초록 ▼

An electronic circuit interconnection system provides high density mounting on ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, d

An electronic circuit interconnection system provides high density mounting on ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.

대표청구항 ▼

An electronic circuit interconnection system comprising a substrate means having a plurality of circuit path means arranged in spaced electrically insulated relation to each other and electronic semiconductor means mounted on the substrate means and electrically interconnected with the circuit path

An electronic circuit interconnection system comprising a substrate means having a plurality of circuit path means arranged in spaced electrically insulated relation to each other and electronic semiconductor means mounted on the substrate means and electrically interconnected with the circuit path means, characterized in that the semiconductor means have portions formed of inorganic material having selected thermal expansion properties and carry metal conductors which are fixedly connected in electrically and thermally conducting relation to the circuit path means, and the substrate means has a plurality of portions of a metal layer means defining respective portions of said circuit path means embedded in electrically insulating inorganic means for securing the circuit path means defined by said metal layer portions in said spaced electrically insulated relation to each other, the metal layer means and the inorganic embedding means being selected and proportioned relative to each other to provide the substrate means with thermal expansion properties corresponding to those of the semiconductor means to maintain the integrity of the fixed electrical connections of the metal conductors to the circuit path means during temperature cycling of the system and to provide the substrate means with thermal conductivity sufficient to maintain the semiconductor means at safe temperatures during system operation.