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Magnetoplasmadynamic apparatus and process for the separation and deposition of materials

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05D-001/08
출원번호 US-0365782 (1982-04-05)
발명자 / 주소
  • Cann Gordon L. (P.O. Box 279 Laguna Beach CA 92652)
인용정보 피인용 횟수 : 129  인용 특허 : 15

초록

A plasma arc discharge method for deposition of metallic and semiconductor layers on a substrate for the purpose of producing semiconductor grade materials such as silicon at a reduced cost is disclosed. Magnetic fields are used so that silicon ions and electrons can be directed toward a target area

대표청구항

A method for refining semiconductor materials comprising: (a) providing a vacuum environment; (b) establishing a plasma between an anode and a cathode; (c) accelerating the plasma with an accelerating magnet; (d) placing a substance comprising a semiconductor metal in the plasma, thereby forming a p

이 특허에 인용된 특허 (15)

  1. Mazelsky ; Robert ; Fey ; Maurice G. ; Harvey ; Francis J., Arc heater method for the production of single crystal silicon.
  2. Harvey ; II ; Francis J., Arc heater production of silicon involving a hydrogen reduction.
  3. Fey ; Maurice G. ; Harvey ; II ; Francis J. ; McDonald ; Jack, Arc heater production of silicon involving alkali or alkaline-earth metals.
  4. Fey Maurice G. (Plum Borough PA) Harvey ; II Francis J. (Murrysville PA) McDonald Jack (Penn Hills PA), Arc heater production of silicon involving alkali or alkaline-earth metals.
  5. Reitz Norman E. (Redwood City CA), Crystallizing a layer of silicon on a sodium thallium type crystalline alloy substrate.
  6. Harvey ; II ; Francis J. ; Fey ; Maurice G., High purity silicon production by arc heater reduction of silicon intermediates.
  7. Mourier Georges (Paris FRX), Ion source producing a dense flux of low energy ions.
  8. Gurev Harold S. (San Rafael CA), Method and apparatus for forming films from vapors using a contained plasma source.
  9. Tsuchimoto ; Takashi, Plasma processor.
  10. Janowiecki Richard J. (Dayton OH) Willson Michael C. (Waynesville OH) Harris Douglas H. (Dayton OH), Plasma spraying process for preparing polycrystalline solar cells.
  11. Fey ; Maurice G., Process for doping high purity silicon in an arc heater.
  12. Kumar Kaplesh (Wellesley MA) Das Dilip K. (Bedford MA) Wettstein Ernest C. (Acton MA), Process of making permanent magnets.
  13. Lindmayer Joseph (Bethesda MD), Semicrystalline silicon article and method of making same.
  14. Luscher Paul E. (Sunnyvale CA), Transfer and temperature monitoring apparatus.
  15. Steube Kenneth E. (St. Charles MO), Vapor deposition coating machine.

이 특허를 인용한 특허 (129)

