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Disc cleaning machine 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G11B-003/58
출원번호 US-0453370 (1982-12-27)
발명자 / 주소
  • Rattan William D. (San Jose CA) Walwyn Craig M. (San Jose CA)
출원인 / 주소
  • General Signal Corporation (Stamford CT 02)
인용정보 피인용 횟수 : 78  인용 특허 : 6

초록

A cleaning machine for cleaning annular discs is disclosed. Annular discs of rigid or flexible material are designed to receive a magnetic coating capable of operating as a memory for a computer. The cleaning machine uses a spindle that aligns and holds the disc. The spindle rotates and high pressur

대표청구항

A machine for cleaning a surface of an annular disc having an inner annular surface of a predetermined diameter, comprising: a dispenser for dispensing a stream of cleaning fluid onto one or both surfaces of an annular disc, rotational drive means, a spindle for holding and rotating a disc through a

이 특허에 인용된 특허 (6)

  1. Dussault Jean G. M. (Naugatuck CT) Geckle Robert A. (Newtown CT) Puskas William L. (Trumbull CT), Apparatus for cleaning workpieces by ultrasonic energy.
  2. Giffin James W. (4653 Columbia River Ct. San Jose CA 95136) De Santis Michael A. (3116 Penetencia Creek Rd. San Jose CA 95132) Burchard John S. (630 Dorrance Rd. Boulder Creek CA 95006), Apparatus for in-situ processing of photoplates.
  3. Scharpf Mike A. (4624 Buehring Rd. Oshkosh WI 54901), Apparatus for washing and drying phonograph records.
  4. Rager Edgar A. (601 Almarida ; Apt. T6 Campbell CA 95008), Centering collar for a disk hub.
  5. Castelli Vittorio (Scottsdale NY) Chai Stephen T. (Carson CA), Contaminant trapping in rotating disk devices.
  6. Shortes Samuel R. (Plano TX) Millis Edwin Graham (Dallas TX), Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water.

이 특허를 인용한 특허 (78)

