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Apparatus for selective electrolytic plating 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-017/00
  • C25D-017/28
출원번호 US-0474320 (1983-03-11)
발명자 / 주소
  • Palnik Karl (Huntingdon Valley PA)
출원인 / 주소
  • The Carolinch Company (Ivyland PA 02)
인용정보 피인용 횟수 : 40  인용 특허 : 2

초록

Selective electrolytic plating of small interconnected parts at high rates of production is disclosed. A porous hydrophobic material serves as the body of a brush member which has surfaces configured to transfer charged electrolytic solution to the selected surfaces of the parts being plated. Electr

대표청구항

Apparatus for the electroplating of parts, wherein the parts are interconnected in the form of elongated strip material wherein the metallic strip material is moved in a path which extends lengthwise of the apparatus, said apparatus comprising a plating brush means comprised of an elongated body mem

이 특허에 인용된 특허 (2)

  1. Eidschun ; Jr. ; Charles Douglas, Continuous contact plater product.
  2. Bick Maurice (South Orange NJ) Lochet Jean A. (Metuchen NJ) Dubas Donald J. (Maplewood NJ) Di Murro Richard J. (Harrison NJ), Selective plating apparatus.

이 특허를 인용한 특허 (40)

  1. Cohen, Adam L., Apparatus for electrochemical fabrication using a conformable mask.
  2. Bacon Jeffery E. (Long Beach CA) Craig James E. (South Pasadena CA) Pedersen Mark K. (Yorba Linda CA), Continuous contact method for electrolytic fluid working of parts.
  3. Bacon Jeffery E. (Long Beach CA) Craig James E. (South Pasadena CA) Pedersen Mark K. (Yorba Linda CA), Continuous contact plating apparatus.
  4. Bacon Jeffery E. (Long Beach CA) Craig James E. (South Pasadena CA) Pedersen Mark K. (Yorba Linda CA), Continuous contact plating apparatus.
  5. Zielke, Darrell W., Continuous plating system and method with mask registration.
  6. Zielke, Darrell W., Continuous plating system and method with mask registration.
  7. Zielke, Darrell W., Continuous plating system and method with mask registration.
  8. Zielke, Darrell W., Continuous plating system and method with mask registration.
  9. Wingenfeld Peter (Degenfelderstrasse 26/2 7070 Weiler DEX) Holdt Dietmar (Staufenstrasse 19 7078 Leinzell DEX), Device for selective galvanic coating.
  10. Palnik Karl (Huntingdon Valley PA), Electrolytic plating apparatus.
  11. Moffitt Herb J. (Carlisle PA), Electroplating apparatus.
  12. Mayer, Steven T.; Drewery, John S., Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation.
  13. Adam L. Cohen, Method for electrochemical fabrication.
  14. Cohen Adam L., Method for electrochemical fabrication.
  15. Cohen, Adam L., Method for electrochemical fabrication.
  16. Cohen, Adam L., Method for electrochemical fabrication.
  17. Cohen, Adam L., Method for electrochemical fabrication.
  18. Cohen,Adam L., Method for electrochemical fabrication.
  19. Cohen, Adam L., Method for electromechanical fabrication.
  20. Brown, Elliot R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Method for fabricating miniature structures or devices such as RF and microwave components.
  21. Brown, Elliott R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Method for fabricating miniature structures or devices such as RF and microwave components.
  22. Mayer,Steven T.; Reid,Jonathan D.; Rea,Mark L.; Emesh,Ismail T.; Meinhold,Henner W.; Drewery,John S., Method for planar electroplating.
  23. Cohen, Adam L., Method of electrochemical fabrication.
  24. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
  25. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
  26. Brown, Elliot R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Miniature RF and microwave components and methods for fabricating such components.
  27. Brown, Elliott R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Miniature RF and microwave components and methods for fabricating such components.
  28. Brown,Elliott R.; Evans,John D.; Bang,Christopher A.; Cohen,Adam L.; Lockard,Michael S.; Smalley,Dennis R.; Grosser,Morton, Miniature RF and microwave components and methods for fabricating such components.
  29. Mayer, Steven T.; Porter, David W., Modulated metal removal using localized wet etching.
  30. Cohen, Adam L., Multi-layer encapsulated structures.
  31. Wu, Ming Ting; Larsen, III, Rulon Joseph; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
  32. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
  33. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
  34. Wen Hua Hui, Ni-Fe-Co electroplating bath.
  35. Murata Yasuto (Kanagawa JPX) Tezuka Junichi (Kanagawa JPX) Yamamoto Kenji (Tokyo JPX), Plating device for minute portions of connector terminals.
  36. Mayer, Steven T.; Drewery, John S.; Hill, Richard S.; Archer, Timothy M.; Kepten, Avishai, Selective electrochemical accelerator removal.
  37. Mayer, Steven T.; Drewery, John; Hill, Richard S.; Archer, Timothy; Kepten, Avishai, Selective electrochemical accelerator removal.
  38. Mayer, Steven T.; Stowell, Marshall R.; Drewery, John S.; Hill, Richard S.; Archer, Timothy M.; Kepten, Avishai, Selective electrochemical accelerator removal.
  39. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
  40. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
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