초록 ▼

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg1 and that of Tg2 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg1 and Tg2, has excellent dimensional stability, heat resistance and through-hole reliability.

대표청구항 ▼

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been prepared

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating reinforcing substrates with a polyimide resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg1) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg2) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg1 and Tg2. A prepreg resin sheet prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg2) of the resin after cured, said Tg2 being 170°C. or higher, and wherein the resin composition comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: [Figure] (1) wherein R is a divalent organic group having at least one carbon-carbon double bond; and R1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H2N－R2－NH2 (2) wherein R2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: [Figure] (3) wherein R3, R4 and R5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R3, R4 and R5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.