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An apparatus and a method of use thereof for cast encapsulation of items, particularly electronic components. The apparatus consists of a plurality of identically shaped split matrix elements. Each matrix element has a first surface for receiving and securing the item to be encapsulated. A second su

An apparatus and a method of use thereof for cast encapsulation of items, particularly electronic components. The apparatus consists of a plurality of identically shaped split matrix elements. Each matrix element has a first surface for receiving and securing the item to be encapsulated. A second surface of another identically shaped matrix element, located on a side thereof opposite to its first surface, is then mated with the first surface securing the item. Thus mated, the first and second surfaces establish a molding cavity for enclosing the item and an orifice providing access thereto. This process of securing an item to a first surface and enclosing it with a second surface is repeated thereby assembling a stack of matrix elements. This stack is then rigidly secured and the molding cavities are filled with particulate filler material through upright orifices. Excess filler is removed by quickly turning the stack over and then righting it again. The stack of matrices is then heated, its orifices filled with a quantity of heated, liquid thermosetting encapsulating compound and exposed to vacuum whereby substantially all air is drawn from the molding cavities through the liquid encapsulating compound. The stack is then again exposed to atmospheric pressure forcing the encapsulating compound throughout the unoccupied voids in the molding cavities after which that compound is permitted to solidify, thereby completing the encapsulation process.

대표청구항 ▼

A method for encapsulation casting comprising the steps of: a. securing an item to be encapsulated to a first surface of a split matrix molding cavity element and then mating a surface of another split matrix molding cavity element with said first surface to which said item is secured thereby formin

A method for encapsulation casting comprising the steps of: a. securing an item to be encapsulated to a first surface of a split matrix molding cavity element and then mating a surface of another split matrix molding cavity element with said first surface to which said item is secured thereby forming a composite cavity about the matrix and with an orifice extending from the cavity to the exterior whereby a stack of mated matrix elements is established, said item being enclosed within the molding cavity established therein; b. rigidly securing said stack of mated matrix elements; c. filling said molding cavity in said rigidly secured stack with a quantity of particulate filler material; d. evacuating said molding cavity containing said item to be encapsulated and said particulate filler material so as to remove gases and moisture; e. filling said evacuated molding cavity with an encapsulating compound; f. removing the source of vacuum, thus allowing atmospheric pressure to act on the encapsulating compound; and g. solidifying said encapsulating compound into an integral whole including said particulate filler material and encapsulating said item to be encapsulated.