  1. Ko, Alexander Sou-Kang; Donoso, Bernardo, Adjustable nozzle for wafer bevel cleaning.
  2. Kottman Rickie A. (Dallas TX) Terrill Robert E. (Carrollton TX) Wise Ann E. (Dallas TX), Apparatus and method for edge cleaning.
  3. Cheung Robin ; Sinha Ashok ; Tepman Avi ; Carl Dan, Apparatus for electro-chemical deposition with thermal anneal chamber.
  4. Ritzdorf, Thomas L.; Stevens, E. Henry; Chen, LinLin; Graham, Lyndon W.; Dundas, Curt, Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device.
  5. Bran,Mario E., Apparatus for megasonic processing of an article.
  6. Shiba Kazuhiko,JPX, Cleaning apparatus.
  7. Maydan, Dan, Coated anode apparatus and associated method.
  8. Kovarsky,Nicolay; Yang,Michael; Lubomirsky,Dmitry, Contact plating apparatus.
  9. Herchen,Harald, Contact ring with embedded flexible contacts.
  10. Hey, H. Peter W.; Dordi, Yezdi N.; Olgado, Donald J. K.; Denome, Mark, Deposition uniformity control for electroplating apparatus, and associated method.
  11. Mannheimer Lee R. (3219 W. Sierra Dr. Westlake Village CA 91362) De Ridder A. Lody (433 Bradrick Dr. Carson CA 90745), Diskette cleaner.
  12. Donoso, Bernardo; Stevens, Joseph J.; Olgado, Donald J.; Ko, Alexander Sou-Kang, Dual post centrifugal wafer clip for spin rinse dry unit.
  13. Stevens, Joe; Olgado, Donald; Ko, Alex; Mok, Yeuk-Fai Edwin, Edge bead removal/spin rinse dry (EBR/SRD) module.
  14. Herchen,Harald; Lubomirsky,Dmitry; Zheng,Bo; Pang,Lily L., Electric field reducing thrust plate.
  15. Landau Uziel ; D'Urso John J. ; Rear David B., Electro deposition chemistry.
  16. Landau, Uziel; D'Urso, John J.; Rear, David B., Electro deposition chemistry.
  17. Uziel Landau ; John J. D'Urso ; David B. Rear, Electro deposition chemistry.
  18. Yezdi Dordi ; Joe Stevens ; Roy Edwards ; Bob Lowrance ; Michael Sugarman ; Mark Denome, Electro-chemical deposition cell for face-up processing of single semiconductor substrates.
  19. Dordi Yezdi ; Malik Muhammad Atif ; Hao Henan ; Franklin Timothy H. ; Stevens Joe ; Olgado Donald, Electro-chemical deposition system.
  20. Dordi Yezdi ; Olgado Donald J. ; Morad Ratson ; Hey Peter ; Denome Mark ; Sugarman Michael ; Lloyd Mark ; Stevens Joseph ; Marohl Dan ; Shin Ho Seon ; Ravinovich Eugene ; Cheung Robin ; Sinha Ashok K, Electro-chemical deposition system.
  21. Dordi, Yezdi; Olgado, Donald J.; Morad, Ratson; Hey, Peter; Denome, Mark; Sugarman, Michael; Lloyd, Mark; Stevens, Joseph; Marohl, Dan; Shin, Ho Seon; Ravinovich, Eugene; Cheung, Robin; Sinha, Ashok , Electro-chemical deposition system.
  22. Shen Ben ; Dordi Yezdi ; Birkmaier George, Electro-chemical deposition system and method.
  23. Landau Uziel, Electro-chemical deposition system and method of electroplating on substrates.
  24. Landau,Uziel, Electro-chemical deposition system and method of electroplating on substrates.
  25. Landau, Uziel; D'Urso, John J., Electrodeposition chemistry for filling apertures with reflective metal.
  26. Landau, Uziel; D'Urso, John J., Electrodeposition chemistry for filling of apertures with reflective metal.
  27. Uziel Landau ; John J. D'Urso, Electrodeposition chemistry for filling of apertures with reflective metal.
  28. Stevens, Joseph J.; Lubomirsky, Dmitry; Pancham, Ian; Olgado, Donald J.; Grunes, Howard E.; Mok, Yeuk-Fai Edwin; Dixit, Girish, Electroless plating system.
  29. Becker David Scott ; Hanestad Ronald J. ; Thomes Gregory P. ; Weygand James F. ; Zimmerman Larry D., Eliminating stiction with the use of cryogenic aerosol.
  30. Dordi, Yezdi N.; Stevens, Joseph J.; Hey, H. Peter W.; Olgado, Donald J. K., Flow diffuser to be used in electro-chemical plating system and method.
  31. Lakshmikanthan Jayant ; Stevens Joe, Inflatable compliant bladder assembly.
  32. Olgado, Donald J. K., Linear motion apparatus and associated method.
  33. Burkhart,Vincent E.; Herchen,Harald; Yahalom,Joseph, Liquid isolation of contact rings.
  34. Chen,B. Michelle; Shin,Ho Seon; Dordi,Yezdi; Morad,Ratson; Cheung,Robin, Method and apparatus for annealing copper films.
  35. Olim, Moshe, Method and apparatus for cleaning disc drive components.
  36. Morad, Ratson; Shin, Ho Seon; Cheung, Robin; Kogan, Igor, Method and apparatus for heating and cooling substrates.
