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Method of inspecting microscopic surface defects 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/00
출원번호 US-0347248 (1982-02-09)
우선권정보 JP-0017547 (1981-02-10)
발명자 / 주소
  • Yamaguchi Kazuo (Sagamihara JPX) Kuni Asahiro (Nakamachi JPX) Akiyama Nobuyuki (Yokohama JPX) Endo Juro (Kumagaya JPX)
출원인 / 주소
  • Hitachi Metals, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 72  인용 특허 : 0

초록 ▼

A method is provided for inspecting defects in the surface of an object to be inspected, wherein oblique lighting and perpendicular lighting are alternately applied to a location where a defect or a foreign substance possibly exists. Brightness detected in the location under the application of obliq

대표청구항 ▼

A method of inspecting defects in the surface of an object to be inspected, comprising: alternately applying oblique lighting and perpendicular lighting to a location on the surface of the object where a defect or a foreign substance possibly exists; sensing reflected brightness from said surface of

이 특허를 인용한 특허 (72)

  1. Sato, Tatsuya; Kato, Yuichiro; Mitomo, Kenji, Apparatus and method for inspecting surface of semiconductor wafer or the like.
    상세보기
  2. Hine Roger G., Apparatus and methods for viewing identification marks on semiconductor wafers.
    상세보기
  3. Max, Erland; Larsson, Peter, Arrangement and method for measuring surface irregularities.
    상세보기
  4. Clark ; Jr. John C. ; Gillis Earle W. ; Majka Christopher J. ; Seward Matthew F. ; Westgate Michael M., Automated inspection system for metallic surfaces.
    상세보기
  5. Chen Ming Chun ; Steffan Paul J., Automatic defect classification (ADC) reclassification engine.
    상세보기
  6. Gambino,Jeffrey P.; Stamper,Anthony K.; Wistrom,Richard E., Detection of hardmask removal using a selective etch.
    상세보기
  7. Grimme, Ralf; Klumpp, Bernhard; Hoffmann, Michael; Smith, John David, Device and method for controlling the surface of an object.
    상세보기
  8. Leonard,Robert Tyler; Jenny,Jason Ronald, Double side polished wafer scratch inspection tool.
    상세보기
  9. Adler, Avraham; Ben Shlomo, Moshe, Illumination for inspecting surfaces of articles.
    상세보기
  10. Avraham Adler IL; Moshe Ben Shlomo IL, Illumination for inspecting surfaces of articles.
    상세보기
  11. Katzir, Yigal; Teichman, Eyal; Wechsler, Idit; Negry, Shabtai; Gross, Avraham; Arnon, Oded, Illuminator for inspecting substantially flat surfaces.
    상세보기
  12. Katzir,Yigal; Teichman,Eyal; Wechsler,Idit; Negry,Shabtai; Gross,Avraham; Arnon,Oded, Illuminator for inspecting substantially flat surfaces.
    상세보기
  13. Taguchi, Junichi; Sugimoto, Aritoshi; Ikota, Masami; Inoue, Yuko; Watanabe, Tetsuya; Shinke, Wakana, Inspecting method and apparatus for repeated micro-miniature patterns.
    상세보기
  14. Taguchi, Junichi; Sugimoto, Aritoshi; Ikoto, Masami; Inoue, Yuko; Watanabe, Tetsuya; Shinke, Wakana, Inspecting method and apparatus for repeated micro-miniature patterns.
    상세보기
  15. Miyazaki Yoko,JPX ; Mugibayashi Toshiaki,JPX, Inspection apparatus for foreign matter and pattern defect.
    상세보기
  16. Yoko Miyazaki JP; Toshiaki Mugibayashi JP, Inspection apparatus for foreign matter and pattern defect.
    상세보기
  17. Ishikawa Seiji,JPX ; Sakata Masao,JPX ; Nakazato Jun,JPX ; Shimoyashiro Sadao,JPX ; Nagatomo Hiroto,JPX ; Taniguchi Yuzo,JPX ; Satou Osamu,JPX ; Okabe Tsutomu,JPX ; Sakamoto Yuzaburo,JPX ; Muramatsu , Inspection data analyzing system.
    상세보기
  18. Ishikawa, Seiji; Sakata, Masao; Nakazato, Jun; Shimoyashiro, Sadao; Nagatomo, Hiroto; Taniguchi, Yuzo; Satou, Osamu; Okabe, Tsutomu; Sakamoto, Yuzaburo; Muramatsu, Kimio; Matsuoka, Kazuhiko; Hashimot, Inspection data analyzing system.
