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Continuous process for producing reinforced resin laminates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C09J-005/02
출원번호 US-0223402 (1981-01-08)
우선권정보 JP-0001020 (1980-01-08)
발명자 / 주소
  • Oizumi Masayuki (Kobe JPX) Uekita Masakazu (Kobe JPX) Goto Masana (Miki JPX) Azumi Ichiro (Ohtsu JPX) Uozumi Shoji (Kobe JPX) Abe Masaharu (Kobe JPX) Fushiki Yasuo (Takatsuki JPX) Isshiki Minoru (Kob
출원인 / 주소
  • Kanegafuchi Kagaku Kogyo Kabushiki Kaisha (Osaka JPX 03)
인용정보 피인용 횟수 : 28  인용 특허 : 2

초록

A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated subs

대표청구항

In a continuous process for producing reinforced resin laminates comprising the steps of impregnating a cellulosic fibrous substrate with a liquid thermosetting unsaturated polyester resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous by-products, l

이 특허에 인용된 특허 (2)

  1. Wagle ; Uday Dakornath ; Ramdas ; Venkatram, Continuous manufacture of peroxyesters.
  2. Adler ; Edward, Process for producing metal-plastic laminate.

이 특허를 인용한 특허 (28)

  1. Lauffer,John M.; Markovich,Voya R.; Orband,James W.; Wilson,William E., Apparatus and method for making circuitized substrates in a continuous manner.
  2. Lauffer, John M.; Markovich, Voya R.; McNamara, Jr., James J.; Moschak, Peter A., Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner.
  3. Lauffer,John M.; Markovich,Voya R.; Orband,James W.; Wilson,William E., Apparatus for making circuitized substrates in a continuous manner.
  4. Jeffrey W. Johnson ; Michael D. Fox, Coating compositions containing non-aqueous dispersed polymer, a silane functional acrylic polymer and a triazine.
  5. Aijima, Masatoshi, Continuous molding method of composite material having stepwise sectional thickness.
  6. Eggers Eugene A. (Binghamton NY) Summa William J. (Endwell NY), Continuous process for the manufacture of printed circuit boards.
  7. Benedikt George M. (Macedonia OH) Smith David J. (Sheffield Lake OH), Curable polycycloolefin resin solutions, their use in making printed circuit boards and the boards so made.
  8. Balthes, Garry E.; Eggers, Darrell R.; Baumbaugh, Gregg B., Fire retardant panel composition and methods of making the same.
  9. Balthes, Garry E., Heat deflection/high strength panel compositions.
  10. Benedikt, George M., Laminates of polynorbornene and polyolefins derived from C.sub.2 -C.sub.4 monomers.
  11. Benedikt George M. (Macedonia OH), Laminates of polynorbornene and polyolefins derived from C2-C4 monomers.
  12. Benedikt George M. (Macedonia OH) Tenney Linwood P. (Birmingham AL), Low dielectric constant prepreg based on blends of polynorbornene and polyolefins derived form C2-C4<.
  13. Ichino, Masahiro; Kaneko, Manabu; Koga, Kazuki; Miura, Teppei; Teranishi, Takuya; Numata, Kiharu; Mitani, Kazutami; Samejima, Tadao, Matrix resin composition, prepreg and method for producing the same, and fiber-reinforced composite material.
  14. Yanagida Tomomi (Fujieda JPX) Ajiki Mitunori (Fujieda JPX) Suzuki Shigeru (Fujieda JPX), Metal-clad laminate and process for producing the same.
  15. Cattanach James B. (Middlesbrough GB2) Jones Anthony E. (Hitchin GB2), Method for forming reinforced thermoplastic composites.
  16. Davis, Thomas J.; Desai, Subahu D.; Lauffer, John M.; McNamara, Jr., James J.; Markovich, Voya R., Method for making a multilayered circuitized substrate.
  17. Lauffer, John M.; Markovich, Voya R.; McNamara, Jr., James J.; Moschak, Peter A., Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner.
  18. Jiang, Kai-Li; Liu, Liang; Fan, Shou-Shan, Method for making protective device for protecting carbon nanotube film.
  19. Ellis, John; Caballero, Andrea, Method for on-line control of a manufacturing process for a multicomponent sheet material.
  20. Saitou, Takeshi; Hanawa, Akinori; Matsuzaki, Takashi; Sudou, Morimichi, Method for producing prepreg, prepreg, metal clad laminate and printed wiring board.
  21. Benedikt George M. (Macedonia OH) Aleksa David M. (Parma OH), Multi-layer polynorbornene and epoxy laminates and process for making the same.
  22. Kawamura, Yoichiro; Sawa, Shigeki; Tanno, Katsuhiko; Tanaka, Hironori; Fujii, Naoaki, Printed wiring board.
  23. Krenkel Bernhard (Heidenheim DEX) Joos Heinz (Heidenheim DEX), Process of producing tension-proof, impermeable, flexible bands, in particular for presses to dewater fiber material web.
  24. Tonoki Satoshi (Suita JPX) Tsunemi Hidenari (Ohtsu JPX) Nishimura Asaichi (Ohtsu JPX) Abe Kunihisa (Ohtsu JPX), Unsaturated polyester resin compositions.
  25. Tsunemi Hidenari (Otsu JPX) Fushiki Yasuo (Takatsuki JPX) Nishimura Asaichi (Otsu JPX) Kawai Yousuke (Otsu JPX), Unsaturated polyester resin compositions and electrical laminates made therefrom.
  26. Tsunemi Hidenari (Otsu JPX) Fushiki Yasuo (Takatsuki JPX) Nishimura Asaichi (Otsu JPX) Kawai Yousuke (Otsu JPX), Unsaturated polyester resin compositions and electrical laminates made therefrom.
  27. Raney, Charles C.; Du, Hongli; Pierson, Jr., John T., Web or sheet-fed apparatus having high-speed mechanism for simultaneous X, Y and θ registration and method.
  28. Raney, Charles C.; Du, Hongli; Pierson, Jr., John T., Web or sheet-fed apparatus having high-speed mechanism for simultaneous X,Y and theta registration.

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