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특허 상세정보

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Magnetically enhanced plasma process and apparatus

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-021/306    B44C-001/22    C03C-015/00    C03C-025/06   
미국특허분류(USC) 156/643 ; 156/345 ; 204/298
출원번호 US-0342976 (1982-01-26)
발명자 / 주소
  • Class Walter H. (Yonkers NY) Hurwitt Steven D. (Park Ridge NJ) Hill Michael L. (New York NY) Hutt Marvin K. (Oakland NJ)
출원인 / 주소
  • Materials Research Corporation (Orangeburg NY 02)
인용정보 피인용 횟수 : 54  인용 특허 : 5
초록

Method and apparatus are disclosed for plasma treating a substrate in a hermetic chamber with a magnetic field having lines of force which leave a support, extend across the surface of the substrate and re-enter the support to enclose the substrate exposed surface in a magnetic electron-trapping field. The voltage applied to the substrate support is adjusted to produce a dense glow discharge closely adjacent the substrate surface for reacting chemically therewith.

대표
청구항
▼

A method of plasma processing which includes the steps of placing at least one substrate on a substrate support electrode positioned in a hermetic chamber, evacuating the chamber, introducing a reactant gas into the chamber, and applying a voltage to the substrate support, wherein the improvement comprises: providing a magnetic field having lines of force which leave the support electrode, extend across the surface of the substrate exposed to the coating source, and re-enter the support to enclose said exposed surface in a magnetic electron-trapping fiel...

인용문헌 (5)

  1. Chambers Douglas L. (Nashville TN) Wan Chong T. Wan (Nashville TN), Cathode for sputtering.
  2. Penfold Alan S. (Playa del Rey CA) Thornton John A. (Los Angeles CA), Glow discharge method and apparatus.
  3. Maydan Dan (Short Hills NJ), High capacity etching apparatus and method.
  4. Thornton ; John A., Method and apparatus for sputter cleaning and bias sputtering.
  5. Kuriyama Noboru (Kawasaki JPX), Sputtering device.

이 특허를 인용한 특허 (54)

