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Anti-static packages and packaging material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65D-073/02
  • B65D-085/42
출원번호 US-0439857 (1982-11-08)
발명자 / 주소
  • Petcavich Robert J. (2954 Mission Blvd. #4 San Diego CA 92101)
인용정보 피인용 횟수 : 30  인용 특허 : 6

초록

An anti-static package composed of a multiply flexible film. The inner ply is an anti-static material and the outer ply is an electrically insulating material. A conductive metallic ply is sandwiched between the inner and outer ply. The conductive material is sputtered onto one of the two plies and

대표청구항

A package adapted to receive and protect an electronic component, the walls of the package formed of a flexible sheet material comprising: a first ply of an electrically insulating material, a second ply of a conductive material, and a third ply of an anti-static material, said second ply being embe

이 특허에 인용된 특허 (6)

  1. Ohlbach Ralph C. (417 Green Park Ct. Deerfield IL 60015), Assembly protecting and inventorying printed circuit boards.
  2. Maylandt Helmut (Sachsenweg 6 7310 Plochingen DEX), Electrically conductive cover sheath for dielectric record discs and the like.
  3. Yenni ; Jr. Donald M. (Stillwater MN) Knutsen Steven W. (New Brighton MN) Downing Edward J. (St. Paul MN), Material for forming envelopes used to protect electronic components.
  4. Hardy Charles T. (Alsip IL), Means for containing electrostatic sensitive electronic components.
  5. Kohayakawa Ken (Shizuoka JPX) Ohba Hisao (Shizuoka JPX) Sano Atuhiro (Shizuoka JPX), Method of stacking metal sheet materials.
  6. Ohlbach Ralph C. (417 Green Park Ct. Deerfield IL 60015), Shipping container for printed circuit boards and other items.

이 특허를 인용한 특허 (30)

  1. Bardford Judson A. (Holland MI), Anti-static coated paperboard or similar rigid material.
  2. James Patrick Barnhouse ; Simon Hsiao-Pao Yu, Antistatic plastic materials containing epihalohydrin polymers.
  3. Babinec Michael A. (Midland MI) Mott Charles L. (Midland MI) Burdeaux David C. (Midland MI), Antistatic sheet material, package and method of making.
  4. Ohlbach Ralph C. (Deerefield IL), Conductive container.
  5. Reidinger Deborah L. (El Toro CA) Freitas Michael S. (Irvine CA), Electromagnetically and electrostatically protected see-through packaging unit for printed circuit boards.
  6. Russell Robert J. ; Romeri Robert W., Electrostatic discharge (ESD) protection system for shielding a printed circuit assembly during manufacture.
  7. Beamer, Brent, Electrostatic shielding, low charging-retaining moisture barrier film.
  8. Neal Robert A. (East Rd. Wales ME 04280) Ray Robert (Lake Shore Dr. Auburn ME 04210), Flexible envelope for electronic component packaging.
  9. Lecocq, Jean-Pierre; Chevalier, Nicolas, Flexible storage device comprising a flexible container and an inner liner.
  10. Almarales, Rodrigo, Foot sleeve for stretch device.
  11. White Creighton A. (Valencia CA), Laminated sheet material for packaging electronic components.
  12. Tow, Poh-Siew, Method for using a moisture-protective container.
  13. Bradford Judson A. (Holland MI), Multiple-ply anti-static paperboard.
  14. Kinzelmann, Hans-Georg; Gentschev, Pavel, One-component laminating adhesive having silane cross-linking.
  15. Cohen Philip S. (Cincinnati OH) Schnittger ; Jr. Robert E. (West Chester OH), Packaging material and container having interlaminate electrostatic shield and method of making same.
  16. Dinter Peter,DEX ; Nowotnick Joachim,DEX, Plastic packaging container with improved ability for electrostatic charge derivation.
  17. Neal Robert (Sebattus ME) Ray Robert (Auburn ME), Printed antistatic plastic bag.
  18. Armington Steven E. (Kirtland OH) Halperin Stephen A. (Elmhurst IL) Pickett Gordon E. (Reynoldsburg OH) Metz Barbara A. (Baltimore OH), Processes for the production of antistatic or static dissipative paper, and the paper products thus produced, and appara.
  19. Kasper Kevin (Elm Grove WI) Nigro Paul (Norridge IL), RFI shielded, multiple part container and components thereof.
  20. Val Christian (St. Remy-les Chevreuses FRX) Pinel Joseph (Villefranche-de-Lauragais FRX) Gibod Yves B. (St. Cyr-L\Ecole FRX), Radiation-hardened casing for an electronic component.
  21. Kitamura Wahei,JPX ; Murakami Gen,JPX ; Nishi Kunihiko,JPX, Resist pattern forming method using anti-reflective layer resist pattern formed and method of etching using resist patte.
  22. Ray Robert (R.F.D. 1 ; Wales Rd. Auburn ME) Neal Robert A. (R.F.D. 1 ; Wales Rd. Sabattus ME 04280) Jaran John R. (Waterbury CT) Parker Tim (Southbury CT), Static dissipative elastomeric coating for electronic packaging components.
  23. Nordale John E. (Maplewood MN), Static dissipative tape.
  24. Kitamura Wahei (Kodaira JPX) Murakami Gen (Machida JPX) Nishi Kunihiko (Kokubunji JPX), Surface package type semiconductor package.
  25. Kitamura Wahei (Kodaira JPX) Murakami Gen (Machida JPX) Nishi Kunihiko (Kokubunji JPX), Surface package type semiconductor package and method of producing semiconductor memory.
  26. Kitamura Wahei,JPX ; Murakami Gen,JPX ; Nishi Kunihiko,JPX, Surface package type semiconductor package and method of producing semiconductor memory.
  27. Kitamura Wahei,JPX ; Murakami Gen,JPX ; Nishi Kunihiko,JPX, Surface package type semiconductor package and method of producing semiconductor memory.
  28. Kitamura,Wahei; Murakami,Gen; Nishi,Kunihiko, Surface package type semiconductor package and method of producing semiconductor memory.
  29. Wahei Kitamura JP; Gen Murakami JP; Kunihiko Nishi JP, Surface package type semiconductor package and method of producing semiconductor memory.
  30. McNulty James E. (East Rd. Portland ME) Neal Robert A. (East Rd. Wales ME 04280), Transparent article.
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