초록 ▼

A rotatable magnetron cathode sputtering apparatus for operation in an evacuable chamber for sputter coating substantially planar substrates as they move through said chamber. The cathode comprises an elongated, cylindrical tubular member having a layer of the coating material to be sputtered applie

A rotatable magnetron cathode sputtering apparatus for operation in an evacuable chamber for sputter coating substantially planar substrates as they move through said chamber. The cathode comprises an elongated, cylindrical tubular member having a layer of the coating material to be sputtered applied to the outer surface thereof. Magnetic means are mounted within the tubular member and includes at least one row of permanent magnets extending lengthwise thereof. The tubular member is horizontally mounted in the coating chamber for rotation about its longitudinal axis either in a step-by-step fashion or continuously, relative to the magnets to bring different portions of the coating material into sputtering position opposite said magnets and within the sputter coating zone.

대표청구항 ▼

The method of sputtering thin films of a selected coating material upon substantially planar substrates, comprising providing an elongated, cylindrical tubular member having a layer of the target material to be sputtered applied to the outer surface thereof, providing within said tubular member a ma

The method of sputtering thin films of a selected coating material upon substantially planar substrates, comprising providing an elongated, cylindrical tubular member having a layer of the target material to be sputtered applied to the outer surface thereof, providing within said tubular member a magnetic field defining the length and width of the erosion zone on the target material, rotating said tubular member continuously about its longitudinal axis during the sputtering operation to bring different portions of the target material within the erosion zone for sputtering, and simultaneously moving the planar substrates past said erosion zone to receive the material being sputtered.