초록 ▼

Josephson junction integrated circuits of the current injection type and magnetically controlled type utilize a superconductive layer that forms both Josephson junction electrode for the Josephson junction devices on the integrated circuit as well as a ground plane for the integrated circuit. Large

Josephson junction integrated circuits of the current injection type and magnetically controlled type utilize a superconductive layer that forms both Josephson junction electrode for the Josephson junction devices on the integrated circuit as well as a ground plane for the integrated circuit. Large area Josephson junctions are utilized for effecting contact to lower superconductive layers and islands are formed in superconductive layers to provide isolation between the groundplane function and the Josephson junction electrode function as well as to effect crossovers. A superconductor-barrier-superconductor trilayer patterned by local anodization is also utilized with additional layers formed thereover. Methods of manufacturing the embodiments of the invention are disclosed.

대표청구항 ▼

A method of fabricating a superconductive integrated circuit including at least one Josephson tunnel junction, said tunnel junction including first and second tunnel junction electrodes superposed with respect to each other with a Josephson tunneling barrier therebetween for conducting Josephson tun

A method of fabricating a superconductive integrated circuit including at least one Josephson tunnel junction, said tunnel junction including first and second tunnel junction electrodes superposed with respect to each other with a Josephson tunneling barrier therebetween for conducting Josephson tunneling current between said first and second tunnel junction electrodes, said method comprising the steps of forming a ground plane for said integrated circuit and forming said first tunnel junction electrode by depositing a first layer of superconductive material on a substrate, said first layer comprising said ground plane as well as including said first tunnel junction electrode, forming a first layer of insulative material on said first layer of superconductive material, forming at least one opening through said first layer of insulative material, forming said Josephson tunneling barrier within said opening in said layer of insulative material, and depositing a second layer of superconductive material on said layer of insulative material, said second layer including said second tunnel junction electrode.