[특허]Multi-planar electrode plasma etching

Drytek, Inc.

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특허 상세정보

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Multi-planar electrode plasma etching

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	C23C-015/00
미국특허분류(USC)	156/345; 156/643; 204/192.E; 204/298; 219/121.PP; 219/121.PG; 414/417
출원번호	US-0337372 (1982-01-06)
발명자 / 주소	Maher, Jr., Joseph A. Zafiropoulo, Arthur W.
출원인 / 주소	Drytek, Inc.
대리인 / 주소	Mrose, James E.
인용정보	피인용 횟수 : 45 인용 특허 : 12

초록
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Dry plasma etching of a plurality of planar thin-film semiconductor wafers is effected simultaneously and uniformly in a relatively small chamber enveloping a vertically-stacked array of laminar electrode sub-assemblies each of which includes a pair of oppositely-excited electrode plates tightly sandwiching a solid insulating layer of dielectric material, the parallel sub-assemblies being vertically separated to subdivide the chamber into a plurality of reactor regions where RF discharges can excite a normally inert ambient gas to develop reactive plasma for simultaneous planar plasma etching or reactive ion etching (RIE) of all wafers within the several regions. The upper plates of the electrode sub-assemblies, which support the wafers during etching, are at any instant all maintained at the same potential, whether RF or ground in the different modes of operation, and fluid coolant is forced through a distribution of internal passageways in those support plates; all lower plates of the pairs are simultaneously maintained at the opposite potential, whether ground or RF, and the intervening insulating dielectric layers in the sub-assemblies are relatively thin while at the same time providing critical electrical isolation and curbing spurious discharge without serious electrical mismatching. Uncomplicated transport of individual wafers between vertically-stacked positions in a cassette and the stacked array of etching regions is accomplished from below by a reciprocatable arm which is receivable within accommodating slots recessed into the upper cooled electrode plates alongside one edge of the stacked array; programmed vertical movements of the cassette and electrode array allow for appropriate loading and unloading of wafers, and for proper orientation of the reactor regions in relation to the enclosing chamber and associated equipment.

