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Apparatus for cleaning semiconductor wafers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/12
출원번호 US-0264097 (1981-05-15)
발명자 / 주소
  • Lawson Robert M. (San Jose CA)
출원인 / 주소
  • GCA Corporation (Bedford MA 02)
인용정보 피인용 횟수 : 44  인용 특허 : 4

초록

The cleaning apparatus disclosed herein employs ultrasonic energy applied through a transducer face which overlies the entire wafer face. A cleaning liquid is introduced through the center of the transducer faceplate into the gap between the wafer and the faceplate. The transducer includes a plurali

대표청구항

Apparatus for cleaning semiconductor wafers comprising: a chuck for holding a semiconductor wafer to be cleaned; above and aligned with said chuck, an ultrasonic transducer provided with a faceplate which fully overlies a wafer held in the chuck; drive means interconnecting said chuck and said trans

이 특허에 인용된 특허 (4)

  1. Dussault Jean G. M. (Naugatuck CT) Geckle Robert A. (Newtown CT) Puskas William L. (Trumbull CT), Apparatus for cleaning workpieces by ultrasonic energy.
  2. Davidson ; Amber Charles, Apparatus for ultrasonic cleaning of carpet, upholstery, and similar materials.
  3. Hall William B. (Dallas PA), Megasonic jet cleaner apparatus.
  4. Massa Frank (Cohasset MA), Ultrasonic cleaning systems.

이 특허를 인용한 특허 (44)

  1. Fani, Pejman; Rouillard, Mark; Korbler, John; Brown, James; Hosack, Chad, Acoustic energy system, method and apparatus for processing flat articles.
  2. Rose Peter H. ; Sferlazzo Piero ; van der Heide Robert G., Aerosol surface processing.
  3. Rose Peter H. ; Sferlazzo Piero ; van der Heide Robert G., Aerosol surface processing.
  4. Hiroki Taniyama JP, Apparatus and method for washing substrate.
  5. Bran, Mario E.; Olesen, Michael B.; Wu, Yi, Apparatus and methods for reducing damage to substrates during megasonic cleaning processes.
  6. Meitzler Allen H. (Ann Arbor MI), Apparatus for applying high frequency ultrasonic energy to cleaning and etching solutions.
  7. Meitzler Allen H. (Ann Arbor MI), Apparatus for applying high frequency ultrasonic energy to cleaning and etching solutions.
  8. Bran,Mario E., Apparatus for megasonic processing of an article.
  9. Park,Jong Chul, Apparatus for treating wafer.
  10. Obweger, Rainer; Pfeuffer, Alexander; Köffler, Martin; Lippert, Alexander, Device and method for wet treating disc-like substrates.
  11. Obweger, Rainer; Pfeuffer, Alexander; Köffler, Martin; Lippert, Alexander, Device and method for wet treating disc-like substrates.
  12. Hammond Peter (Rochester NY) Schumacher Kevin S. (North Caldwell NY), High frequency ultrasonic system.
  13. Lauerhaas, Jeffrey M.; Nicolosi, Jr., Thomas J.; Mertens, Paul; Fyen, William, Megasonic cleaner and dryer.
  14. Lauerhaas,Jeffrey M.; Nicolosi, Jr.,Thomas J.; Mertens,Paul; Fyen,William, Megasonic cleaner and dryer.
  15. Itzkowitz, Herman, Megasonic treatment apparatus.
  16. Giles Brian A. (Honeoye Falls NY) Schwab Frederick J. (Churchville NY), Method and apparatus for cleaning semiconductor wafers.
  17. Verhaverbeke, Steven; Truman, J. Kelly; Ko, Alexander; Endo, Rick R., Method and apparatus for wafer cleaning.
  18. Verhaverbeke, Steven; Truman, J. Kelly; Ko, Alexander; Endo, Rick R., Method and apparatus for wafer cleaning.
  19. Verhaverbeke,Steven; Truman,J. Kelly; Ko,Alexander; Endo,Rick R., Method and apparatus for wafer cleaning.
  20. Verhaverbeke,Steven; Truman,J. Kelly; Ko,Alexander; Endo,Rick R., Method and apparatus for wafer cleaning.
  21. Bran, Mario E., Method for megasonic processing of an article.
  22. Pejman, Fani; Rouillard, Mark; Korbler, John; Brown, James; Hosack, Chad, Method for processing flat articles.
  23. Bran,Mario E., Method of cleaning a side of a thin flat substrate by applying sonic energy to the opposite side of the substrate.
  24. Bran, Mario E., Method of manufacturing integrated circuit devices.
  25. Beck, Mark Jonathan, Particle removal method using an aqueous polyphosphate solution.
  26. Huang Ying-Shih,TWX, Post-CMP cleaner apparatus and method.
  27. Jrgensen Peter J. (Virum DKX) Ddder Ulrich (Hvidovre DKX), Process and apparatus for developing including use of sound transducers.
  28. Collings, Anthony Francis, Process for treating a solid-liquid mixture.
  29. Rose Peter H. ; Sferlazzo Piero, Processing a surface.
  30. Beck, Mark J.; Vennerbeck, Richard B.; Lillard, Raymond Y.; Liebscher, Eric G., Radial power megasonic transducer.
  31. Beck, Mark J.; Vennerbeck, Richard B.; Lillard, Raymond Y.; Liebscher, Eric G., Segmented uniform energy megasonic transducer.
  32. Fisch Emily E. ; Gale Glenn W. ; Okorn-Schmidt Harald F. ; Syverson William A., Sonic cleaning with an interference signal.
  33. Hessburg Merilly Ann ; Lindsley Timothy John ; Darrow David Craig ; Sheffield John Edgar, System and method for substantially touchless hydrodynamic transport of objects.
  34. Bran, Mario E., System for megasonic processing of an article.
  35. Bran,Mario E., Transducer assembly for megasonic processing of an article and apparatus utilizing the same.
  36. Irwin Charles (Santa Ana CA) Devine Janet (Downingtown PA) Kramer Richard (Wilmington DE), Ultrasonic cleaning apparatus.
  37. Bran, Mario E., Wafer cleaning.
  38. Bran, Mario E., Wafer cleaning.
  39. Bran Mario E., Wafer cleaning method.
  40. Levi Mark W. (Utica NY), Wafer cleaning method.
  41. Mario E. Bran, Wafer cleaning method.
  42. Bran Mario E., Wafer cleaning system.
  43. Bran Mario E., Wafer cleaning system.
  44. Yeo, In-Jun; Kim, Kyung-Hyun; Nam, Jeong-Lim; Yoon, Byoung-Moon; Cho, Hyun-Ho; Hah, Sang-Rok, Wafer cleaning system.
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