초록 ▼

A method and device for producing multilayer printed circuit boards, under the application of heat and pressure to a stack of printed circuit boards and interposed layers of thermosetting plastic, the multilayer stack being heated in a first press to a curing temperature above the flux point of the

A method and device for producing multilayer printed circuit boards, under the application of heat and pressure to a stack of printed circuit boards and interposed layers of thermosetting plastic, the multilayer stack being heated in a first press to a curing temperature above the flux point of the bonding layers, then precooled under continued pressure to a transfer temperature below the flux point and transferred to a second press, where it is aftercooled under pressure to ambient temperature. The press installation of the invention includes two independently operating multi-stage presses in a common press frame. The plates of the press stages are horizontally aligned in the open position of the two presses.

대표청구항 ▼

A method of assembling a plurality of printed circuit boards into a permanently bonded multilayer circuit board stock, the method comprising the steps of stacking printed circuit boards in alternation with bonding layers of thermosetting resin-based plastic to form multilayer stacks; heating a first

A method of assembling a plurality of printed circuit boards into a permanently bonded multilayer circuit board stock, the method comprising the steps of stacking printed circuit boards in alternation with bonding layers of thermosetting resin-based plastic to form multilayer stacks; heating a first multilayer stack under compression in a first panel press to a curing temperature at which the material of the bonding layers undergoes a curing process; precooling the first multilayer stack under compression in the first panel press to a transfer temperature which lies between the curing temperature and the ambient temperature; transferring the precooled first multilayer stack from the first panel press to a second panel press; loading a second multilayer stack in the first panel press; and aftercooling the transferred multilayer stack under compression in the second panel press to a temperature in the vicinity of the ambient temperature, while heating the second multilayer stack in the first panel press as aforesaid.