초록 ▼

A method of production of solder coated conductor wiring wherein a lead layer and a tin layer are separately applied to the surface of a ceramic substrate in superposed relation, and subjected to heat treatment at a temperature suitable for alloying the lead and tin into a lead-tin alloy, to provide

A method of production of solder coated conductor wiring wherein a lead layer and a tin layer are separately applied to the surface of a ceramic substrate in superposed relation, and subjected to heat treatment at a temperature suitable for alloying the lead and tin into a lead-tin alloy, to provide the solder coated conductor wiring.

대표청구항 ▼

A production method for solder coated conductor wiring comprising the following steps (a) through (g): (a) a thin metal film selected from the group consisting of chromium, nichrome and titanium is formed on a ceramic substrate by vacuum deposition or sputtering, (b) a thin copper film is formed on

A production method for solder coated conductor wiring comprising the following steps (a) through (g): (a) a thin metal film selected from the group consisting of chromium, nichrome and titanium is formed on a ceramic substrate by vacuum deposition or sputtering, (b) a thin copper film is formed on said thin metal film by vacuum deposition or sputtering, (c) a photo-resist is coated on said thin copper film surface, then developed to remove the photo-resist from the portions of the thin copper film which represent conductors of the wiring to expose the copper of these portions, (d) an electroplated copper layer is formed on said exposed portions of thin copper film by electroplating, (e) a lead layer and a tin layer are formed separately superposed relation by electroplating on said copper layer, (f) the residual photo-resist is removed and then said thin copper film and one of the thin chromium film, the thin nichrome film and the thin titanium film underlying the photo-resist is removed by etching, (g) said lead layer and said tin layer are subjected to heat treatment at a suitable temperature for converting the lead and tin into an alloy to produce a lead-tin solder.