초록 ▼

A soldering system is described in which a freshly soldered board is heated substantially immediately following deposition of molten solder onto the board so as to maintain the freshly applied solder in molten condition, and a fluid stream is then directed onto the molten solder. Preferably, but not

A soldering system is described in which a freshly soldered board is heated substantially immediately following deposition of molten solder onto the board so as to maintain the freshly applied solder in molten condition, and a fluid stream is then directed onto the molten solder. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.

대표청구항 ▼

Apparatus for mass joining with solder electrical and electronic components assembled in a circuit board wherein said components have leads which protrude downward through apertures in the board, and comprising in combination: a mass soldering station adapted to deposit a quantity of molten solder o

Apparatus for mass joining with solder electrical and electronic components assembled in a circuit board wherein said components have leads which protrude downward through apertures in the board, and comprising in combination: a mass soldering station adapted to deposit a quantity of molten solder onto said board underside and said protruding leads whereby to join said board and said leads; a post soldering heating station adjacent said soldering station, said post soldering heating station comprising a heat source adapted to input heat onto the freshly deposited solder on said board underside and said protruding leads so as to maintain said freshly deposited solder in molten condition; an excess solder removal station adjacent said post soldering heating station, said excess solder removal station comprising at least one gas jet disposed below the travel path of said board and adapted to direct a fluid gas stream onto the freshly deposited solder on said board underside and said protruding leads before said solder fully solidifies as joints thereon, a source of pressurized fluid, and means connecting said source and said at least one fluid jet; said excess solder removal station being adapted to relocate or remove a portion of the molten solder deposited on said board and said protruding leads before said molten solder solidifies thereon while leaving said molten solder in said apertures substantially intact; and means for transporting said circuit board in line-through said mass soldering station, and post soldering heating station and said excess sold removal station.