  37. Ritzdorf,Thomas L.; Stevens,E. Henry; Chen,LinLin; Graham,Lyndon W.; Dundas,Curt, Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device.
  38. Hey, Peter; Kwak, Byung-Sung Leo, Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio.
  39. Dordi, Yezdi N.; Stevens, Joseph J.; Sugarman, Michael N., Method and associated apparatus for tilting a substrate upon entry for metal deposition.
  40. Wang, Hougong; Zheng, Bo; Dixit, Girish; Chen, Fusen, Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature.
  41. Ritzdorf,Thomas L.; Stevens,E. Henry; Chen,LinLin; Graham,Lyndon W.; Dundas,Curt, Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device.
  42. Bran, Mario E., Method for megasonic processing of an article.
  43. Zheng, Bo; Bajaj, Rajeev; Wang, Zhonghui Alex, Method for regulating the electrical power applied to a substrate during an immersion process.
  44. Zheng, Bo; Wang, Hougong; Dixit, Girish; Chen, Fusen, Method of application of electrical biasing to enhance metal deposition.
  45. Bran,Mario E., Method of cleaning a side of a thin flat substrate by applying sonic energy to the opposite side of the substrate.
  46. Bran, Mario E., Method of manufacturing integrated circuit devices.
  47. Chen,LinLin; Graham,Lyndon W.; Ritzdorf,Thomas L.; Fulton,Dakin; Batz, Jr.,Robert W., Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density.
  48. Olgado, Donald J.; Tepman, Avi; Franklin, Timothy J., Multiple blade robot adjustment apparatus and associated method.
  49. Smith ; Jr. William Charles (Verbank NY) Lord Donn Allan (Hyde Park NY), Programmable apparatus for cleaning semiconductor elements.
  50. Smith ; Jr. William Charles ; Lord Donn Allan, Programmable method and apparatus for cleaning semiconductor elements.
  51. Smith ; Jr. William Charles ; Lord Donn Allan, Programmable method for cleaning semiconductor elements.
  52. Olgado, Donald J. K., Removable modular cell for electro-chemical plating and method.
  53. Hey, H. Peter W.; Dordi, Yezdi N., Reverse voltage bias for electro-chemical plating system and method.
  54. Hey, H. Peter W.; Sugarman, Michael N.; Denome, Mark, Segmenting of processing system into wet and dry areas.
  55. Aegerter,Brian K.; Dundas,Curt T.; Ritzdorf,Tom L.; Curtis,Gary L.; Jolley,Michael; Peace,Steven L., Selective treatment of microelectric workpiece surfaces.
  56. Reardon,Timothy J.; Meuchel,Craig P.; Oberlitner,Thomas H.; Owczarz,Aleksander; Thompson,Raymon F., Semiconductor processing apparatus.
  57. Reardon,Timothy J.; Oberlitner,Thomas H.; Meuchel,Craig P.; Owczarz,Aleksander; Thompson,Raymon F., Semiconductor processing apparatus.
  58. Kim, Hyun Jong; Kim, Ju Won; Cho, Jung Keun, Spin head and substrate treating method using the same.
  59. Lloyd Mark ; Sinha Ashok K. ; Edelstein Sergio ; Sugarman Michael, Spin-rinse-drying process for electroplated semiconductor wafers.
  60. Chen, Linlin; Graham, Lyndon W.; Ritzdorf, Thomas L.; Fulton, Dakin; Batz, Jr., Robert W., Submicron metallization using electrochemical deposition.
  61. Goodman, Daniel; Keigler, Arthur; Guarnaccia, David G., Substrate holder.
  62. Donald J. K. Olgado ; Jayant Lakshmikanthan, Substrate holder system with substrate extension apparatus and associated method.
  63. Goodman, Daniel; Keigler, Arthur; Fisher, Freeman, Substrate loader and unloader.
  64. Lubomirsky,Dmitry, Substrate support with fluid retention band.
  65. Bran, Mario E., System for megasonic processing of an article.
  66. Olgado, Donald J. K.; Tepman, Avi; Lubomirsky, Dmitry; Webb, Timothy R., System for planarizing metal conductive layers.
  67. Bran,Mario E., Transducer assembly for megasonic processing of an article and apparatus utilizing the same.
  68. Patrin John C. ; Heitzinger John M., Treating substrates by producing and controlling a cryogenic aerosol.
  69. Mok,Yeuk Fai Edwin; Nguyen,Son T., Two position anneal chamber.
  70. Bran, Mario E., Wafer cleaning.
  71. Bran, Mario E., Wafer cleaning.
  72. Hongo, Akihisa; Morisawa, Shinya, Wafer cleaning apparatus.
  73. Hongo,Akihisa; Morisawa,Shinya, Wafer cleaning apparatus.
  74. Bran Mario E., Wafer cleaning method.
  75. Mario E. Bran, Wafer cleaning method.
  76. Bran Mario E., Wafer cleaning system.
  77. Bran Mario E., Wafer cleaning system.
  78. Shinbara Kaoru (Kusatsu JPX), Wafer holding mechanism.
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