY), Circuit board construction.
    상세보기
  6. Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Composite heat transfer means.
    상세보기
  7. Menéndez Martin, José Manuel, Composite structure with embedded optical fiber and a process for its repair.
    상세보기
  8. Menéndez Martin, José Manuel, Composite structure with optical fiber embedded in one of its surface layers and a process for its connection and repair.
    상세보기
  9. Leibowitz Joseph D. (Culver City CA), Controlled thermal expansion composite and printed circuit board embodying same.
    상세보기
  10. Knowles, Timothy R.; Seaman, Christopher L., Dendritic fiber material.
    상세보기
  11. Knowles,Timothy R.; Seaman,Christopher L., Dendritic fiber material.
    상세보기
  12. Knowles,Timothy R.; Seaman,Christopher L., Fiber adhesive material.
    상세보기
  13. Schneider, Douglas; Davis, William E., Graphene-based thermal management cores and systems and methods for constructing printed wiring boards.
    상세보기
  14. Monnier Michel J. (Montgeron FRX), Housing for an electronic device.
    상세보기
  15. Vasoya, Kalu K.; Mangrolia, Bharat M.; Davis, William E.; Bohner, Richard A., Lightweight circuit board with conductive constraining cores.
    상세보기
  16. Vasoya, Kalu K.; Mangrolia, Bharat M.; Davis, William E.; Bohner, Richard A., Lightweight circuit board with conductive constraining cores.
    상세보기
  17. Vasoya, Kalu K.; Mangrolia, Bharat M.; Davis, William E.; Bohner, Richard A., Lightweight circuit board with conductive constraining cores.
    상세보기
  18. LeVasseur Robert D. (Binghamton NY) McKeown Stephen A. (Endicott NY), Low thermal expansion, heat sinking substrate for electronic surface mount applications.
    상세보기
  19. Zweben Carl H. (Devon PA) Mogle Rodman A. (Clinton NY) Rodini ; Jr. Benjamin T. (Wayne PA) Thaw Charles L. (Phoenixville PA), Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite.
    상세보기
  20. Bottero, Luca; Duccini, Gianni; Gregori, Massimo; Midali, Alberto, Method for making hollow stiffening elements.
    상세보기
  21. Leibowitz Joseph D. (Culver City CA), Method of fabricating multilayer printed circuit board structure.
    상세보기
  22. Leibowitz Joseph D. (Culver City CA), Method of making multilayer printed circuit board.
    상세보기
  23. Vail, III, William Banning; Skerl, Tomislav, Methods and apparatus for monitoring and fixing holes in composite aircraft.
    상세보기
  24. Vail, III, William Banning, Methods and apparatus to prevent failures of fiber-reinforced composite materials under compressive stresses caused by fluids and gases invading microfractures in the materials.
    상세보기
  25. Jester Randy Douglas ; Culbertson Edwin Charles ; Frank Detlef M.,DEX ; Rounsville Sherman Hall ; Penoyer John Arthur ; Tsugaka Takeichi,JPX ; Onodera Minoru,JPX ; Sato Toshiaki,JPX ; Sanefuji Toru,J, Monolithic LCP polymer microelectronic wiring modules.
    상세보기
  26. Sauzade Jean-Denis (Juan Les Pins FRX) L\Hote Manuel (Vence FRX), Mounting for printed circuits forming a heat sink with controlled expansion.
    상세보기
  27. Leibowitz Joseph D. (Culver City CA), Multilayer printed circuit board for ceramic chip carriers.
    상세보기
  28. Leibowitz Joseph D. (Culver City CA), Multilayer printed circuit board structure.
    상세보기
  29. Kramer Jesse J. ; Madura Jeffrey R. ; Smith Carl Richard, Printed wiring board structure having continuous graphite fibers.
    상세보기
  30. Carl R. Smith ; Jeffrey R. Madura ; Jesse J. Kramer, Printed wiring board structure with integral metal matrix composite core.
    상세보기
  31. Buchanan Alan M. (Midvale UT) Abramowitz Jay S. (Salt Lake City UT) Flygare Roberta A. Y. (Salt Lake City UT), Printed wiring board substrate for surface mounted components.
    상세보기
  32. Jandzio,Gregory M.; Pedersen,Anders P.; Rief,Gary A.; Whybrew,Walter M., Printed wiring board with enhanced structural integrity.
    상세보기
  33. Jandzio,Gregory M.; Pedersen,Anders P.; Rief,Gary A.; Whybrew,Walter M., Printed wiring board with enhanced structural integrity.
    상세보기
  34. Mohammed Juzer (Naperville IL), Printed wiring board with zones of controlled thermal coefficient of expansion.
    상세보기
  35. Vasoya,Kalu K., Printed wiring boards possessing regions with different coefficients of thermal expansion.
    상세보기
  36. Vasoya, Kalu K., Processes for manufacturing printed wiring boards.
    상세보기
  37. Gandi, Angelo; De Oliveira, Rui; Carter, Anthony Arthur, Thermal management device and method of making such a device.
    상세보기
  38. Gandi, Angelo; De Oliveira, Rui; Carter, Anthony Arthur, Thermal management device and method of making such a device.
    상세보기
  39. Jensen Warren M. (Kirkland WA) Wilkinson William C. (Redmond WA), Thermally conductive printed wiring board laminate.
    상세보기
  40. Fuerniss, Stephen J.; Johansson, Gary; Keesler, Ross W.; Lauffer, John M.; Markovich, Voya R.; Moschak, Peter A.; Russell, David J.; Wilson, William E., Through hole in a photoimageable dielectric structure with wired and uncured dielectric.
    상세보기
  41. Shibuya Akinobu (Tokyo JPX) Kimura Mitsuru (Tokyo JPX), Via-structure of a multilayer interconnection ceramic substrate.
    상세보기

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