  1. Patten ; Jr. Donald O. ; Simpson Matthew A. ; Windischmann Henry ; Heuser Michael S. ; Quirk William A. ; Jaffe Stephen M., Apparatus and method for depositing a substance with temperature control.
  2. Mullin Richard S. (Pomfret CT) Riendeau Leo A. (Springfield MA) Ulion Nicholas E. (Marlborough CT), Apparatus for applying ceramic coatings.
  3. Rogers, John A.; Ying, Ming; Bonifas, Andrew; Lu, Nanshu, Appendage mountable electronic devices conformable to surfaces.
  4. Rogers, John A; Ying, Ming; Bonifas, Andrew; Lu, Nanshu, Appendage mountable electronic devices conformable to surfaces.
  5. Gorokhovsky Vladimir I. (2 Laxton Avenue ; Apartment 212 Toronto ; Ontario CAX M6K 1K9 ), Arc assisted CVD coating and sintering method.
  6. J. Albert Sue ; Zhigang Fang ; Alysia Canson White, Automated hardfacing system.
  7. Ghaffari, Roozbeh; Callsen, Gilman; Arora, William J.; Schlatka, Benjamin, Catheter balloon having stretchable integrated circuitry and sensor array.
  8. Henley Francois J. ; Cheung Nathan W., Cleaved silicon thin film with rough surface.
  9. Francois J. Henley ; Michael A. Brayan ; William G. En, Cleaving process to fabricate multilayered substrates using low implantation doses.
  10. Henley,Francois J.; Bryan,Michael A.; En,William G., Cleaving process to fabricate multilayered substrates using low implantation doses.
  11. Rogers, John; Kim, Dae-Hyeong; Litt, Brian; Viventi, Jonathan, Conformable actively multiplexed high-density surface electrode array for brain interfacing.
  12. Henley Francois J. ; Cheung Nathan W., Controlled cleaning process.
  13. Francois J. Henley ; Nathan Cheung, Controlled cleavage process and device for patterned films.
  14. Henley Francois J. ; Cheung Nathan, Controlled cleavage process and device for patterned films.
  15. Henley, Francois J.; Cheung, Nathan, Controlled cleavage process and device for patterned films.
  16. Francois J. Henley ; Nathan W. Cheung, Controlled cleavage process and resulting device using beta annealing.
  17. Henley Francois J. ; Cheung Nathan W., Controlled cleavage process and resulting device using beta annealing.
  18. Henley Francois J. ; Cheung Nathan, Controlled cleavage process using pressurized fluid.
  19. Henley, Francois J.; Cheung, Nathan, Controlled cleavage process using pressurized fluid.
  20. Henley Francois J. ; Cheung Nathan, Controlled cleavage system using pressurized fluid.
  21. Henley Francois J. ; Cheung Nathan W., Controlled cleavage thin film separation process using a reusable substrate.
  22. Henley, Francois J.; Cheung, Nathan W., Controlled cleaving process.
  23. Henley,Francois J.; Cheung,Nathan W., Controlled cleaving process.
  24. Henley,Francois J.; Cheung,Nathan W., Controlled cleaving process.
  25. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
  26. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
  27. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
  28. Henley,Francois J.; Cheung,Nathan W., Controlled process and resulting device.
  29. Bak-Boychuk Gregory ; Bradley Martin G. ; Mack Darryl K. ; Jaffe Stephen M. ; Simpson Matthew, Deposition target medium for diamond film deposition.
  30. Henley Francois J. ; Cheung Nathan, Device for patterned films.
  31. Bak-Boychuk Gregory ; Bradley Martin G. ; Mack Darryl K. ; Jaffe Stephen M. ; Simpson Matthew, Diamond film deposition.
  32. Cecil B. Shepard, Jr., Diamond film deposition on substrate arrays.
  33. Shepard ; Jr. Cecil B., Diamond film deposition on substrate arrays.
  34. Henley Francois J. ; Cheung Nathan W., Economical silicon-on-silicon hybrid wafer assembly.
  35. Rafferty, Conor; Dalal, Mitul, Embedding thin chips in polymer.
  36. Arora, William J.; Ghaffari, Roozbeh, Extremely stretchable electronics.
  37. Arora, William J.; Ghaffari, Roozbeh, Extremely stretchable electronics.
  38. Arora, William J.; Ghaffari, Roozbeh, Extremely stretchable electronics.
  39. Elolampi, Brian; Ghaffari, Roozbeh; de Graff, Bassel; Arora, William; Hu, Xiaolong, Flexible electronic structure.
  40. Nathan W. Cheung ; Francois J. Henley, Generic layer transfer methodology by controlled cleavage process.
  41. Henley, Francois J.; Cheung, Nathan W., Gettering technique for wafers made using a controlled cleaving process.
  42. Henley, Francois J.; Cheung, Nathan W., Gettering technique for wafers made using a controlled cleaving process.
  43. Rogers, John A.; Kim, Dae-Hyeong; Omenetto, Fiorenzo; Kaplan, David L.; Litt, Brian; Viventi, Jonathan; Huang, Yonggang; Amsden, Jason, Implantable biomedical devices on bioresorbable substrates.
  44. Rogers, John A.; Kim, Dae-Hyeong; Omenetto, Fiorenzo; Kaplan, David L.; Litt, Brian; Viventi, Jonathan; Huang, Yonggang; Amsden, Jason, Implantable biomedical devices on bioresorbable substrates.
  45. Joly, Jean-Pierre; Ulmer, Laurent; Parat, Guy, Integrated circuit on high performance chip.
  46. Henley, Francois J., Layer transfer of films utilizing controlled propagation.