    상세보기
  19. Ishikawa, Seiji; Sakata, Masao; Nakazato, Jun; Shimoyashiro, Sadao; Nagatomo, Hiroto; Taniguchi, Yuzo; Satou, Osamu; Okabe, Tsutomu; Sakamoto, Yuzaburo; Muramatsu, Kimio; Matsuoka, Kazuhiko; Hashimot, Inspection data analyzing system.
    상세보기
  20. Seiji Ishikawa JP; Masao Sakata JP; Jun Nakazato JP; Sadao Shimoyashiro JP; Hiroto Nagatomo JP; Yuzo Taniguchi JP; Osamu Satou JP; Tsutomu Okabe JP; Yuzaburo Sakamoto JP; Kimio Muramatsu JP, Inspection data analyzing system.
    상세보기
  21. Jeon,Jae Young, Liquid crystal display device.
    상세보기
  22. Hunter, Reginald, Method and apparatus for embedded substrate and system status monitoring.
    상세보기
  23. Hunter, Reginald, Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques.
    상세보기
  24. Suzuki, Etsuji; Uno, Shinichi; Chiyoda, Kiyomu; Douji, Ryuhachirou, Method and apparatus for examining printed circuit board provided with miniaturized electronic parts.
    상세보기
  25. Chadwick Curt H. (Los Gatos CA) Sholes Robert R. (Ben Lomond CA) Greene John D. (Santa Cruz CA) Tucker ; III Francis D. (Menlo Park CA) Fein Michael E. (Mountain View CA) Jann P. C. (Mountain View CA, Method and apparatus for optical inspection of substrates.
    상세보기
  26. Curt H. Chadwick ; Robert R. Sholes ; John D. Greene ; Francis D. Tucker, III ; Michael E. Fein ; P. C. Jann ; David J. Harvey ; William Bell, Method and apparatus for optical inspection of substrates.
    상세보기
  27. Batson, Don T.; Hunter, Reginald, Method and apparatus for substrate imaging.
    상세보기
  28. Hunter, Reginald, Method and apparatus for substrate surface inspection using spectral profiling techniques.
    상세보기
  29. Hunter, Reginald, Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques.
    상세보기
  30. Hunter,Reginald, Method and apparatus to provide for automated process verification and hierarchical substrate examination.
    상세보기
  31. Gunnar Bostrom SE; Hans Ahlen SE; Mattias Johannesson SE; Simon Sandgren SE, Method and device for inspecting objects.
    상세보기
  32. Jun, Chung-sam; Chon, Sang-mun; Choi, Sang-bong; Cho, Hyung-suk; Hyun, Pil-sik; Lim, Kyu-hong; Lee, Byung-am, Method of and device for detecting micro-scratches.
    상세보기
  33. Shortt, David; Biellak, Stephen; Belyaev, Alexander, Methods and systems for inspection of a wafer.
    상세보기
  34. Freifeld Daniel, Microscope illuminator for cylindrical objects.
    상세보기
  35. Sopori, Bhushan; Rupnowski, Przemyslaw; Ulsh, Michael, On-line, continuous monitoring in solar cell and fuel cell manufacturing using spectral reflectance imaging.
    상세보기
  36. Elyasaf Emanuel,ILX ; Eran Yair,ILX, Optical inspection method and apparatus.
    상세보기
  37. Herod,David W.; Hennessey,Kathleen; Lin,Youling, Optical inspection method utilizing ultraviolet light.
    상세보기
  38. Bronte Joseph J. (Poughkeepsie NY) Herbert Roland C. (Hopewell Junction NY) Khoury Henri A. (Yorktown Heights NY), Optical inspection system for semiconductor wafers.
    상세보기
  39. Hunter, Reginald, Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems.
    상세보기
  40. Lewis, Isabella; Vaez-Iravani, Mehdi, Optical system for detecting anomalies and/or features of surfaces.
    상세보기
  41. Lewis,Isabella; Vaez Iravani,Mehdi, Optical system for detecting anomalies and/or features of surfaces.
    상세보기
  42. Hunter, Reginald, Particle detection and embedded vision system to enhance substrate yield and throughput.
    상세보기
  43. Allemand Charly D. (Newtonville MA), Particle detection method and apparatus.
    상세보기
  44. Marxer,Norbert; Gross,Kenneth P.; Altendorfer,Hubert; Kren,George, Process and assembly for non-destructive surface inspections.
    상세보기
