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Slope etch of polyimide 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B44C-001/22
  • C03C-015/00
  • C03C-025/06
출원번호 US-0595229 (1984-03-30)
발명자 / 주소
  • Almgren Carl W. (Austin TX)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 67  인용 특허 : 4

초록

A sloped via through polyimide between metal layers is achieved by first sloping a hard mask which overlies the polyimide. Sloped photoresist overlying the hard mask transfers the slope to the hard mask. The sloped hard mask is used to slope the polyimide. Oxide underlying the polyimide is also etch

대표청구항

In a semiconductor having an insulating layer overlying a metal layer, wherein the insulator comprises an upper oxide layer, an intermediate polyimide layer, and a lower oxide layer in contact with the metal layer, a method for etching a via from an upper surface of the polyimide layer to the metal

이 특허에 인용된 특허 (4)

  1. Pan Alfred I. (San Jose CA), Edge profile control during patterning of silicon by dry etching with CCl4-O2 mixtures.
  2. Saiki Atsushi (Musahimurayama JPX) Okubo Toshio (Tokyo JPX) Harada Seiki (Hachioji JPX), Method for fabricating semiconductor device and etchant for polymer resin.
  3. Belani Jagdish G. (Cupertino CA), Polymeric insulation layer etching process and composition.
  4. Stein Leonard (Dewitt NY), Process for selective etching of polymeric materials embodying silicones therein.

이 특허를 인용한 특허 (67)

