|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||428/40 ; 24/304 ; 24/DIG ; 11 ; 156/71|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 29 인용 특허 : 2|
A method and apparatus making use of that method for applying pressure to an element to be adhesively or comparably secured to a substrate. An example of such an apparatus is found in an adhesive patch and means for applying the patch to a surface which may have been ruptured.
An adhesive attachment assembly for applying an attachment to a substrate, comprising: an attachment; a support member including a first portion carrying said attachment, and a second portion movably supporting said first portion for movement of said attachment between a first position out of substantial bearing engagement with the substrate and a second position for bearing engagement with the substrate; connector means for temporarily securing said second portion of said support member with respect to the substrate adjacent said attachment; and biasing...