초록 ▼

An electrically conductive path through an insulating plate (10) is produced by forcing sheets of conductive material (13, 14) into contact through a hole (11) in the plate (10). The sheets (13, 14) are forced together with sufficient force to produce a cold weld junction, which is then plated with

An electrically conductive path through an insulating plate (10) is produced by forcing sheets of conductive material (13, 14) into contact through a hole (11) in the plate (10). The sheets (13, 14) are forced together with sufficient force to produce a cold weld junction, which is then plated with a conductive metal (102). Dies for producing the cold weld utilize metallic spheres (110), rods (188) or chemically etched projections (228). Shaped dies (268, 272) form a crimped joint without a cold weld, and offset dies (246, 250) produce a raised junction (252) for use as a mount for a planar component. In manufacturing a printed circuit board (160) the cold weld die (158) is produced with the same drill hole pattern as used to form the drill holes in the printed circuit board (160).

대표청구항 ▼

A method for establishing an electrically conductive path through an insulating plate which comprises the steps of: (a) forming a hole through said plate, (b) placing conductive material over each opening of said hole and in flush contact with each surface of said plate, and (c) disposing the assemb

A method for establishing an electrically conductive path through an insulating plate which comprises the steps of: (a) forming a hole through said plate, (b) placing conductive material over each opening of said hole and in flush contact with each surface of said plate, and (c) disposing the assembly in a press with said through holes located between opposed non-planar pressing members. (d) applying pressure to cause said conductive material to merge and flow outwards between pressing members to produce a cold weld. The method of claim 1, wherein the opposed pressing members are pressed substantially together to provide a through hole in the conductive material. A method for forming an electrically conductive through-hole in an insulating plate comprising the steps of: (a) forming a hole through said plate; (b) placing conductive material over each opening of said hole and in flush contact with each surface of said plate, (c) applying a force to a first of said conductive materials to force said first conductive material into contact with a second of said conductive materials where said force is of magnitude and character to produce a metallurgical junction between said conductive materials and form a hole through said conductive materials in the zone of contact, said metallurgical junction formed by vibrating at least that portion of said conductive materials in the zone of contact to cause said conductive materials metallurgically to bond at point of said contact. Apparatus for forcing together selected areas of conduction members disposed on opposite sides of an insulating member through a hole in the insulating member to form a cold weld junction between said conduction members, comprising in combination: (a) a first plate and second opposed plate, (b) a plurality of opposed projecting members extending from the surface of said first plate and said second plate, (c) an opposed convexly rounded face on each of said projecting members, (d) means for positioning said insulating member between said first and second plates to align said areas of said conduction members to be welded with said projecting member, and (e) means for driving said first and said second plates together to compress said conduction members together between said faces of said projecting members with sufficient force to form a cold weld junction between said conduction members in the zone of said hole.