이 특허를 인용한 특허 (69)

1. Nakai Izuru,JPX ; Muneyuki Ken,JPX, Apparatus and method for processing.

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2. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.

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3. Sasaoka, Kenji; Ikegaya, Fumitoshi; Mori, Takahiro; Motomura, Tomohisa; Sato, Yoshizumi; Shibayama, Koichiro, Apparatus for manufacturing a wiring board.

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4. Hara, Hideaki, Carrier system, exposure apparatus, carrier method, exposure method, device manufacturing method, and suction device.

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5. Cherala, Anshuman; Choi, Byung Jin; Lad, Pankaj B.; Shackleton, Steven C., Chucking system comprising an array of fluid chambers.

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6. Babbs, Daniel A.; Choi, Byung-Jin; Cherala, Anshuman, Chucking system for nano-manufacturing.

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7. Compen, Rene Theodorus Petrus; Jacobs, Johannes Henricus Wilhelmus; Leenders, Martinus Hendrikus Antonius; Ottens, Joost Jeroen; Smeets, Martin Frans Pierre, Clamping device and object loading method.

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8. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.

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9. Siddall Graham J. (Woodside CA), Deformable chuck driven by piezoelectric means.

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10. Phillips, Alton H., Devices and methods for reducing residual reticle chucking forces.

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11. Yonekawa, Masami; Fukagawa, Yozo, Exposure apparatus and its control method, stage apparatus, and device manufacturing method.

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12. Tanaka Tsutomu (Yokohama JPX) Oshida Yoshitada (Fujisawa JPX) Shiba Masataka (Yokohama JPX) Nakashima Naoto (Kurita JPX) Funatsu Ryuichi (Yokohama JPX), Exposure method and apparatus.

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13. Govil, Pradeep Kumar; Ivaldi, Jorge, Flexible piezoelectric chuck and method of using the same.

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14. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.

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15. Jones, William D., High pressure fourier transform infrared cell.

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16. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.

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17. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.

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18. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.

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19. McMackin,Ian M.; Lad,Pankaj B.; Truskett,Van N., Imprint lithography template to facilitate control of liquid movement.

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20. Lin, Burn-Jeng; Gau, Tsai-Sheng; Chen, Jeng-Horng, Level adjustment systems and adjustable pin chuck thereof.

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21. Tempelaars,Jeffrey Godefridus Cornelis; Hofmans,Gerardus Carolus Johannus; Oesterholt,Rene; Hauschild,Jan; Kattouw,Hans Erik, Lithographic apparatus, calibration method, device manufacturing method and computer program product.

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22. McKinley William G. ; Perron Gerard M. ; Tatian Berge, Lithography system and method with mask image enlargement.

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23. Itoh, Masamitsu, Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server.

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24. Itoh, Masamitsu, Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server.

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25. Itoh, Masamitsu, Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server.

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26. Itoh, Masamitsu, Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server.

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27. Itoh,Masamitsu, Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server.

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28. Itoh,Masamitsu, Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server.

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29. Yamada Katsurou,JPX ; Miyata Sumio,JPX, Manufacturing method of liquid display devices using a stainless steel suction plate having a phosphorus doped nickel c.

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30. Kim, Ho Eoun, Mask clamping apparatus and method of manufacturing mask.

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31. Donders, Sjoerd N .L.; van Empel, Tjarko A. R., Mask for clamping apparatus, e.g. for a lithographic apparatus.

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32. Itoh, Masamitsu, Maunfacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server.

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33. Doran Daniel B., Method and apparatus for chemical mechanical polishing.

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34. Collins David R. (Eau Claire WI) Franz Perry D. (Elk Mound WI) Taylor Pamela W. (Eau Claire WI), Method and apparatus for cooling an integrated circuit chip during testing.

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35. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.

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36. Taniguchi, Yukio; Yamaguchi, Hirotaka; Tsujikawa, Susumu, Method and apparatus for forming pattern on thin substrate or the like.

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37. Taniguchi,Yukio; Yamaguchi,Hirotaka; Tsujikawa,Susumu, Method and apparatus for forming pattern on thin substrate or the like.

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38. Fehrenbach Hubert (Kehl DEX) Koch Volker (Battenberg DEX) Boese Bernhard (Kehl DEX), Method and apparatus for the surface machining of substrate plates for magnetic memory plates.

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39. Govil, Pradeep Kumar; Tsacoyeanes, James, Method and system for selective linewidth optimization during a lithographic process.

