초록 ▼

A thermoelectric device exhibiting both structural integrity and decreased stress across the device notwithstanding the application of thermally cycled temperature differentials thereacross includes, electrically interconnected thermoelectric elements and a rigidly affixed substrate. Thermal stress

A thermoelectric device exhibiting both structural integrity and decreased stress across the device notwithstanding the application of thermally cycled temperature differentials thereacross includes, electrically interconnected thermoelectric elements and a rigidly affixed substrate. Thermal stress is relieved by using flexible conductors to interconnect the thermoelectric elements, and by the use of a flexile joint to attach a second substrate to the remainder of the device. Complete elimination of the second substrate may also be used to eliminate stress. Presence of the rigidly affixed substrate gives the device sufficient structural integrity to enable it to withstand rugged conditions.

대표청구항 ▼

A new and improved thermoelectric device providing both structural integrity and relief of stress across the device, notwithstanding the application of thermally cycled temperature differentials across said device, said device comprising: a. a plurality of thermoelectric elements; b. first and secon

A new and improved thermoelectric device providing both structural integrity and relief of stress across the device, notwithstanding the application of thermally cycled temperature differentials across said device, said device comprising: a. a plurality of thermoelectric elements; b. first and second electrical coupling means on opposite respective sides of said thermoelectric elements for interconnecting said elements electrically in accordance with a predetermined pattern; c. a first rigid substrate afixed to said first coupling means on the side thereof opposite said thermoelectric elements, to provide structural integrity, and; d. flexile stress relieving means associated with said second electrical coupling means, for permitting said elements, said substrate, and said coupling means to expand and contract responsive to thermal cycling of said device.