  1. Gillery F. Howard (Allison Park PA) Criss Russell C. (Pittsburgh PA), Anode for magnetic sputtering apparatus.
  2. Johnson Randall E. (Carrollton TX) Spencer John E. (Plano TX), Anodized aluminum substrate for plasma etch reactor.
  3. Yan,Hongwen; Ji,Brian L.; Panda,Siddhartha; Wise,Richard; Chen,Bomy A., Apparatus and method for shielding a wafer from charged particles during plasma etching.
  4. Felts, John T.; Fisk, Thomas E.; Abrams, Robert S.; Ferguson, John; Freedman, Jonathan R.; Pangborn, Robert J.; Sagona, Peter J., Apparatus and method for transporting a vessel to and from a PECVD processing station.
  5. Davis Cecil J. (Greenville TX) Johnson Randall E. (Carrollton TX) Spencer John E. (Plano TX), Automated plasma reactor.
  6. Davis Cecil J. (Greenville TX) Spencer John E. (Plano TX) Johnson Randall E. (Carrollton TX) Jucha Rhett B. (Celeste TX) Brown Frederick W. (Tarrant TX) Kohan Stanford P. (Garland TX), Automated single slice cassette load lock plasma reactor.
  7. Davis Cecil J. (Greenville TX) Spencer John E. (Plano TX) Hockersmith Dan T. (Garland TX) Hildenbrand Randall C. (Richardson TX) Brown Frederick W. (Colleyville TX) Kohan Stanford P. (Garland TX), Automated single slice powered load lock plasma reactor.
  8. Hong Liubo ; Wang Hougong ; Yao Gongda ; Xu Zheng, Central coil design for ionized metal plasma deposition.
  9. Fisk, Thomas E., Coating inspection method.
  10. Jurgensen, Charles W.; Johnson, Gregory A.; Taravade, Kunal N., Confinement device for use in dry etching of substrate surface and method of dry etching a wafer surface.
  11. Weikart, Christopher; Clark, Becky L.; Stevenson, Adam; Abrams, Robert S.; Belfance, John, Controlling the uniformity of PECVD deposition.
  12. Weikart, Christopher; Clark, Becky L.; Stevenson, Adam; Abrams, Robert S.; Belfance, John; Jones, Joseph A.; Fisk, Thomas E., Controlling the uniformity of PECVD deposition on medical syringes, cartridges, and the like.
  13. Fournier Paul R. (980 Miramonte Dr. ; #4 Santa Barbara CA 93109), Cross-field diode sputtering target assembly.
  14. Felts, John T.; Fisk, Thomas E.; Abrams, Robert S.; Ferguson, John; Freedman, Jonathan R.; Pangborn, Robert J.; Sagona, Peter J., Cyclic olefin polymer vessels and vessel coating methods.
  15. Kinoshita Haruhisa,JPX ; Matsumoto Osamu,JPX ; Sakuma Harunobu,JPX, Dry process system.
  16. Sharp-Geisler Bradley A. (San Jose CA), Etching plasma generator diffusor and cap.
  17. Gopalraja, Praburam; Xu, Zheng; Rosenstein, Michael; Forster, John C., Feedthrough overlap coil.
  18. Liubo Hong, Hybrid coil design for ionized deposition.
  19. Johnson Randall E. (Carrollton TX) Peters Louis E. (Dallas TX) Simmons Lowell E. (Garland TX), Low particulate vacuum chamber input/output valve.
  20. Hsu Jon Shaochung,TWX, Magnetic field generator, coating method and apparatus including same, and devices having coating aligned therewith.
  21. Wolfe John C. (Houston TX) El-Masry Ahmed M. (Houston TX) Fong Fu-On (Houston TX), Magnetically enhanced RIE process and apparatus.
  22. Nozawa Toshihisa,JPX ; Horioka Keiji,JPX ; Hasegawa Isahiro,JPX, Magnetron plasma process apparatus.
  23. Spencer John E. (Plano TX) Carter Duane (Plano TX) Autery Dave (Richardson TX), Magnetron plasma reactor.
  24. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Cheng Mei (San Jose CA) Cheng David (San Jose CA), Magnetron-enhanced plasma etching process.
  25. Fisk, Thomas E.; Sagona, Peter J.; Jones, Joseph A., Method and apparatus for detecting rapid barrier coating integrity characteristics.
  26. Wagner Israel (Monsey NY) Hurwitt Steven D. (Park Ridge NJ), Method and apparatus for improving the uniformity ion bombardment in a magnetron sputtering system.
  27. Tanaka Yoichiro ; Hong Liubo ; Wada Yuichi,JPX, Method and apparatus for producing a uniform density plasma above a substrate.
  28. Holmann Ralf ; Xu Zheng, Method and apparatus for reducing plasma nonuniformity across the surface of a substrate in apparatus for producing an ionized metal plasma.
