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In a method for manufacturing a module for a fiber optic link, a plate-shaped transparent circuit unit is molded in advance. The circuit module is transfer molded together with an optoelectronic element connected to leads. The circuit module is clamped between a pair of rod-shaped first dies which h

In a method for manufacturing a module for a fiber optic link, a plate-shaped transparent circuit unit is molded in advance. The circuit module is transfer molded together with an optoelectronic element connected to leads. The circuit module is clamped between a pair of rod-shaped first dies which have a common central axis and one of which defines an optical path of the module, in such a manner that the optoelectronic element is located on a central axis of the circuit module. Under this condition, the circuit module is housed in a cavity defined by a pair of second dies. A light-shielding molding material is injected into the cavity for injection molding to mold a case. After the case is cured, the first and second dies are removed, and the hole of the case formed by one of the first die is closed with a cap to complete a receptacle.

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A method of manufacturing a module for a fiber optic link using a pair of first dies each having opposing end portions, said first pair of dies reciprocably and coaxially movable relative to one another, and a pair of second dies defining a cavity, said second pair of dies transversely positioned wi

A method of manufacturing a module for a fiber optic link using a pair of first dies each having opposing end portions, said first pair of dies reciprocably and coaxially movable relative to one another, and a pair of second dies defining a cavity, said second pair of dies transversely positioned with respect to said pair of first dies and reciprocably movable to clamp said first pair of dies so that said end portions are within said cavity, said method comprising the steps of: (a) transfer molding a transparent first member having a predetermined shape and an optoelectric element embedded therein, said optoelectric element being operatively coupled to one of a plurality of leads outwardly extending from said first member, (b) coaxially positioning said optoelectric element between said pair of opposing first dies, (c) clamping said first member between said end portions of said pair of first dies after said optoelectric element is coaxially positioned according to step (b), (d) positioning said first member clamped according to step (c) in said cavity and injecting a light-shielding molding material into said cavity, (e) removing said first and second dies, one of said first dies after removal defining an optical path in said module, said optical path being coaxially aligned with said optoelectric element, the other of said first dies after removal defining an aperture in said module, said aperture coaxially opposing said optical path, and (f) covering said aperture with a light-shielding cap, whereby said optoelectric element is coaxially positioned with respect to said optical path and whereby simultaneous optical alignment and molding of said module is effected by virtue of said clamping relationship of said first member between said pair of first dies.