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1. Apparatus for interacting gas plasma with workpieces, comprising chamber means including means for providing within it gaseous environment from which plasma can be generated under influence of applied electrical potentials, a multi-electrode assembly for applying said potentials across separated proximate regions each accommodating at least one workpiece within said chamber means, said assembly including a plurality of electrode units spaced apart by said regions and each having a pair of conductive electrodes and a solid dielectric material therebetween, and means for establishing different electrical potentials simultaneously at the conductive electrodes of each pair of electrodes. 2. Apparatus for interacting gas plasma with workpieces as set forth in claim 1, wherein said conductive electrodes are uniformly spaced and said dielectric material in each of said units substantially fills the volume between the electrodes thereof, the thickness of said dielectric material in said units being less than that of the said regions between said units. 3. Apparatus for interacting gas plasma with workpieces as set forth in claim 2 wherein said conductive electrodes are substantially planar and parallel, wherein said electrode units are of substantially the same size and substantially parallel and aligned with one another, wherein said regions are of substantially the same volume and thickness, and wherein said means for establishing said potentials produces like instantaneous potentials of the same sense across all of said regions. 4. Apparatus for interacting gas plasma with workpieces as set forth in claim 3 wherein said conductive electrodes are substantially horizontal and said regions are in vertically-stacked relationship, upper electrodes of said units being adapted to receive and support workpieces thereon. 5. Apparatus for interacting gas plasma with workpieces as set forth in claim 3 wherein said means for establishing said potentials comprises a source of radio-frequency signals, impedance matching means for coupling said source with all of said electrodes to apply said potentials thereacross, and means for splitting the radio-frequency power output from said impedance matching means substantially equally between adjacent sets of electrodes. 6. Apparatus for interacting gas plasma with workpieces as set forth in claim 5 wherein corresponding ones of each of the pairs of said electrodes is grounded, and wherein said impedance-matching means comprises an adjustable inductance in series with an ungrounded output lead from said source and an adjustable capacitance shunted across said lead and said grounded electrodes. 7. Apparatus for interacting gas plasma with workpieces as set forth in claim 5 wherein said means for splitting said radio-frequency power output comprises adjustable capacitances in series with corresponding ones of each of the pairs of said electrodes. 8. Apparatus for interacting gas plasma with workpieces as set forth in claim 7 further comprising adjustable capacitance means in series with all of the adjustable capacitance means of the pairs of said electrodes. 9. Apparatus for etching workpieces such as semiconductor wafers by exposure to gas plasma, comprising chamber means including means for providing within it gaseous environment from which plasma can be generated under influence of applied electrical potentials, a vertically-stacked multi-electrode assembly for applying said potentials similarly across all of an aligned series of separate plasma-discharge regions each accommodating a workpiece within said chamber means, said assembly including a plurality of substantially horizontal electrode units each having a pair of substantially planar electrodes with substantially the same lateral dimensions and shape and a fill of solid dielectric material of substantially uniform thickness therebetween, said assembly further including a support structure having uprights mounting said electrode units at the edges thereof in insulated vertically-stacked and aligned relation to one another and with the same uniform-height spacing therebetween defining said separate plasma-discharge regions, said thickness of said full of dielectric material being less than the height of said spacing, and upper electrodes of said units being adapted to receive and support workpieces thereon, and means for applying substantially the same radio-frequency excitation at each instant across electrodes of said units which border the top and bottom of each of said regions to thereby generate substantially identical plasma conditions simultaneously in all of said regions. 10. Apparatus for etching workpieces as set forth in claim 9 further comprising a workpiece-transfer station including means alongside said assembly of electrode units for receiving a cassette with vertically-stacked workpieces therein, and a workpiece-transfer arm operatively associated with actuating and control means which moves said arm between extended and retracted positions and causes said arm transfers workpieces sequentially between their positions is said cassette and the portions of said upper electrodes which are adapted to receive and support them. 11. Apparatus for etching workpieces as set forth in claim 10 further including means for elevating and lowering said support structure to bring said regions and said portions of said upper electrodes into position for loading and unloading of workpieces by said workpiece-transfer arm. 12. Apparatus for etching workpieces as set forth in claim 9 wherein said workpiece-supporting upper electrodes of said units have passageways therethrough for guiding flow of coolant therethrough to maintain said upper electrodes cooled, and further comprising means for forcing liquid coolant through said upper electrodes while plasma is generated in said regions. 13. Apparatus for etching workpieces as set forth in claim 12 wherein said passageways in each of said upper electrodes are formed by a pair of spaced parallel elongated blind bores laterally therein each merged with a plurality of oblique elongated bores formed therein from the site of a cavity recessed into an edge thereof between said blind bores, said cavity being closed along said edge, the openings to said blind bores forming an inlet and outlet for the coolant flow through each of said upper electrodes. 14. Apparatus for etching workpieces as set forth in claim 9 wherein said means for applying substantially the same radio-frequency excitation at each instant comprises a source of radio-frequency electrical power, adjustable means for substantially matching the impedance at which the output of power is delivered from said source and the input impedance exhibited by the spaced and insulated planar electrodes, and means for splitting the radio-frequency power output from said adjustable means substantially equally between the several pairs of said electrodes. 15. Apparatus for etching workpieces as set forth in claim 14 wherein said adjustable means comprises an adjustable inductance in series with an ungrounded output conductor from said source and an adjustable capacitance shunted across said conductor and a grounded output conductor from said source. 16. Apparatus for etching workpieces as set forth in claim 14 wherein said means for splitting said output comprises a plurality of adjustable capacitances one each in series with each of said upper electrodes and connected with an ungrounded output conductor from said adjustable means. 17. Apparatus for etching workpieces as set forth in claim 14 further comprising adjustable capacitance means in series with all of said upper electrodes.

이 특허에 인용된 특허 (12)

이 특허를 인용한 특허 피인용횟수: 45

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Multi-planar electrode plasma etching

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Multi-planar electrode plasma etching

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이 특허에 인용된 특허 (12)

이 특허를 인용한 특허 피인용횟수: 45

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