  47. Henley, Francois J., Layer transfer of films utilizing controlled shear region.
  48. Faris,Sadeg M., MEMS and method of manufacturing MEMS.
  49. Crow James T. ; Mowrer Gary R., Magnetic multipole redirector of moving plasmas.
  50. Konstantin K. Tzatzov CA; Alexander S. Gorodetsky CA, Method and apparatus for magnetron sputtering.
  51. Campbell Gregor A. (Glendale CA) Conn Robert W. (Los Angeles CA) Goebel Dan M. (Santa Monica CA) Adam Rolf (Hanau DEX) Aichert Hans (Hanau DEX) Betz Hans (Bruchkoebel DEX) Dietrich Anton (Wiesenfeld , Method and apparatus for the application of materials.
  52. Moll, Eberhard, Method and apparatus for uniformly heating articles in a vacuum container.
  53. Francois J. Henley ; Nathan W. Cheung, Method and device for controlled cleaving process.
  54. Henley Francois J. ; Cheung Nathan, Method and device for controlled cleaving process.
  55. Henley Francois J. ; Cheung Nathan W., Method and device for controlled cleaving process.
  56. Henley, Francois J.; Cheung, Nathan W., Method and device for controlled cleaving process.
  57. Henley,Francois J.; Cheung,Nathan, Method and device for controlled cleaving process.
  58. Henley, Francois J., Method and structure for fabricating solar cells using a thick layer transfer process.
  59. Simpson Matthew A. (Sudbury MA), Method for coating a substrate with diamond film.
  60. Patten ; Jr. Donald O. (Sterling MA) Simpson Matthew A. (Sudbury MA) Windischmann Henry (Northboro MA) Heuser Michael S. (Foothill Ranch CA), Method for depositing a substance with temperature control.
  61. Shepard ; Jr. Cecil B. (Laguna Niguel CA) Heuser Michael S. (Foothill Ranch CA) Raney Daniel V. (Mission Viejo CA) Quirk William A. (Lake Forest CA) Bak-Boychuk Gregory (San Juan Capistrano CA), Method for depositing a substance with temperature control.
  62. Fournel, Franck; Moriceau, Hubert; Lagahe, Christelle, Method for making a stressed structure designed to be dissociated.
  63. Tauzin, Aurélie; Dechamp, Jérôme; Mazen, Frédéric; Madeira, Florence, Method for preparing thin GaN layers by implantation and recycling of a starting substrate.
  64. Nguyen, Nguyet-Phuong; Cayrefourcq, Ian; Lagahe-Blanchard, Christelle; Bourdelle, Konstantin; Tauzin, Aurélie; Fournel, Franck, Method for self-supported transfer of a fine layer by pulsation after implantation or co-implantation.
  65. Faris,Sadeg M., Method of fabricating multi layer devices on buried oxide layer substrates.
  66. Petrakov Vladimir P. (ulitsa Sotsialisticheskaya ; 27 ; kv. 2 Ufa SUX) Minkin Gennady P. (ulitsa Trifonovskaya ; 11 ; kv. 286 Moscow SUX) Shagun Vladimir A. (ulitsa Musorgskogo ; 19/1 ; kv. 52 Ufa SU, Method of ionized-plasma spraying and apparatus for performing same.
  67. Meroth John (333 Howard St. Northboro MA 01532 4), Method of making synthetic diamond film with reduced bowing.
  68. Aspar, Bernard; Bruel, Michel; Poumeyrol, Thierry, Method of producing a thin layer of semiconductor material.
  69. Cheung Nathan W. ; Lu Xiang ; Hu Chenming, Method of separating films from bulk substrates by plasma immersion ion implantation.
  70. Deguet, Chrystel; Clavelier, Laurent; Dechamp, Jerome, Method of transferring a thin film onto a support.
  71. Fournel, Franck, Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layer.
  72. de Graff, Bassel; Arora, William J.; Callsen, Gilman; Ghaffari, Roozbeh, Methods and applications of non-planar imaging arrays.
  73. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
  74. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
  75. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
  76. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
  77. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
  78. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
  79. Malik, Igor J.; Kang, Sien G.; Fuerfanger, Martin; Kirk, Harry; Flat, Ariel; Current, Michael Ira; Ong, Philip James, Non-contact etch annealing of strained layers.
  80. Bryan Michael A. ; Kai James K., Nozzle for cleaving substrates.
  81. Bryan, Michael A.; Kai, James K., Nozzle for cleaving substrates.
  82. Rogers, John A., Optical component array having adjustable curvature.
  83. Rogers, John; Nuzzo, Ralph; Meitl, Matthew; Menard, Etienne; Baca, Alfred J.; Motala, Michael; Ahn, Jong-Hyun; Park, Sang-II; Yu, Chang-Jae; Ko, Heung-Cho; Stoykovich, Mark; Yoon, Jongseung, Optical systems fabricated by printing-based assembly.
  84. Rogers, John; Nuzzo, Ralph; Meitl, Matthew; Menard, Etienne; Baca, Alfred J.; Motala, Michael; Ahn, Jong-Hyun; Park, Sang-Il; Yu, Chang-Jae; Ko, Heung Cho; Stoykovich, Mark; Yoon, Jongseung, Optical systems fabricated by printing-based assembly.
  85. Rogers, John; Nuzzo, Ralph; Meitl, Matthew; Menard, Etienne; Baca, Alfred; Motala, Michael; Ahn, Jong-Hyun; Park, Sang-Il; Yu, Chang-Jae; Ko, Heung Cho; Stoykovich, Mark; Yoon, Jongseung, Optical systems fabricated by printing-based assembly.
