초록 ▼

A method for forming photovoltaic cell module laminates wherein the cells are sealed in a crosslinked polymer between a solid superstrate and a solid substrate wherein the polymer is formed from ethylene/vinylacetate copolymer having dispersed therein at least one peroxide initiator to crosslink the

A method for forming photovoltaic cell module laminates wherein the cells are sealed in a crosslinked polymer between a solid superstrate and a solid substrate wherein the polymer is formed from ethylene/vinylacetate copolymer having dispersed therein at least one peroxide initiator to crosslink the polymer and at least one organosilane primer to promote bonding of the ethylene/vinylacetate to the superstrate and substrate, the initiator being present in an amount of no more than 1 weight percent based on the total weight of the copolymer and the primer being present in an amount of no more than 0.5 weight percent based on the total weight of the copolymer and subjecting the thus formed laminate to an elevated temperature for a time sufficient to crosslink the copolymer and seal the photovoltaic cells in the crosslinked copolymer while at the same time binding the crosslinked ethylene/vinylacetate copolymer to both the substrate and superstrate.

대표청구항 ▼

In a method for forming a photovoltaic cell module laminate composed of at least one photovoltaic cell circuit sealed in a polymer, a solid superstrate, bonded to said polymer on the upperside of said cell and a solid substrate bonded to said polymer on the bottom side of said cell circuit, the impr

In a method for forming a photovoltaic cell module laminate composed of at least one photovoltaic cell circuit sealed in a polymer, a solid superstrate, bonded to said polymer on the upperside of said cell and a solid substrate bonded to said polymer on the bottom side of said cell circuit, the improvement comprising providing upper and lower layers of uncrosslinked ethylene/vinylacetate copolymer adjacent the top and bottom of said cell circuit, said ethylene/vinylacetate copolymer layers having dispersed therein at least one peroxide initiator to crosslink said ethylene/vinylacetate copolymer and at least one organosilane monomer primer to promote bonding of said ethylene/vinylacetate copolymer to said cell circuit, superstrate and substrate, said initiator being present in an amount of no more than 1 weight percent based on the total weight of said ethylene/vinylacetate copolymer, said primer being present in an amount of no more than 0.5 weight percent based on the total weight of said ethylene/vinylacetate copolymer, and subjecting said laminate to an elevated temperature for a time sufficient to crosslink said ethylene/vinylacetate copolymer and seal said crosslinked ethylene/vinylacetate copolymer layers to one another around said cells thereby completely encapsulating said cells in crosslinked ethylene/vinylacetate copolymer and bonding said crosslinked ethylene/vinylacetate copolymer to said cell circuit, substrate and superstrate without separately coating said cell circuit, substrate and superstrate with primer prior to said crosslinking and bonding step.