초록 ▼

An Integrated Circuit Package in which integrated circuit (I.C.) chips having flexible beam leads, the inner lead bond sites of which are bonded to input/output (I/O) terminals on the active faces of the chips, are mounted active face down on a surface of a substrate. The surface of the substrate is

An Integrated Circuit Package in which integrated circuit (I.C.) chips having flexible beam leads, the inner lead bond sites of which are bonded to input/output (I/O) terminals on the active faces of the chips, are mounted active face down on a surface of a substrate. The surface of the substrate is provided with chip sites and outer lead (OL) pads associated with each chip site. A preform of a fiber glass web coated with a thermosetting plastic is positioned on each chip site between a chip site and the active face of the I.C. chip. The plastic material of the preforms encapsulates the active faces of the chips, including a portion of each of the leads proximate a chip, and secures each chip to its chip site. The outer lead bond sites of the leads are bonded to OL pads of the substrate with the exposed portions of the leads between the OL pads and the encapsulated portion being bent away from the substrate and under compression.

대표청구항 ▼

The combination comprising: an integrated circuit chip having an active face having outer edges, a back face, and a plurality of input/output terminals on the active face; a plurality of flexible beam leads, each lead having an inner and an outer lead bonding site, the inner lead bonding site of eac

The combination comprising: an integrated circuit chip having an active face having outer edges, a back face, and a plurality of input/output terminals on the active face; a plurality of flexible beam leads, each lead having an inner and an outer lead bonding site, the inner lead bonding site of each lead being bonded to an input/output terminal on the integrated circuit chip; a substrate having a top surface, a chip pad formed on said top surface, and a plurality of outer lead pads associated with said chip pad; a preform comprised of a segment of a web coated with an electrically insulating thermally conductive thermosetting plastic material, said preform substantially covering said chip pad; and said integrated circuit chip being mounted on said preform with its active face and the portions of the leads proximate the input/output terminals of the chip being encapsulated in the plastic material of said preform, said plastic material also being located between the leads and the outer edges of the active face of the chip, the outer lead bonding sites of the leads being bonded respectively to the outer lead pads associated with the chip pad.