초록 ▼

A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection reg

A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.

대표청구항 ▼

A solderable and weldable circuit board apparatus comprising: a base board having a multiplicity of holes therein; a layer of solderable material disposed on said base board and forming a plurality of separate connection regions, the layer in each of said regions plating a plurality of holes and an

A solderable and weldable circuit board apparatus comprising: a base board having a multiplicity of holes therein; a layer of solderable material disposed on said base board and forming a plurality of separate connection regions, the layer in each of said regions plating a plurality of holes and an area on said base board which connects the holes; and a plurality of pins of weldable material, each lying in a selected one of said holes and having an electrode-engageable end to enable the welding of a wire thereto, each pin being in press-fit contact with the layer of solderable material on the walls of the hole but being free of bonding to the solderable material that plates the hole so the pin can be removed by forcing out without substantial damage to the walls of the hole; each of said connection regions having at least one hole which holds one of said pinds and at least one other hole which is devoid of a pin to enable a lead to be soldered therein.