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Heat-absorbing heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/42
출원번호 US-0292639 (1981-08-13)
발명자 / 주소
  • Hayes Claude Q. C. (7980 Linda Vista Rd. #49 San Diego CA 92111)
인용정보 피인용 횟수 : 53  인용 특허 : 8

초록

An improved heat sink device for transferring heat from a heat generator to lower-temperature surroundings comprising a device-embedded compound that absorbs heat, delaying temperature rise in the heat generator, at a specific temperature by melting or entering into an endothermic chemical change or

대표청구항

An improved heat sink device for transferring heat from a heat generator to lower-temperature surroundings by radiation, covection, and conduction, wherein the improvement comprises: a device-embedded compound that absorbs heat at a specific temperature, delaying temperature rise in the heat generat

이 특허에 인용된 특허 (8)

  1. Alspaugh Thomas R. (4707 Otomi Ave. San Diego CA 92117), Energy storage system and method.
  2. Best John S. (Freeport MI) McMillan William J. (Midland MI), Heat or thermal energy storage structure.
  3. Ruka Roswell J. (Pittsburgh PA) Charles Robert G. (Allison Park PA), Heat sink.
  4. Weidenbenner William A. (Dallas TX) Steltz Irvin J. (North Wales PA), Heat transfer composition and method of making.
  5. Whitfield Fred J. (1405 S. Village Way Santa Ana CA 92705) Doyel ; Jr. Arthur T. (4402 Casa Oro Yorba Linda CA 92686), Methods and materials for conducting heat from electronic components and the like.
  6. Telkes Maria (Killeen TX), Phase change thermal storage materials with crust forming stabilizers.
  7. Balderes Demetrios (Wappingers Falls NY) Lynch John R. (Hopewell Junction NY) Yacavonis Robert A. (Poughkeepsie NY), Semiconductor package with improved conduction cooling structure.
  8. Kesselring Fritz (Schiedhaldenstr. 55 8700 Kusnacht CHX) Schilling Siegfried (Sunnebuelstr. 41 8604 Volketswil CHX), Storage element for a sorption heat storage system.

이 특허를 인용한 특허 (53)

