초록 ▼

A high wet strength waferboard panel is disclosed made from aspen species of wood flakes or equivalent with average specific gravity less than 0.6 and having wet strength equivalent to plywood. At least a portion of the wood wafers are oriented generally in a lengthwise direction such that the lengt

A high wet strength waferboard panel is disclosed made from aspen species of wood flakes or equivalent with average specific gravity less than 0.6 and having wet strength equivalent to plywood. At least a portion of the wood wafers are oriented generally in a lengthwise direction such that the length to width strength ratio of the panel, measured as modulus of rupture, is in the range of about 1.3:1 to 2:1, the density of the waferboard panel being in the range of about 38 to 45 lb/ft3, the content of adhesive resin in the panel being in the range of about 4% to 10%, the content of wax in the panel being in the range of about 1% to 2½% and the thickness of the panel being in the range of about ⅜to 1½inches. The fully soaked panel having a moisture content of at least about 30% with an MOR lengthwise greater than about 2900 lb/in2 and an MOE lengthwise greater than about 0.9×106 lb/in2.

대표청구항 ▼

A waferboard panel comprising wood wafers having an initial average specific gravity, based on oven dry weight with volume at 12% moisture content, of less than about 0.6, said wood wafers having a length of at least about 1.5 inches and a width in the range of about 0.125 to 1.5 inches, adhesive re

A waferboard panel comprising wood wafers having an initial average specific gravity, based on oven dry weight with volume at 12% moisture content, of less than about 0.6, said wood wafers having a length of at least about 1.5 inches and a width in the range of about 0.125 to 1.5 inches, adhesive resin in the range of about 4% to 10% by weight of the wood wafers, at least a portion of the wood wafers being oriented generally in a lengthwise direction, such that the length to width strength ratio of the waferboard panel, measured as modulus of rupture, is in the range of about 1.3:1 to 2:1, the waferboard panel having a density in the range of about 38 to 45 lb/ft3, the fully soaked waferboard panel having a moisture content of at least about 30%, with an MOR lengthwise greater than about 2900 lb/in2 and an MOE lengthwise greater than about 0.9×106 lb/in2, and the waferboard panel having a weight gain of not more than about 14% after a ten week exterior exposure.