초록 ▼

A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface follo

A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

대표청구항 ▼

An article of manufacture comprising: (a) a substrate having a surface of a rubber-modified epoxy resin, said surface having any weak boundary layer thereon essentially removed; (b) a thin adherent base metal film selected from the group consisting of Cr, Ni, Ni-V alloy, Pd, Pt, or Ti on said surfac

An article of manufacture comprising: (a) a substrate having a surface of a rubber-modified epoxy resin, said surface having any weak boundary layer thereon essentially removed; (b) a thin adherent base metal film selected from the group consisting of Cr, Ni, Ni-V alloy, Pd, Pt, or Ti on said surface, said metal having been vacuum deposited on the surface; and (c) a thicker primary metal deposited over the base metal film said primary metal having a peel strength of at least 8 pounds/inch.