초록 ▼

The cooling of electronic modules on a circuit board is improved by the use of heat sinks comprising a plurality of longitudinal fins projecting from the modules. Individual tubes communicating with an air plenum fit around and part way along each heat sink. Air drawn from or forced into the plenum

The cooling of electronic modules on a circuit board is improved by the use of heat sinks comprising a plurality of longitudinal fins projecting from the modules. Individual tubes communicating with an air plenum fit around and part way along each heat sink. Air drawn from or forced into the plenum causes air flow within the tubes and along the fins to cool them and the modules to which they are attached.

대표청구항 ▼

In an assembly comprising a base, a circuit board mounted thereon, and a plurality of heat-generating electronic modules mounted on a side of the circuit board, an improved means for cooling the modules, comprising (a) a plurality of heat conductive heat sinks each comprising a plurality of fins pro

In an assembly comprising a base, a circuit board mounted thereon, and a plurality of heat-generating electronic modules mounted on a side of the circuit board, an improved means for cooling the modules, comprising (a) a plurality of heat conductive heat sinks each comprising a plurality of fins projecting from the circuit board, each heat sink attached in intimate thermal contact at one end to an electronic module; (b) an air plenum mounted on the base having an air guiding side in facing, spaced apart relation with the side of the circuit board on which the heat sinks are mounted, said air guiding side including a plurality of tube sections communicating with the plenum\s interior, each extending toward and partially enclosing a heat sink, the exterior of each tube section being substantially sealed to the air guiding side; and (c) means for creating an air pressure in the plenum different from the ambient.