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Air baffle assembly for electronic circuit mounting frame 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0332480 (1981-12-21)
발명자 / 주소
  • Wright Kurt O. (Sun Valley CA) Brehm Timothy L. (Irvine CA) Berger Duaine E. (Los Angeles CA) Matsuoka Paul S. (Culver City CA)
출원인 / 주소
  • Ampex Corporation (Redwood City CA 02)
인용정보 피인용 횟수 : 47  인용 특허 : 1

초록

A variable width baffle assembly maintains constant, uniform impedance to the flow of cooling air across a vacant space on a partially populated electronic mounting frame for printed circuit board assemblies. The inexpensive but reliable baffle assembly includes end boards mounted on opposite sides

대표청구항

An assembly comprising: an electronic mounting frame adapted to receive and maintain in parallel spaced relationship a maximum number of electronic elements; at least one and less than the maximum number of electronic elements, each occupying an amount of space; and a baffle assembly that is adaptab

이 특허에 인용된 특허 (1)

  1. Calabro Anthony D. (8738 West Chester Pike Upper Darby PA 19082), Uniformly cooled printed circuit board mounting assembly.

이 특허를 인용한 특허 (47)

  1. Clinard,Kristopher Michael, Adjustable power supply housing with compensating air baffle.
  2. Speraw Floyd G. (Lexington SC), Air cooling assembly in an electronic system enclosure.
  3. Holdredge, Paul; Hamstra, James R., Air inlet diffuser.
  4. Tong-Viet, Emmanuel, Airflow control apparatus.
  5. Saari, Byron John; Meybaum, Paul Eric, Airflow diverter for reduced specimen temperature gradient.
  6. Boyden, Demick; Sindhu, Pradeep; Hocker, Keith J., Airflow/cooling solution for chassis with orthogonal boards.
  7. Tamarkin, Vladimir; Wessel, Mark W., Apparatus and methods for cooling network switches.
  8. Tamarkin, Vladimir, Apparatus and methods for cooling networks switches.
  9. McKeen Wilbert John,CAX ; Rhodes Steven James,CAX, Baffle arrangement for an airflow balance system.
  10. C. Michael Hayward ; Richard N. Rehlander, Card guide including air deflector means.
  11. Banton, Randall G.; Blanchet, Don W.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Circuit board assembly with integrated shaping and control of flow resistance curve.
  12. Bell David L. (Winchester GB2), Circuit board installation.
  13. Wilson, Jeremy I.; Robertus, Todd D.; Hahn, Steven R.; Brooks, Michael A., Composite construction baffle for modular electronic systems.
  14. Brooks,Michael A.; Larson,Thane M., Computer cooling system and method.
  15. Larson,Thane M.; Brooks,Michael A., Computer cooling system and method.
  16. Swensen Michael W. (Austin TX) Martin William C. (Austin TX) Kight Henry H. (Austin TX), Computer cooling system using recycled coolant.
  17. Besterman, Paula; Cox, Aaron R.; Sassano, Camillo; Schultz, Kevin L., Configurable door panels.
  18. Delia David J. ; Kelly Peter W. ; McClafferty William D. ; Schmidt Roger R., Constant impedance air baffle for cooling of electronic card assemblies.
  19. Glover, Troy W.; June, Michael S.; Kamath, Vinod; Scott, III, Whitcomb R., Controlling airflow in a computer chassis.
  20. Tsai, Pinche; Conn, Kevin D, Controlling impedance of blank cartridges.
  21. Besold, Jean-Eric; Merlet, Etienne, Device with integrated electronic components provided with a partition for separating ventilated zones.
  22. Oyama, Hidetoshi; Aimi, Kei, Electric equipment.
  23. Schwehr Gregory D. (Milwaukee WI) Zibolski Richard E. (Menomonee Falls WI), Electronic circuit module with improved cooling.
  24. Scafidi Christopher J. ; Pierce David J., Electronic component cooling system.
  25. Kabat, Zbigniew, Electronic components card air deflector.
  26. Bellin, Bruno; Brehin, Francoise, Electronic computer comprising an air channeling system for cooling electronic boards.
  27. Deguchi,Masaru, Electronic equipment.
  28. John McKeen ; Willie Braun, Equipment enclosure having separate compartments cooled by separate cooling airflows.
  29. Chan, Johni, Fail safe cooling system.
  30. Fleischer, Werner, Flat element for thermally adjusting indoor air.
  31. Augustin, Thomas J.; Barsun, Stephan Karl; Malone, Christopher Gregory, Fluid-flow balancer, electronic system and related methods.
  32. Papst Georg (St. Georgen DEX) Wrobel Guenter (Villingen DEX) Koletzki Ulrich (St. Georgen DEX), Heat sink for electronic devices.
  33. Wong Henry ; Gatti John, High availability airflow management system for use in electronic equipment.
  34. Vach John P. (1145 176th Pl. ; NE. Redmond WA 98052) Johnson Jerry E. (2838 170th SE. Bellevue WA 98008) Hocker Lon O. (199 Main St. N. Falmouth MA 02556) Godley John H. (66 Lakeshore Dr. E. Falmouth, Housing for remote environmental monitor system.
  35. Kennedy Kevin J. (Sea Girt NJ), Induced flow heat exchanger.
  36. Yiu Joseph T. (Chandler AZ), Localized circuit card cooling device.
  37. Strmiska,Bernard; Brocklesby,Brandon, Method and apparatus for regulating airflow in a chassis.
  38. Dodson Douglas A., Multiple fan cooling device.
  39. Tamarkin, Vladimir, Network device with baffle for redirecting cooling air and associated methods.
  40. Elko Gary W. (Summit NJ) Howard Paul (Hinsdale IL) Quinlan Daniel A. (Andover MA), Option slot filler board.
  41. Culpepper,Martin L.; Girdhar,Rohit; Patel,Sarosh M., RIM slot filler module and method of manufacturing the same.
  42. Noha El-Ghobashy ; Albert Pedoeem ; Jana Regenwetter, Removable fan tray assembly with latching features.
  43. Duret Michael J. ; Hasenkamp Erin Martin ; Markulec Jeffrey R. ; Rex Dennis G. ; Schuster Richard E., Sieve like structure for fluid flow through structural arrangement.
  44. Miyamoto,Kenich; Okabe,Yoji, Storage device, and storage part and dummy unit for storage device.
  45. Smoot ; III Edmond (233 Broadway ; Rm. 3615 New York NY 10007) Spector George (233 Broadway ; Rm. 3615 New York NY 10007), System cooler for a computer.
  46. Fleming, James N.; Goldsberry, Timothy; Shurhay, Mark; Hibner, Max W., Thermal ducting system.
  47. Dodson Douglas A. (5995 Avenida Encinas Carlsbad CA 92008), Twin fan cooling device.
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