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특허 상세정보

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내보내기 페이스북 공유 카카오톡 공유

Cylindrical magnetron sputtering cathode and apparatus

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) C23C-015/00   
미국특허분류(USC) 204/298 ; 204/112R
출원번호 US-0290426 (1981-08-06)
우선권정보 EP-0200753 (1980-08-08)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 42  인용 특허 : 7
초록
▼

The cylindrical magnetron sputtering cathode (10) of the present invention essentially comprises a tubular target (20) having a face (20a) of material to be sputtered, and a magnet assembly (45) disposed behind the back face of said tubular target for generating magnetic fields having flux lines which form arch portions (50,51) over the sputtering face. This magnet assembly (45) more specifically consists of a plurality of equiangularly spaced axially extending radially magnetized magnets arranged in such a manner as to form over the sputtering face (20a...

대표
청구항
▼

An improved cylindrical magnetron cathodic sputtering apparatus for coating a substrate with a material from a tubular target within an evacuated sealed enclosure, in which magnetic fields enhance the sputtering of the tubular target, said target having a sputtering face of the material to be sputtered and a back face opposed to the sputtering face, wherein the improvement comprises: a magnet assembly that is radially magnetized, disposed behind the back face of the tubular target, having a plurality of equiangularly spaced, axially extending magnets and...

이 특허에 인용된 특허 (7)

  1. Hawton ; Jr. John T. (Colorado Springs CO) Shumate William G. (Colorado Springs CO). Cylindrical magnetron sputtering source. USP1979124179351.
  2. Penfold Alan S. (Playa del Ray CA) Thornton John A. (Los Angeles CA). Electrode type glow discharge apparatus. USP1976113995187.
  3. Penfold Alan S. (Playa del Rey CA) Thornton John A. (Los Angeles CA). Electrode type glow discharge apparatus. USP1977064031424.
  4. Penfold Alan S. (Playa del Rey CA) Thornton John A. (Los Angeles CA). Electrode type glow discharge method and apparatus. USP1977064030996.
  5. McKelvey Harold E. (Plymouth MI). Magnetron cathode sputtering apparatus. USP1982104356073.
  6. Class Walter H. (Yonkers NY) Unterkofler George J. (Nanuet NY) Hurwitt Steven D. (Park Ridge NJ). Magnetron sputtering target and cathode assembly. USP1980044198283.
  7. Kuriyama Noboru (Kawasaki JPX). Sputtering device. USP1980094221652.