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40. Tseng,Li Hsin; Huang,Gil; Yu,Huei Mei; Cheng,Chia Jen; Sun,Ken; Yu,Chien Tung; Chang,Blenny; Chan,Chih Yang; Luo,Jian Wen; Chen,Owen, Method for forming solder bumps of increased height.

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41. Kuit, Jan-Jaap; Snijders, Nick, Method of loading a substrate on a substrate table and lithographic apparatus and device manufacturing method.

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42. Kuit, Jan-Jaap; Snijders, Niek, Method of loading a substrate on a substrate table and lithographic apparatus and device manufacturing method.

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43. Choi, Byung Jin; Cherala, Anshuman; Babbs, Daniel A., Method of retaining a substrate to a wafer chuck.

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44. Choi, Byung Jin; Cherala, Anshuman; Choi, Yeong jun; Meissl, Mario J.; Sreenivasan, Sidlgata V.; Schumaker, Norman E.; Lu, Xiaoming; McMackin, Ian M.; Babbs, Daniel A., Method of separating a mold from a solidified layer disposed on a substrate.

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45. Waddell John L., Portable leveling vacuum tool.

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46. Yoshitake, Shusuke; Tamamushi, Shuichi, Position measuring apparatus and positional deviation measuring method.

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47. Baruch Ben-Menachem IL; Yaacov Zerem IL; Nissim Asida IL, Precision double-sided aspheric element.

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48. Ben Menachem,Baruch; Zerem,Yaacov; Asida,Nissim, Precision double-sided aspheric element.

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49. Ben-Menachem, Baruch; Zerem, Yaacov; Asida, Nissim, Precision double-sided aspheric element.

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50. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.

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51. Wuester,Christopher D., Process flow thermocouple.

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52. Falster, Robert J.; Voronkov, Vladimir V.; Pitney, John A.; Albrecht, Peter D., Processes and apparatus for preparing heterostructures with reduced strain by radial compression.

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53. Falster, Robert J.; Voronkov, Vladimir V.; Pitney, John A.; Albrecht, Peter D., Processes and apparatus for preparing heterostructures with reduced strain by radial distension.

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54. Ishizaka Shoji (Kawasaki JPX) Mizutani Hideo (Yokohama JPX) Makinouchi Susumu (Kawasaki JPX) Tanimoto Akikazu (Yokohama JPX), Projection optical apparatus.

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55. Heo, Jin-Seok; Park, Chang-Min; Yeo, Jeong-Ho; Park, Joo-On; Kim, In-Sung, Reflective reticle chuck, reflective illumination system including the same, method of controlling flatness of reflective reticle using the chuck, and method of manufacturing semiconductor device using the chuck.

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56. Zordan, Enrico, Reticle clamping system.

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57. Yamamoto,Masayuki; Matsushita,Takao, Semiconductor wafer transport method and semiconductor wafer transport apparatus using the same.

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58. Shibazaki, Yuichi; Yoshimoto, Hiromitsu, Stage apparatus, exposure apparatus and device manufacturing method.

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59. Smeets, Erik Marie Jose, Substrate distortion measurement.

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60. Smeets, Erik Marie Jose, Substrate distortion measurement.

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61. Kitaoka Atsushi (Kisarazu JPX) Kuno Mitsutoshi (Sagamihara JPX) Marumo Mitsuji (Sagamihara JPX), Substrate holding system and exposure apparatus having the same.

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62. Akiyama Nobuyuki (Yokohama JPX) Kuni Asahiro (Tokyo JPX) Kembo Yukio (Yokohama JPX) Nakata Toshihiko (Yokohama JPX), Substrate surface deflecting device.

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63. Hernandez Hernandez, Adrian, Tool for transporting and shaping flexible sheet parts.

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64. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.

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65. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.

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66. Schwartz Vladimir (Lexington MA) Freytsis Avrum (Swampscott MA), Vacuum pick for semiconductor wafers.

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67. Edis David (San Bernardino CA) Poort Bert (Covina CA), Vacuum vice for bowling balls and method.

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68. Kenbo Yukio (Yokohama JPX) Akiyama Nobuyuki (Yokohama JPX) Koizumi Mitsuyoshi (Yokohama JPX) Kuni Asahiro (Tokyo JPX), Wafer transforming device.

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69. Yoshitake, Shusuke; Tamamushi, Shuichi, Writing method and writing apparatus of charged particle beam, positional deviation measuring method, and position measuring apparatus.

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