초록

A cooling system is described for modules on electronic circuit cards, the system typically containing a multiplicity of cards. Improved cooling is achieved due to improved boundary layer conditions established by counter air flow in opposite directions on opposite sides of the cards.

대표청구항 ▼

A counter flow cooling assembly which cools electronic circuit cards with an air cooling agent, said assembly having enclosed rear, oppositely positioned side, and bottom surfaces and further having unenclosed front and top portions thereof and said assembly comprising; support means including slott

A counter flow cooling assembly which cools electronic circuit cards with an air cooling agent, said assembly having enclosed rear, oppositely positioned side, and bottom surfaces and further having unenclosed front and top portions thereof and said assembly comprising; support means including slotted receptacles on the rear inside surface of said assembly supporting an array of said circuit cards in spaced apart relationship from side to side within said assembly, each of said circuit cards having an area substantially congruent with the area of either of said side surfaces of said assembly and each circuit card in one dimension from rear to front of said assembly having substantially the same dimension as the rear to front dimension of a said side surface but each circuit card in a transverse direction from top to bottom within said assembly having a substantially shorter dimension than the top to bottom dimension of said side surfaces thereby establishing a common air flow area between the lowermost edges of said circuit cards and the bottom surface of said assembly; a first set of air flow baffles positioned on the front edges of selected alternate pairs of said circuit cards to block and prevent passage of air between said selected alternate pairs of said circuit cards, said first set of air flow baffles further also defining entry passageways for passage of air between alternate pairs of circuit cards not blocked by said first set of air flow baffles; a second set of air flow baffles abutting the top edges of said circuit cards to block and prevent passage of air between the top edges of the same selected alternate pairs of circuit cards having front entry passageways therebetween established by the first set of air flow baffles, said second set of air flow baffles further defining a set of exit passageways for passage of air between alternate circuit cards not blocked by said second set of air flow baffles; a plenum mounted at the lowermost ends of said first set of air flow baffles to further define an air flow entry area for said assembly; exhaust fan means directing air through said assembly including passage through said entry passageways at the front edges of said circuit cards, through said common air flow area, and through said exit passageways to establish flow of air through said systems substantially in a downward direction past even numbered alternate pairs of said circuit cards as air passes from said entry area to said common air flow area at the bottom of said circuit cards the air in going downwardly acquiring heat from the circuit cards and creating a thermal boundary layer relative to said circuit cards which starts from the top and which thickens downwardly, with the thicker boundary layer having a higher external thermal resistance, and to further establish flow of air substantially in an upward direction past odd numbered alternate pairs of said circuit cards as air passes from said common air flow area through said exit passageways, the now heated air in going upwardly acquiring additional heat from the circuit cards and creating a thermal boundary layer relative to said circuit cards that starts from the bottom of the cards and thickens upwardly, the thicker boundary layer having a higher external thermal resistance, thereby cooling said circuit cards more effectively due to counter flow passage of air on both sides of each circuit card which establishes uniform thermal resistance characteristics and enhanced boundary layer conditions all over said circuit cards.