  45. Mehdi Vaez-Iravani ; Stanley Stokowski ; Guoheng Zhao, Sample inspection system.
    상세보기
  46. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
    상세보기
  47. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
    상세보기
  48. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
    상세보기
  49. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
    상세보기
  50. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
    상세보기
  51. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
    상세보기
  52. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
    상세보기
  53. Ishihara Kazuko,JPX ; Ishikawa Seiji,JPX ; Sakata Masao,JPX ; Miyazaki Isao,JPX ; Miyamoto Yoshiyuki,JPX ; Nakazato Jun,JPX, Semiconductor failure analysis system.
    상세보기
  54. Kazuko Ishihara JP; Seiji Ishikawa JP; Masao Sakata JP; Isao Miyazaki JP; Yoshiyuki Miyamoto JP; Jun Nakazato JP, Semiconductor failure analysis system.
    상세보기
  55. Steffan Paul J. ; Tracy Bryan ; Chen Ming Chun, Semiconductor wafer optical scanning system and method using swath-area defect limitation.
    상세보기
  56. Noso Kazunori (Yokohama JPX) Saito Hiroshi (Yokosuka JPX), Surface condition estimating apparatus.
    상세보기
  57. Ishimaru, Ichiro; Noguchi, Minori; Moriyama, Ichiro; Tanabe, Yoshikazu; Yatsugake, Yasuo; Kenbou, Yukio; Watanabe, Kenji; Tsuchiyama, Hirofumi, Surface inspection apparatus and method thereof.
    상세보기
  58. Ishimaru, Ichiro; Noguchi, Minori; Moriyama, Ichiro; Tanabe, Yoshikazu; Yatsugake, Yasuo; Kenbou, Yukio; Watanabe, Kenji; Tsuchiyama, Hirofumi, Surface inspection apparatus and method thereof.
    상세보기
  59. Ishimaru, Ichiro; Noguchi, Minori; Moriyama, Ichiro; Tanabe, Yoshikazu; Yatsugake, Yasuo; Kenbou, Yukio; Watanabe, Kenji; Tsuchiyama, Hirofumi, Surface inspection apparatus and method thereof.
    상세보기
  60. Ishimaru,Ichiro; Noguchi,Minori; Moriyama,Ichiro; Tanabe,Yoshikazu; Yatsugake,Yasuo; Kenbou,Yukio; Watanabe,Kenji; Tsuchiyama,Hirofumi, Surface inspection apparatus and method thereof.
    상세보기
  61. Ishimaru,Ichiro; Noguchi,Minori; Moriyama,Ichiro; Tanabe,Yoshikazu; Yatsugake,Yasuo; Kenbou,Yukio; Watanabe,Kenji; Tsuchiyama,Hirofumi, Surface inspection apparatus and method thereof.
    상세보기
  62. Kawai Michio (Funabashi JPX) Tanaka Sadahiro (Yokohama JPX) Osanai Osamu (Chiba JPX), Surface profile analyzer.
    상세보기
  63. Chen,Wayne; Zeng,Andrew; Akbulut,Mustafa, System and methods for classifying anomalies of sample surfaces.
    상세보기
  64. Chen,Wayne; Zeng,Andrew; Akbulut,Mustafa, System and methods for classifying anomalies of sample surfaces.
    상세보기
  65. Chen,Wayne; Zeng,Andrew; Akbulut,Mustafa, System and methods for classifying anomalies of sample surfaces.
    상세보기
  66. Hu, Jinlian; Xin, Binjie; Guo, Yueyang; Newton, Edward, System for analysis of fabric surface.
    상세보기
  67. Buchanan Robert ; Yarussi Richard A. ; Spady Blaine R., System using a polar coordinate stage and continuous image rotation to compensate for stage rotation.
    상세보기
  68. Biellak, Steve; Stokowski, Stanley E.; Vaez-Iravani, Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
    상세보기
  69. Biellak,Steve; Stokowski,Stanley E.; Vaez Iravani,Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
    상세보기
  70. Toh Peng Seng,SGX, Two and a half dimension inspection system.
    상세보기
  71. Adomaitis Paul R. (Level Green PA) Brouwer Nicholaas L. (Allegheny Township ; Westmoreland County PA) Hobi Bernard J. (Upper Burrell Twp. ; Westmoreland County PA), Video surface inspection system.
    상세보기
  72. Osada, Tatsuya; Egashira, Masahiko; Uchino, Tomokatsu, Wafer inspection method and wafer inspection apparatus.
    상세보기

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