초록 ▼

Various embodiments of a casing adapted to receive an electronic device and in particular power discrete devices are disclosed. The casings include metal or metal alloy base components with the electronic device adhered to its surface. A metal or metal alloy leadframe is bonded to and electrically i

Various embodiments of a casing adapted to receive an electronic device and in particular power discrete devices are disclosed. The casings include metal or metal alloy base components with the electronic device adhered to its surface. A metal or metal alloy leadframe is bonded to and electrically insulated from the base component. The electronic device is connected to the leadframe. A metal or metal alloy cover is bonded to the leadframe to seal the electronic device within the casing. Each of the modifications includes a technique for effectively removing the heat generated by the electronic device from the casing.

대표청구항 ▼

A casing adapted to receive an electronic device, comprising: a first high thermal conductivity metal or metal alloy substrate having a first surface, a first metal or metal alloy cladding having a first thin refractory oxide layer on at least a first surface thereof, said first surface of said subs

A casing adapted to receive an electronic device, comprising: a first high thermal conductivity metal or metal alloy substrate having a first surface, a first metal or metal alloy cladding having a first thin refractory oxide layer on at least a first surface thereof, said first surface of said substrate being bonded to a second surface of said first metal or metal alloy cladding, said first surface of said substrate adapted to have said electronic device adhered thereto to enhance the transfer of heat generated by said device to the outside of said casing; a metal or metal alloy leadframe having a second thin refractory oxide layer thereon, said leadframe being bonded to said first refractory oxide layer and insulated from said first metal or metal alloy cladding by said first and second refractory oxide layers, said leadframe further being adapted for electrical connection to the electronic device; a metal or metal alloy cover having a third thin refractory oxide layer on at least a portion of one surface thereof, said third oxide layer being bonded to said second refractory oxide layer whereby said electronic device is sealed between said substrate and said cover.