  1. Patry Jean,FRX ; Reboul Claude,FRX, Accumulator-exchanger device.
  2. Kamath,Vinod; Loebach,Beth Frayne; Makley,Albert Vincent, Acoustic and thermal energy management system.
  3. Rhodes, Michael S.; Izrailev, Leonid; Tuerack, Jason; Rhodes, Philip S, Activated flame retardants and their applications.
  4. Worley,James Brice; Hartmann,Mark Henry; Lekan,Alan John; Magill,Monte Christopher; Henshaw,Michael Alan; Pushaw,Robert John, Coated articles having enhanced reversible thermal properties and exhibiting improved flexibility, softness, air permeability, or water vapor transport properties.
  5. Weber, Richard M.; Rummel, Kerrin A., Construction of phase change material embedded electronic circuit boards and electronic circuit board assemblies using porous and fibrous media.
  6. Kauppila, Richard W.; Kauppila, Raymond W., Cooling arrangement for conveyors and other applications.
  7. Olzak Richard A. ; Kersten Gary, Data and cockpit voice recorder enclosure.
  8. Deeney Jeffrey L., Electrically conductive thermal interface.
  9. Wold, Claude Hayes, Endotherm systems and methods utilizing carbohydrate in non-oxidizing environment.
  10. McLellan Neil (Garland TX) Strittmatter Mike (Carrollton TX) Hundt Joseph P. (Corinth TX) Sells Christopher M. (Carrollton TX) Scherpenberg Francis A. (Carrollton TX), Enhanced low profile sockets and module systems.
  11. Hayes, Claude Q. C., Heat absorbing temperature control devices that include hydroxide.
  12. Groenewegen Johannes B. (Kirkland WA), Heat shielded memory unit for an aircraft flight data recorder.
  13. Pause Barbara, Interactive thermal insulating system having a layer treated with a coating of energy absorbing phase change material adjacent a layer of fibers containing energy absorbing phase change material.
  14. Pause Barbara, Interactive thermal insulating system having a layer treated with a coating of energy absorbing phase change material adjacent a layer of fibers containing energy absorbing phase change material.
  15. Brown Robert C., Latent heat-ballasted gasifier.
  16. Hyde, Roderick A.; Ishikawa, Muriel Y.; Kare, Jordin T.; Tuckerman, David B.; Wood, Jr., Lowell L.; Wood, Victoria Y. H., Maintaining insulators in power transmission systems.
  17. Chiu Chia-Pin ; Sharaf Nadir ; Solbrekken Gary ; Cooks Correy D., Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments.
  18. Haws,James L.; Short, Jr.,Byron Elliott, Method and apparatus for cooling with a phase change material and heat pipes.
  19. Haws,James L.; Short, Jr.,Byron Elliott, Method and apparatus for cooling with a phase change material and heat pipes.
  20. Chiu Chia-Pin ; Sharaf Nadir ; Solbrekken Gary ; Cooks Correy D., Method for an integrated circuit thermal grease mesh structure.
  21. Ren Jane ; Osuch Christopher E. ; Olzak Richard A. ; Plyley Amanda L., Method for dissipating heat away from a heat sensitive device using bicarbonate compositions.
  22. Jane Ren ; Christopher E. Osuch ; Richard A. Olzak, Method for heat absorption using polyoxymethylene polymer compositions.
  23. Natori Katsuhide (Yokohama JPX) Watanabe Isao (Sagamihara JPX) Katsuyama Koji (Yokohama JPX) Kawamura Isao (Yokohama JPX) Yamamoto Haruhiko (Yokohama JPX) Nagai Takeshi (Yokohama JPX), Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling uni.
  24. McLellan Neil ; Strittmatter Mike, Method of providing thermal protection of electrical elements.
  25. Martinez-Soto Alfredo (Rincon Colonial MXX) Loredo-Murphy Jorge (Monterrey MXX) Becerril-Ortega Benito (Puesta Del Sol MXX), Molding cooling system for the manufacture of glass articles or similar materials.
  26. Lee, Howard W. H., Multi-junction solar cell devices.
  27. Brown, Albert S., Multi-terminal photovoltaic module including independent cells and related system.
  28. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  29. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  30. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  31. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  32. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  33. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  34. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  35. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  36. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  37. Dahlstrom, Mattias E., Phase changing on-chip thermal heat sink.
  38. Hyde, Roderick A.; Gates, William; Kare, Jordin T.; Myhrvold, Nathan P.; Tegreene, Clarence T.; Tuckerman, David B.; Wood, Jr., Lowell L., Smart link coupled to power line.
  39. Hyde, Roderick A.; Gates, William; Kare, Jordin T.; Myhrvold, Nathan P.; Tegreene, Clarence T.; Tuckerman, David B.; Wood, Jr., Lowell L., Smart link coupled to power line.
  40. Hyde, Roderick A.; Gates, William; Kare, Jordin T.; Myhrvold, Nathan P.; Tegreene, Clarence T.; Tuckerman, David B.; Wood, Jr., Lowell L., Smart link coupled to power line.
  41. Hyde, Roderick A.; Gates, William; Kare, Jordin T.; Myhrvold, Nathan P.; Tegreene, Clarence T.; Tuckerman, David B.; Wood, Jr., Lowell L., Smart link coupled to power line.
  42. Maxik, Fredric S.; Henderson, David; Bastien, Valerie, System for dissipating heat energy.
  43. Miller, David Lowell; Kersten, Gary; Frost, Wendell A., Systems and methods for a protective casing.
  44. Hyde, Roderick A.; Ishikawa, Muriel Y.; Kare, Jordin T.; Tuckerman, David B.; Wood, Jr., Lowell L.; Wood, Victoria Y. H., Systems and methods for assessing standoff capabilities of in-service power line insulators.
  45. Hyde, Roderick A.; Ishikawa, Muriel Y.; Kare, Jordin T.; Tuckerman, David B.; Wood, Jr., Lowell L.; Wood, Victoria Y. H., Systems and methods for assessing standoff capabilities of in-service power line insulators.
  46. Hyde, Roderick A.; Wood, Jr., Lowell L., Systems and methods for testing the standoff capability of an overhead power transmission line.
  47. Farris, III, Chester A.; Lee, Howard W. H.; Wieting, Robert, Tandem photovoltaic cell and method using three glass substrate configuration.
  48. Solbrekken, Gary L.; Simmons, Craig B.; Chiu, Chia-Pin, Thermal interface material on a mesh carrier.
  49. McLellan Neil ; Strittmatter Mike, Thermal protection of electrical elements systems.
  50. Hayes Claude Q. C., Thermal storage and transfer device.
  51. Hyde, Roderick A.; Ishikawa, Muriel Y.; Kare, Jordin T.; Wood, Jr., Lowell L.; Wood, Victoria Y. H., Use pairs of transformers to increase transmission line voltage.
  52. Hyde, Roderick A.; Ishikawa, Muriel Y.; Kare, Jordin T.; Wood, Jr., Lowell L.; Wood, Victoria Y. H., Use pairs of transformers to increase transmission line voltage.
  53. Miller, David Lowell; Kersten, Gary; Farraj, Karim, Wireless crash survivable memory unit.
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