이 특허를 인용한 특허 피인용횟수: 42

  1. Yumshtyk, Gennady. Advanced gun barrel. USP2017019546837.
  2. Wei, Ronghua; Lee, Sabrina L.. Apparatus and method for RF plasma enhanced magnetron sputter deposition. USP2012098273222.
  3. Wei, Ronghua; Langa, Edward; Lee, Sabrina L.. Apparatus and method utilizing a double glow discharge plasma for sputter cleaning. USP2014068747631.
  4. Morgan Steven V. (253 Mark West Station Rd. Windsor CA 95492) Vanderstraeten Johan (Industriezone E.376 Laan 75-59 B-9800 Deinze BEX) Vanderstraeten Erwin (Industriezone E.376 Laan 75-59 B-9800 Deinz. Apparatus for affixing a rotating cylindrical magnetron target to a spindle. USP1997015591314.
  5. Mintz Donald M. (Sunnyvale CA). Apparatus for and the method of controlling magnetron sputter device having separate confining magnetic fields to separa. USP1986064595482.
  6. Aichert Hans (Hanau am Main DEX) Gegenwart Rainer (Rodermark DEX) Kukla Reiner (Hanau am Main DEX) Wilmes Klaus (Bad Orb DEX) Kieser Jorg (Forchheim DEX). Cathode sputtering apparatus on the magnetron principle with a hollow cathode and a cylindrical target. USP1990104966677.
  7. McFarland, Michael D.; Krishnan, Mahadevan; Wright, Jason D.; Gerhan, Andrew N.; Tang, Benjamin. Coaxial plasma arc vapor deposition apparatus and method. USP2011017867366.
  8. Chiang, Kuang-Tsan Kenneth; Wei, Ronghua. Conformal magnetron sputter deposition. USP2012108277617.
  9. Barrett, Richard L.. Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation. USP2004056736948.
  10. Rietzel,James G.; Johnson,Kevin D.. Cylindrical magnetron with self cleaning target. USP2006037014741.
  11. Hartig, Klaus; Smith, Steve E.; Madocks, John E.. Cylindrical target with oscillating magnet for magnetron sputtering. USP2011087993496.
  12. Reusser, Hans; Waber, Toni. Electron-beam device. USP2015079076633.
  13. Xu, Tianzong; Guo, George Xinsheng; Nguyen, Oanh. Inverted cylindrical magnetron (ICM) system and methods of use. USP2017059640359.
  14. Helmer John C. (Menlo Park CA) Doniger Kenneth J. (Menlo Park CA). Inverted re-entrant magnetron ion source. USP1988094774437.
  15. Navala,Sergiy Yakovlevich; Tolmachev,Yuri Nikolaevich; Ma,Dong joon; Kim,Tae wan. Magnetron cathode and magnetron sputtering apparatus comprising the same. USP2006057052583.
  16. Hubert Peter (Alzenau DEX) Kussel Barbara (Rodgau DEX) Wirz Peter (Waldernbach DEX). Magnetron cathode sputter coating apparatus. USP1989044818358.
  17. Helmer John C. (Menlo Park CA). Magnetron sputter device having planar and curved targets. USP1986084606806.
  18. Hutchinson Martin A. (Santa Clara CA). Magnetron sputter device using the same pole piece for coupling separate confining magnetic fields to separate targets s. USP1986024569746.
  19. Wei, Ronghua. Magnetron sputtering apparatus and method for depositing a coating using same. USP2009047520965.
  20. Pei, Shao-Kai. Magnetron sputtering device having rotatable substrate holder. USP2014038673123.
  21. Weaver, Scott Andrew; Carter, William Thomas; Marruso, Paul Mario. Method and apparatus for cathodic arc ion plasma deposition. USP2011027879203.
  22. Konstantin K. Tzatzov CA; Alexander S. Gorodetsky CA. Method and apparatus for magnetron sputtering. USP2002086436252.
  23. Chiang, Kuang-Tsan Kenneth; Wei, Ronghua; Langa, Edward. Method for magnetron sputter deposition. USP2010097790003.
  24. Nakahigashi Takahiro,JPX ; Kuwahara Hajime,JPX ; Fujiyama Hiroshi,JPX. Method of manufacturing a tube having a film on its inner peripheral surface and apparatus for manufacturing the same. USP1999085935391.
  25. Chiang, Kuang Tsan Kenneth; Arps, James H.; Wei, Ronghua. Nanostructured low-Cr Cu-Cr coatings for high temperature oxidation resistance. USP2009097592051.
  26. Kljuchko Gennady V. (prospekt Kurchatova ; 27 ; kv. 68 Kharkov SUX) Padalka Valentin G. (ulitsa Danilevskogo ; 10 ; kv. 122 Kharkov SUX) Sablev Leonid P. (ulitsa P. Morozova ; 3 ; kv. 3 Kharkov SUX) . Plasma arc apparatus for applying coatings by means of a consumable cathode. USP1985014492845.
  27. Madocks, John E.; Morse, Patrick Lawrence; Ngo, Phong. Rotary magnetron magnet bar and apparatus containing the same for high target utilization. USP2016079388490.
  28. Sander, Thorsten; Weidelt, Cornell; Heinrich, Hans-Juergen. Rotatable sputter target comprising an end-block with a liquid coolant supply system. USP2015069058961.
  29. Taylor Clifford L. (Nerstrand MN) Crowley Daniel T. (Owatonna MN). Rotating floating magnetron dark-space shield and cone end. USP1996105567289.
  30. Dekempeneer, Erik; De Bosscher, Wilmert; Verheyen, Pascal. Sputtering apparatus. USP2015079082595.
  31. Anderson Robert L. ; Helmer John C.. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile. USP2000026024843.
  32. Yumshtyk, Gennady; Ivanov, Dmitri. Sputtering devices and methods. USP2017029583319.
  33. Yumshtyk, Gennady; Ivanov, Dmitri. Sputtering devices and methods. USP2014068741115.
  34. Bryan William J. (Granby CT) Perrotti Patrick A. (Newington CT). Sputtering process burnable poison coating. USP1993125272735.
  35. Mayer, Raymond M.; Lu, Yiwei. Sputtering target with bonding layer of varying thickness under target material. USP2012028123919.
  36. Yumshtyk, Gennady. Sputtering targets and methods. USP2016069368330.
  37. Criss Russell C. (Pittsburgh PA) Gillery F. Howard (Allison Park PA). Stainless steel primer for sputtered films. USP1985044512863.
  38. Stowell, Michael W.. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties. USP2010117842355.
  39. Hollars, Dennis R.. Target utilization improvement for rotatable magnetrons. USP2013038398834.
  40. Mintz Donald M. (Sunnyvale CA). Targets for magnetron sputter device having separate confining magnetic fields to separate targets subject to separate d. USP1987044657654.
  41. McLeod, Paul Stephen. Trim magnets to adjust erosion rate of cylindrical sputter targets. USP2014028652310.
  42. Wei,Ronghua; Rincon,Chistopher; Arps,James. Tubular structures with coated interior surfaces. USP2008047351480.

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