  86. Rogers, John; Nuzzo, Ralph; Meitl, Matthew; Menard, Etienne; Baca, Alfred; Motala, Michael; Ahn, Jong-Hyun; Park, Sang-Il; Yu, Chang-Jae; Ko, Heung Cho; Stoykovich, Mark; Yoon, Jongseung, Optical systems fabricated by printing-based assembly.
  87. Henley Francois J. ; Cheung Nathan W., Pre-semiconductor process implant and post-process film separation.
  88. Henley Francois J. ; Cheung Nathan W., Pressurized microbubble thin film separation process using a reusable substrate.
  89. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao; Ko, Heung Cho; Mack, Shawn, Printable semiconductor structures and related methods of making and assembling.
  90. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao; Ko, Heung Cho; Mack, Shawn, Printable semiconductor structures and related methods of making and assembling.
  91. Rogers, John A.; Kim, Tae Ho; Choi, Won Mook; Kim, Dae Hyeong; Meitl, Matthew; Menard, Etienne; Carlisle, John, Printable, flexible and stretchable diamond for thermal management.
  92. Rogers, John A.; Nuzzo, Ralph; Kim, Hoon-sik; Brueckner, Eric; Park, Sang Il; Kim, Rak Hwan, Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays.
  93. Rogers, John A.; Nuzzo, Ralph; Kim, Hoon-sik; Brueckner, Eric; Park, Sang Il; Kim, Rak Hwan, Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays.
  94. Bruel,Michel, Process for the production of thin semiconductor material films.
  95. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film.
  96. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film comprising an inclusion creation step.
  97. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film comprising an inclusion creation step.
  98. Ghaffari, Roozbeh; Schlatka, Benjamin; Callsen, Gilman; de Graff, Bassel, Protective cases with integrated electronics.
  99. Henley, Francois J.; Brailove, Adam, Race track configuration and method for wafering silicon solar substrates.
  100. Henley Francois J. ; Cheung Nathan W., Reusable substrate for thin film separation.
  101. Faris,Sadeg M., Selectively bonded thin film layer and substrate layer for processing of useful devices.
  102. Henley Francois J. ; Cheung Nathan W., Silicon-on-silicon hybrid wafer assembly.
  103. Henley, Francois J.; Cheung, Nathan W., Silicon-on-silicon hybrid wafer assembly.
  104. Henley Francois J. ; Cheung Nathan W., Silicon-on-silicon wafer bonding process using a thin film blister-separation method.
  105. Moriceau, Hubert; Aspar, Bernard; Margail, Jacques, Stacked structure and production method thereof.
  106. Rogers, John A.; Huang, Yonggang; Ko, Heung Cho; Stoykovich, Mark; Choi, Won Mook; Song, Jizhou; Ahn, Jong Hyun; Kim, Dae Hyeong, Stretchable and foldable electronic devices.
  107. Rogers, John A; Huang, Yonggang; Ko, Heung Cho; Stoykovich, Mark; Choi, Won Mook; Song, Jizhou; Ahn, Jong Hyun; Kim, Dae Hyeong, Stretchable and foldable electronic devices.
  108. Rogers, John A; Huang, Yonggang; Ko, Heung Cho; Stoykovich, Mark; Choi, Won Mook; Song, Jizhou; Ahn, Jong Hyun; Kim, Dae Hyeong, Stretchable and foldable electronic devices.
  109. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
  110. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
  111. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
  112. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
  113. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
  114. Bryan Michael A. ; Kai James K., Substrate cleaving tool and method.
  115. Bryan, Michael A.; Kai, James K., Substrate cleaving tool and method.
  116. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
  117. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
  118. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
  119. Windischmann Henry (Northborough MA), Synthetic diamond film with reduced bowing and method of making same.
  120. James M. Olson, Synthetic diamond wear component and method.
  121. Simpson Matthew (Arlington MA), Synthetic diamond wear component and method.
  122. De Graff, Bassel; Ghaffari, Roozbeh; Arora, William J., Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy.
  123. de Graff, Bassel; Ghaffari, Roozbeh; Arora, William J., Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy.
  124. Ghaffari, Roozbeh; de Graff, Bassel; Callsen, Gilman; Arora, William J.; Schlatka, Benjamin; Kuznetsov, Eugene, Systems, methods, and devices using stretchable or flexible electronics for medical applications.
  125. Brailove, Adam; Liu, Zuqin; Henley, Francois J.; Lamm, Albert J., Techniques for forming thin films by implantation with reduced channeling.
  126. Rogers, John A.; Kim, Hoon-Sik; Huang, Yonggang, Thermally managed LED arrays assembled by printing.
  127. Rogers, John A.; Omenetto, Fiorenzo G.; Hwang, Suk-Won; Tao, Hu; Kim, Dae-Hyeong; Kaplan, David, Transient devices designed to undergo programmable transformations.
  128. Faris,Sadeg M, Vertical integrated circuits.
  129. Rogers, John A.; Kim, Rak-Hwan; Kim, Dae-Hyeong; Kaplan, David L.; Omenetto, Fiorenzo G., Waterproof stretchable optoelectronics.
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