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|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||34/151 ; 34/20 ; 34/158 ; 34/162|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 11 인용 특허 : 1|
Electrical circuit boards are cooled immediately after passing through a soldering work station wherein heat-sensitive electrical components are mechanical soldered into such circuit boards so as to minimize dangerous temperature peaks without disrupting the soldering process. The cooling device is positioned closely adjacent to the soldering work station and comprises a housing having a C-shaped passageway along the center thereof for receiving an elongated transport means carrying freshly-soldered circuit boards in a given direction from the solder sol...
In a device for cooling printed circuit boards after mechanical soldering of heat-sensitive electrical components into such boards with the aid of a cooling air stream which is circulated in a substantially closed circuit with the aid of a fan means and a means for transporting such board past the air stream, wherein the improvement comprises: a somewhat C-shaped housing defining said closed circuit and positioned approximately perpendicular relative to a transport direction of said boards and embracing said means for transporting such boards at a distan...