  1. Lindert, Nick; Cea, Stephen M., Bulk non-planar transistor having strained enhanced mobility and methods of fabrication.
  2. Doyle, Brian S.; Jin, Been-Yih; Kavalieros, Jack T.; Datta, Suman; Brask, Justin K.; Chau, Robert S., CMOS devices with a single work function gate electrode and method of fabrication.
  3. Andricacos,Panayotis; Cooper,Emanuel Israel; Dalton,Timothy Joseph; Deligianni,Hariklia; Guidotti,Daniel; Kwietniak,Keith Thomas; Steen,Michelle Leigh; Tsang,Cornelia Kang I, Deep filled vias.
  4. Brask, Justin K.; Datta, Suman; Doczy, Mark L.; Blackwell, James M.; Metz, Matthew V.; Kavalieros, Jack T.; Chau, Robert S., Dielectric interface for group III-V semiconductor device.
  5. Radosavljevic, Marko; Datta, Suman; Doyle, Brian S.; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Majumdar, Amian; Chau, Robert S., Field effect transistor with metal source/drain regions.
  6. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  7. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  8. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  9. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  10. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  11. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  12. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  13. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  14. Greenberg, Robert Jay; Humayun, Mark S., Flexible circuit electrode array for improved layer adhesion.
  15. Grennberg, Robert Jay; Humayun, Mark S., Flexible circuit electrode array for improved layer adhesion.
  16. DeLoach,Juanita; Smith,Brian A., In situ hardmask pullback using an in situ plasma resist trim process.
  17. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors.
  18. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors in same process flow.
  19. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors in same process flow.
  20. Pham Tuan D. ; Templeton Michael K., Method for fabricating shallow isolation trenches using angular photoresist profiles to create sloped isolation trench w.
  21. Brask, Justin K.; Chau, Robert S.; Datta, Suman; Doczy, Mark L.; Doyle, Brian S.; Kavalieros, Jack T.; Majumdar, Amlan; Metz, Matthew V.; Radosavljevic, Marko, Method for fabricating transistor with thinned channel.
  22. Brask, Justin K.; Chau, Robert S.; Datta, Suman; Doczy, Mark L.; Doyle, Brian S.; Kavalieros, Jack T.; Majumdar, Amlan; Metz, Matthew V.; Radosavljevic, Marko, Method for fabricating transistor with thinned channel.
  23. Bukhman Yefim (Tempe AZ), Method for forming semiconductor devices.
  24. Blosse, Alain P.; Chowdhury, Saurabh Dutta, Method for forming sub-critical dimension structures in an integrated circuit.
  25. Kim, Tae-Ho, Method for manufacturing flash memory cell by rie slope etching reflowed photoresist pattern.
  26. Wada Osamu (Isehara) Sanada Tatsuyuki (Yokohama) Miura Shuichi (Atsugi) Machida Hideki (Atsugi) Yamakoshi Shigenobu (Ebina) Sakurai Teruo (Sagamihara JPX), Method for producing a monolithically integrated optoelectronic device.
  27. Hui, Angela T.; Singh, Bhanwar, Method of creating a smaller contact using hard mask.
  28. Hui, Angela T.; Singh, Bhanwar, Method of creating narrow trench lines using hard mask.
  29. Shah,Uday; Doyle,Brian S.; Brask,Justin K.; Chau,Robert S., Method of fabricating a multi-cornered film.
  30. Nemiroff Michael H. (Del Mar CA), Method of fabricating a tapered via hole in polyimide.
  31. Yamamoto Isamu (Hyogo JPX) Fukushima Jiro (Hyogo JPX), Method of forming a passivation film.
  32. Auda Bernard (Montlhery FRX), Method of forming a via-hole having a desired slope in a photoresist masked composite insulating layer.
  33. Abe Masahiro (Yokohama JPX) Mase Yasukazu (Tokyo JPX), Method of forming holes in semiconductor integrated circuit device.
  34. Brask, Justin K.; Doyle, Brian S.; Shah, Uday; Chau, Robert S., Method of patterning a film.
  35. Brask, Justin K.; Kavalieros, Jack; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S.; Doyle, Brian S., Methods for patterning a semiconductor film.
  36. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  37. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  38. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  39. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  40. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  41. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  42. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  43. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Rios, Rafael; Linton, Tom; Datta, Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  44. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Rios, Rafael; Linton, Tom; Datta, Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  45. Hareland,Scott A.; Chau,Robert S.; Doyle,Brian S.; Rios,Rafael; Linton,Tom; Datta,Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  46. Brask, Justin K.; Dovle, Brian S.; Kavalleros, Jack; Doczy, Mark; Shah, Uday; Chau, Robert S., Nonplanar transistors with metal gate electrodes.
  47. Uchimura David H. (Chandler AZ), Plasma etch process.
  48. Inasaka Jun (Tokyo JPX), Printer circuit and a process for preparing same.
  49. Nanda Madan M. (Reston VA) Peterman Steven L. (Manassas VA) Stanasolovich David (Manassas VA), Process for defining vias through silicon nitride and polyimide.
  50. Bukhman, Yefim; Thornquist, Steven C., Process for etching tapered polyimide vias.
  51. Kavalieros, Jack T.; Brask, Justin K.; Doyle, Brian S.; Shah, Uday; Datta, Suman; Doczy, Mark L.; Metz, Matthew V.; Chau, Robert S., Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby.
  52. Kavalieros,Jack T.; Brask,Justin K.; Doyle,Brian S.; Shah,Uday; Datta,Suman; Doczy,Mark L.; Metz,Matthew V.; Chau,Robert S., Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby.
  53. Hills Graham William, Reduced size etching method for integrated circuits.
  54. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  55. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  56. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  57. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  58. Hudait, Mantu K.; Shaheen, Mohamad A.; Chow, Loren A.; Tolchinsky, Peter G.; Fastenau, Joel M.; Loubychev, Dmitri; Liu, Amy W. K., Stacking fault and twin blocking barrier for integrating III-V on Si.
  59. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  60. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  61. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  62. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  63. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  64. Abrams Allan D. (Essex Junction VT) Bausmith Robert C. (Essex Junction VT) Holland Karey L. (Essex Junction VT) Holland Steven P. (Essex Junction VT), Tailoring of via-hole sidewall slope.
  65. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Datta, Suman; Jin, Been-Yih, Tri-gate transistor device with stress incorporation layer and method of fabrication.
  66. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Datta, Suman; Jin, Been-Yih, Tri-gate transistor device with stress incorporation layer and method of fabrication.
  67. Greenberg, Robert Jay; Humayun, Mark S., Visual prosthesis for improved circadian rhythms and method of improving the circadian rhythms.

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