초록 ▼

A polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups useful for forming relief structures on electrical devices such as capacitors, integrated circuits and semiconductors; a solution of the composition is applied to a substrate suc

A polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups useful for forming relief structures on electrical devices such as capacitors, integrated circuits and semiconductors; a solution of the composition is applied to a substrate such as a coated silicon wafer which forms an electrical device, dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is baked to form a polyimide structure with sharp definition and has good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition: a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.

대표청구항 ▼

An improved radiation polymerizable composition consisting essentially of (a) a polyamide ester resin containing photopolymerizable groups; (b) a solvent for the resin; (c) radiation sensitive polymerizable polyfunctional acrylate compound and (d) photopolymerization initiator of an aromatic biimida

An improved radiation polymerizable composition consisting essentially of (a) a polyamide ester resin containing photopolymerizable groups; (b) a solvent for the resin; (c) radiation sensitive polymerizable polyfunctional acrylate compound and (d) photopolymerization initiator of an aromatic biimidazole; wherein the polyamide ester resin upon heating converts to a polyimide resin.