  29. Hartig Klaus (Ronneburg DEX) Dietrich Anton (Rodenbach DEX), Method and equipment for coating substrates by means of a plasma discharge using a system of magnets to confine the plas.
  30. Kadlec, Stanislav; Kügler, Eduard; Haag, Walter, Method for manufacturing sputter-coated substrates, magnetron source and sputtering chamber with such source.
  31. Russell, Derrek Andrew, Method, apparatus and magnet assembly for enhancing and localizing a capacitively coupled plasma.
  32. Russell,Derrek Andrew, Method, apparatus and magnet assembly for enhancing and localizing a capacitively coupled plasma.
  33. Latz Rudolf (Frankfurt am Main DEX) Scherer Michael (Rodenbach DEX) Geisler Michael (Wchtersbach DEX) Jung Michael (Kahl DEX), Microwave cathode sputtering arrangement.
  34. Ding, Peijun, Overlap design of one-turn coil.
  35. Felts, John T.; Fisk, Thomas E.; Kinney, Shawn; Weikart, Christopher; Hunt, Benjamin; Raiche, Adrian; Fitzpatrick, Brian; Sagona, Peter J.; Stevenson, Adam, PECVD coating methods for capped syringes, cartridges and other articles.
  36. Jones, Joseph A.; Felts, John T.; Gresham, James Troy; Lilly, Brian Russell; Fisk, Thomas E., PECVD lubricity vessel coating, coating process and apparatus providing different power levels in two phases.
  37. Felts, John T.; Fisk, Thomas E.; Abrams, Robert S.; Ferguson, John; Freedman, Jonathan R.; Pangborn, Robert J.; Sagona, Peter J.; Weikart, Christopher, Passivation, pH protective or lubricity coating for pharmaceutical package, coating process and apparatus.
  38. Hockersmith Dan T. (Garland TX) Gilbert Joe W. (Leonard TX), Plasma etch movable substrate.
  39. Sato Masaaki (Kanagawa JPX) Arita Yoshinobu (Kanagawa JPX), Plasma etching apparatus.
  40. Hershkowitz Noah (Madison WI) Cho Moo-Hyun (Madison WI), Plasma etching apparatus with surface magnetic fields.
  41. Jones, Joseph A.; Weikart, Christopher; Martin, Steven J., Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus.
  42. Spencer John E. (Plano TX) Johnson Randall E. (Carrollton TX) Hockersmith Dan T. (Garland TX) Hildenbrand Randall C. (Richardson TX) Jones John I. (Plano TX) Jaspersen William S. (Dallas TX), Powered load lock electrode/substrate assembly including robot arm, optimized for plasma process uniformity and rate.
  43. Koshiba Mitsunobu (Kanagawa JPX) Yamada Keiichi (Kanagawa JPX) Harita Yoshiyuki (Kanagawa JPX) Kawamura Shin\ichi (Kanagawa JPX) Furuto Yuuji (Kanagawa JPX), Reactive ion etching apparatus.
  44. Felts, John T.; Fisk, Thomas E.; Abrams, Robert S.; Ferguson, John; Freedman, Jonathan R.; Pangborn, Robert J.; Sagona, Peter; Weikart, Christopher; Israelachvili, Jacob, Saccharide protective coating for pharmaceutical package.
  45. Class Walter H. (Yonkers NY) Hurwitt Steven D. (Park Ridge NJ) I Lin (Piermont NY), Shaped field magnetron electrode.
  46. Kiyota, Hideharu; Horiuchi, Mitsuaki, Sputtering apparatus.
  47. Setoyama Eiji (Hitachi JPX) Arimatsu Keiji (Hitachi JPX) Ohshita Youichi (Hitachi JPX), Sputtering apparatus.
  48. Gopalraja Praburam ; Xu Zheng ; Hofmann Ralf, Sputtering method and apparatus with small diameter RF coil.
  49. Fu, Jianming, Transverse magnetic field for ionized sputter deposition.
  50. Weikart, Christopher; Clark, Becky L.; Stevenson, Adam; Felts, John T., Trilayer coated pharmaceutical packaging.
  51. Weikart, Christopher; Clark, Becky L.; Stevenson, Adam; Felts, John T., Trilayer coated pharmaceutical packaging.
  52. Weikart, Christopher; Clark, Becky L.; Stevenson, Adam; Felts, John T., Trilayer coated pharmaceutical packaging with low oxygen transmission rate.
  53. Liu, Alan B.; Lavitsky, Ilya; Rosenstein, Michael, Unitary removable shield assembly.
  54. Felts, John T.; Fisk, Thomas E.; Abrams, Robert; Ferguson, John; Freedman, Jonathan; Pangborn, Robert; Sagona, Peter, Vessels, contact surfaces, and coating and inspection apparatus and methods.

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