초록 ▼

For achieving optimum application of bonding agent to particulate material, in particular chips, without elaborate plant and machinery, it is proposed to carry out the application of bonding agent using a pneumatic conveyor device for material which is in any case present, by arranging at least one

For achieving optimum application of bonding agent to particulate material, in particular chips, without elaborate plant and machinery, it is proposed to carry out the application of bonding agent using a pneumatic conveyor device for material which is in any case present, by arranging at least one spray nozzle for bonding agent in at least one section of the pipes of the material transport device and spraying the particles which are transported in the form of a film, using this spray nozzle for bonding agent.

대표청구항 ▼

In a process for bonding particulate material by the spraying of bonding agent onto the material which material is in the form of a film of particles, the improvement wherein (i) said particulate material is fed into a pneumatic material transport device at a first location, (ii) said film of partic

In a process for bonding particulate material by the spraying of bonding agent onto the material which material is in the form of a film of particles, the improvement wherein (i) said particulate material is fed into a pneumatic material transport device at a first location, (ii) said film of particles is uniformly diverted by at least one air conducting installation located within said pneumatic material transport device downstream of said first location, and (iii) bonding agent is sprayed onto said material within said pneumatic material transport device downstream of said air conducting installation, whereby said bonding agent is dispersed in air before it comes into contact with said material.