초록 ▼

A socket for connecting an integrated circuit package to a printed circuit board or the like wherein the connection between the circuit board and the semiconductor chip is as short as possible. This is accomplished by providing a straight line conductor between the integrated circuit package and the

A socket for connecting an integrated circuit package to a printed circuit board or the like wherein the connection between the circuit board and the semiconductor chip is as short as possible. This is accomplished by providing a straight line conductor between the integrated circuit package and the printed circuit board. In accordance with one embodiment, a contact in the form of a movable double ended sharp needle is employed to connect the lead from the package to the lead on a substrate. In order to provide the force mating the leads and the intermediate needle, external force is provided by a spring structure comprising a multi-fingered element with the tips of the fingers encapsulated in plastic or other compliant membrane separating the spring member and the leads of the package.

대표청구항 ▼

A socket for connecting a semiconductor chip carrier having resilient leads to a printed circuit board or the like comprising: (a) a housing for holding said chip carrier, said housing including, (b) a plurality of spaced-apart apertures aligned with said leads, (c) electrically conductive needles s

A socket for connecting a semiconductor chip carrier having resilient leads to a printed circuit board or the like comprising: (a) a housing for holding said chip carrier, said housing including, (b) a plurality of spaced-apart apertures aligned with said leads, (c) electrically conductive needles slidably disposed in said apertures and being freely disposed therein, and having an axial dimension greater than the axial length of said apertures, and (d) pressure means for applying a force on said leads in the direction of said needles whereby said leads force said needles into said apertures and thereby against electrical circuit paths contained on said board, said paths aligned with said apertures and having said board secured to said frame and said housing.