초록 ▼

A waferboard having at least one surface rendered water resistant and stabilized against wafer loss is disclosed. In the past heavy paper overlays have been used on panel surfaces. However, these paper overlays are specially treated non-porous paper and generally have to be specially applied by the

A waferboard having at least one surface rendered water resistant and stabilized against wafer loss is disclosed. In the past heavy paper overlays have been used on panel surfaces. However, these paper overlays are specially treated non-porous paper and generally have to be specially applied by the addition of a glue. The waferboard of the present invention is formed of wood wafers bonded together in a hot press with adhesive resin and wax, and having a layer of porous paper bonded in the hot press to at least one surface of the waferboard. In one embodiment, the contours of the wood wafers on the surface of the waferboard are transmitted through the layer of porous paper.

대표청구항 ▼

Waferboard having at least one surface rendered water resistant and stabilized against wafer loss, formed of wood wafers bonded together in a hot press with an adhesive resin and wax, and having a layer of porous paper bonded in the hot press to at least one surface of the waferboard, said paper ret

Waferboard having at least one surface rendered water resistant and stabilized against wafer loss, formed of wood wafers bonded together in a hot press with an adhesive resin and wax, and having a layer of porous paper bonded in the hot press to at least one surface of the waferboard, said paper retaining its porosity after said bonding in the hot press. In a process for manufacturing waferboard wherein wood wafers are bonded together in a hot press with an adhesive resin and wax, the improvement of imparting water resistance and stabilizing at least one surface of the waferboard against wafer loss, comprising bonding a layer of porous paper to at least one surface of the waferboard while to wood wafers are being bonded together with the hot press, said paper remaining porous after said bonding.