초록 ▼

A semiconductor element is positioned between opposing faces of two thermally and electrically conductive members. An external force is then applied to the two members to move the opposing faces of the members toward each other and against the sides of the element. While this external force is maint

A semiconductor element is positioned between opposing faces of two thermally and electrically conductive members. An external force is then applied to the two members to move the opposing faces of the members toward each other and against the sides of the element. While this external force is maintained, the members are fixed in a housing by means of bonding means, and are separated from the housing by an electrically insulating, thermally conducting material, which may itself be the bonding means. Upon removal of the external force from the members, the members are held by the bonding means and the housing in thermal and electrical contact with the semiconductor element, and the assembly has been pre-stressed. During the operation of the semiconductor element the pressure is controlled by thermally responsive elements.

대표청구항 ▼

A method for mounting a semiconductor element having opposing sides in a retaining frame to facilitate electrical connection and double-side cooling of said element, comprising: positioning said element between two electrically and thermally conductive members; applying to said members external forc

A method for mounting a semiconductor element having opposing sides in a retaining frame to facilitate electrical connection and double-side cooling of said element, comprising: positioning said element between two electrically and thermally conductive members; applying to said members external force to maintain said members in electrical and thermal contact with the opposing sides of said element; fixing said members in said retaining frame by means of bonding means, said members being electrically isolated from said retaining frame by thermally conductive insulation means; removing said external force from said members, so that said members are maintained in electrical and thermal contact with said semiconductor element by said bonding means to cooperation with said retaining frame.