초록 ▼

Container package for transporting a plurality of silicon wafers for shipment as well as preventing contamination thereof. The container wafer package includes a cassette having two sides, an end, and an H-bar including an upper ramp support and a lower round support with the bar being reinforced by

Container package for transporting a plurality of silicon wafers for shipment as well as preventing contamination thereof. The container wafer package includes a cassette having two sides, an end, and an H-bar including an upper ramp support and a lower round support with the bar being reinforced by a partially cylindrical rod, a package bottom including four sides, a female trough surrounding the sides, hook latches, four internal side dividing members, and orthogonal feet for stacking; and the package top including four sides, a male trough to mate with the female trough, configured independent flexible grooved fingers, and orthogonal feet for stacking where the cassette is positioned by internal side dividers in the top and bottom packages for secure placement. The three components provide that the cassette mates between the top and bottom packages, the wafers mate in the cassette and with the top fingers, the top and bottom packages mate between the trough, and the hook ends secure the top and bottom packages together with also securing of the cassette and wafers therein. The side of the package is smooth, providing for a flush perimeter for taping. The interlocking orthogonal pairs of feet on each corner provide for stacking of like packages. The smooth, rounded contour design of the package provides a design for shrink wrapping. The package limits and prohibits wafer movement, and eliminates wafer breakage.

대표청구항 ▼

1. Package for silicon wafers comprising: a. wafer cassette including opposing mirror-image curved sides, a plurality of vertically opposing outward extending dividers partitioning said cassette, a closed end, a substantially open H-bar configured end including a ramped top portion and a rounded

1. Package for silicon wafers comprising: a. wafer cassette including opposing mirror-image curved sides, a plurality of vertically opposing outward extending dividers partitioning said cassette, a closed end, a substantially open H-bar configured end including a ramped top portion and a rounded bottom portion, and a partially segmented cylindrical support rod secured and positioned outward across said H-bar and including two mating buttons spaced thereon; b. package bottom including a bottom member, four slightly geometrically configured sides, female trough surrounding a top edge of said sides, opposing end hook latches with a finger hole including a hook on each side of each of said finger holes, internal geometrically configured vertical side and end positioning members extending outwardly and upwardly from interior sides and ends for positioning of said cassette, and four pairs of orthogonal feet at each edge of said bottom member thereof; and, c. package top including a top member, four angled sides surrounding said top, a male lip extending downwardly from said bottom of said sides for mating with each female trough, a plurality of opposing flexible independent fingers including a side groove and a top groove in each of said opposing fingers for perimeter contact mating with each wafer, internal geometrically configured vertical positioning members extending outwardly and downwardly from interior sides and ends for positioning of said cassette, hole indentations including outward extending latch on each side positioned on outer lower ends for receiving and latching said hooks of said package bottom, and a plurality of orthogonal pairs of feet on each outer top corner of said package top member whereby silicon wafers engage between said dividers of said cassette, between said cassette and said fingers of said package top, said cassette engages and interlocks between said vertical side and end members between said package top and package bottom, said package top lip engages into said package trough bottom, and said latches engage over said hook ends between said bottom and top package respectively, and said interlocking orthogonal feet providing for stacking of like packages, thereby providing secure and contamination-free environment for transportation and storage of silicon wafers and a smooth perimeter about said mated package top and bottom. 2. Package of claim 1 wherein said package top lip and top of said package bottom comprise a flush perimeter of a finite height surrounding the perimeter between the package top and said package bottom when said package top and package bottom are interengaged and mated with respect to each other. 3. Package of claim 1 wherein said cassette supports at least one to twenty-five wafers. 4. Package of claim 1 wherein said engaged opposing hook and said latch provide for a flush perimeter. 5. Package of claim 1 wherein each end of said package includes dual hooks and latches on opposing sides of a finger hole. 6. Package of claim 1 wherein said female trough and said male lip provide for a secure environment within said package top and package bottom which can be evacuated and support an inert atmosphere. 7. Package of claim 1 wherein each finger includes independent means providing spring action thereto on wafer edge contact. 8. Package of claim 1 wherein each finger includes a rounded V-grooved top and a grooved inside V-rounded member for engaging with an edge on wafer. 9. Package of claim 1 wherein each of said fingers is independently spaced with respect to each other including an independent slit between each of said fingers along each row of fingers. 10. Package of claim 1 wherein said fingers limit and secure movement of each of said wafers. 11. Package for silicon wafers comprising: a. wafer cassette means for housing a plurality of spaced wafers therein along a longitudinal distance and including forward indexing button means; b. package bottom for supporting said wafer cassette means in a spaced relationship therein and including female receiving trough means on a top edge thereof and flexible hook locking means projecting upwardly along opposing ends of said package bottom; c. package top for enclosing said package bottom and said wafer cassette means in a spaced relationship therein and including male lip means on a bottom edge extending downwardly therefrom and latch means extending outwardly from an edge for engaging said locking means; and, d. plurality of independent finger means extending downwardly in spaced opposing rows from an interior surface of said package top, said fingers providing for independent spacing and securing of each of said wafers in said cassette means, and between said package top and package bottom whereby said fingers secure edges of said wafers thereby preserving structural integrity of each of said wafers. 12. Package of claim 11 including means at said finger means for springing upward said package top from said package bottom when said hook and latch locking means are disengaged thereby disengaging said package top and package bottom about said lip means. 13. Package of claim 11 wherein each of said finger means includes an independent V-grooved top and an independent V-grooved side for independent spacing of said wafer by said top groove and securing said wafer by said side groove into said cassette means. 14. Package of claim 11 including slit means for independent operation of each of said fingers with respect to each other. 15. Package of claim 11 including means providing for a flush perimeter for shrink wrap. 16. Package of claim 11 including means providing for smooth contoured edges of said package for shrink wrap. 17. Package of claim 11 comprising dividers for twenty-five wafers. 18. Package of claim 11 comprising means in said package bottom for accepting said cassette means in only one indexed direction. 19. Package of claim 11 wherein said latching and hook means is equally flush with said trough-lip means. 20. Wafer cassette comprising: mirror-image curved sides, a substantially closed end, an open H-bar configured end including a ramped top portion and a rounded bottom portion, a partial cylindrical member secured across said H-bar and including locating buttons, one at either end, and a center enlarged cylindrical rod for structural support integrity, two vertical sides at opposing ends of said H-bar, and two substantially vertical lower edges secured to said curved sides whereby said H-bar including said cylindrical rod, two indexing buttons, and an enlarged cylindrical rod provide for machine indexing, cassette indexing, and structural integrity. 21. Package comprising: a. package bottom including a bottom member, four slightly geometrically configured sides, female trough surrounding a top edge of said sides, opposing end hook latches with a finger hole including a hook on each side of each of said finger holes, internal geometrically configured vertical side and end positioning members extending outwardly and upwardly from interior sides and ends for positioning, and four pairs of orthogonal feet at each edge of said bottom member thereof; and, b. package top including a top member, four angled sides surrounding said top, a male lip extending downwardly from said bottom of said sides for mating with said female trough, a plurality of opposing flexible independent fingers including a side groove and a top groove in each of said opposing fingers for perimeter contact mating with each wafer in a cassette placed into said package bottom, internal geometrically configured vertical position members extending outwardly and downwardly from interior sides and ends for positioning of a cassette, hole indentations including outward extending latch on each side positioned on outer lower ends for receiving and latching said hooks of said package bottom, and a plurality of orthogonal pairs of feet on each outer top corner of said package top member.