초록 ▼

Hot melt adhesive compositions are prepared from ethylene copolymers, atactic polypropylene, tackifying resins and optional additives. The adhesives are non-pressure sensitive and are characterized by high cohesive strength, strong tack, and good heat, creep and cold resistance. In accordance with t

Hot melt adhesive compositions are prepared from ethylene copolymers, atactic polypropylene, tackifying resins and optional additives. The adhesives are non-pressure sensitive and are characterized by high cohesive strength, strong tack, and good heat, creep and cold resistance. In accordance with the preferred embodiment, the adhesives are formulated so as to be particularly adaptable for use in the construction of disposable diapers of the multi-line construction variety.

대표청구항 ▼

A non-pressure sensitive hot melt adhesive composition consisting essentially of: (a) 10 to 40% by weight of a copolymer of ethylene with vinyl acetate or an alkyl acrylate wherein the vinyl acetate or alkyl acrylate comprises 5 to 25% by weight of the copolymer. (b) 10 to 40% by weight of atactic p

A non-pressure sensitive hot melt adhesive composition consisting essentially of: (a) 10 to 40% by weight of a copolymer of ethylene with vinyl acetate or an alkyl acrylate wherein the vinyl acetate or alkyl acrylate comprises 5 to 25% by weight of the copolymer. (b) 10 to 40% by weight of atactic polypropylene; the weight ratio of atactic polypropylene to ethylene copolymer being between 0.5 and 2.5; (c) 20 to 50% by weight of a compatible tackifying resin; (d) 0 to 15% by weight of plasticizing oil; (e) 0 to 15% by weight of a petroleum derived wax; and (f) 0 to 1.5% stabilizer; and wherein the composition is characterized by a viscosity within the range of 1,000 to 10,000 cps. at 300°F.; a minimum open time of 5 seconds; and a minimum tensile strength at 100% elongation of 60 psi at room temperature and 30 psi at 100°F. A multi-line type diaper construction comprising at least polyethylene or polypropylene substrate bonded to at least one non-woven substrate using a non-pressure sensitive hot melt composition consisting essentially of: (a) 20 to 30% by weight of a copolymer of ethylene with vinyl acetate or a lower alkyl acrylate; (b) 20 to 40% by weight of atactic polypropylene; the weight ratio of atactic polypropylene to ethylene copolymer being between 0.5 and 2.5; (c) 35 to 50% by weight of a compatable tackifying resin; (d) 5 to 15% by weight of a plasticizing oil; (e) 0 to 5% by weight of a petroleum derived wax; and (f) 0 to 1.5% by weight of a stabilizer; and wherein the composition is characterized by a viscosity of 2000 to 8000 cps at 300°F., a minimum open time of 10 seconds, a minimum bonding temperature of 160°F. and a minimum tensile strength at room temperature of 100 psi and at 100°F. of 50 psi.